Patents by Inventor Akitoshi SAKAUE

Akitoshi SAKAUE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240272754
    Abstract: In printed wiring that is formed, on a surface of a base member. by a film of cured electrically conductive ink and that includes: a wavy line; a first wiring element located at one side of both sides sandwiching the wavy line in a width direction; and a second wiring element located at the other side of the both sides and adjacently to the wavy line; a surplus wavy line is provided which is another wavy line, which extends along the wavy line adjacently to the wavy line between the wavy line and the first wiring element, and which is connected to the wavy line to have the same potential.
    Type: Application
    Filed: April 24, 2024
    Publication date: August 15, 2024
    Applicant: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventor: Akitoshi SAKAUE
  • Patent number: 12052831
    Abstract: A wiring board includes a conductor pattern formed on a board, and an insulating film that covers at least part of the conductor pattern. A first insulating film is provided in a first region on the board, the first region covering at least part of the conductor pattern and having a first border segment. A second insulating film is provided in a second region on the board, the second region covering at least part of the first region and having a second border segment. The second border segment is located outside the first region, and the shortest distance from any point belonging to the second border segment to the first border segment is not more than 400 ?m.
    Type: Grant
    Filed: April 28, 2023
    Date of Patent: July 30, 2024
    Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventor: Akitoshi Sakaue
  • Patent number: 12014012
    Abstract: In printed wiring that is formed, on a surface of a base member, by a film of cured electrically conductive ink and that includes: a wavy line; a first wiring element located at one side of both sides sandwiching the wavy line in a width direction; and a second wiring element located at the other side of the both sides and adjacently to the wavy line; a surplus wavy line is provided which is another wavy line, which extends along the wavy line adjacently to the wavy line between the wavy line and the first wiring element, and which is connected to the wavy line to have the same potential.
    Type: Grant
    Filed: July 8, 2021
    Date of Patent: June 18, 2024
    Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventor: Akitoshi Sakaue
  • Publication number: 20240184409
    Abstract: In printed wiring that is formed on a surface of a base member by a film of cured electrically conductive ink and that includes: a wavy line; a first wiring element located at one side of both sides sandwiching the wavy line in a width direction; and a second wiring element located at the other side of the both sides and adjacently to the wavy line; a surplus wavy line is provided which is another wavy line, which extends along the wavy line adjacently to the wavy line between the wavy line and the first wiring element, and which is connected to the wavy line to have the same potential.
    Type: Application
    Filed: February 12, 2024
    Publication date: June 6, 2024
    Applicant: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventor: Akitoshi SAKAUE
  • Publication number: 20230302782
    Abstract: In a gravure plate for wiring printing on which a recessed portion defining a wiring pattern is formed on a plate surface, a projecting portion for reducing a volume of the recessed portion is formed on a bottom surface of the recessed portion. A contour of the projecting portion in cross section parallel to the plate surface has a semicircular arc shape, which protrudes toward one side in one direction that is parallel to the plate surface, on the one side. The recessed portion has a side wall that is composed of a plane orthogonal to the plate surface and faces the projecting portion at a distance of 15 ?m or less without coming into contact with the projecting portion. The contour of the projecting portion has a semicircular arc shape, which protrudes toward the side wall, also on a side closer to the side wall.
    Type: Application
    Filed: March 14, 2023
    Publication date: September 28, 2023
    Applicant: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventor: Akitoshi SAKAUE
  • Patent number: 11751340
    Abstract: A wiring board includes a conductor pattern formed on a board, and an insulating film that covers at least part of the conductor pattern. A first insulating film is provided in a first region on the board, the first region covering at least part of the conductor pattern and having a first border segment. A second insulating film is provided in a second region on the board, the second region covering at least part of the first region and having a second border segment. The second border segment is located outside the first region, and the shortest distance from any point belonging to the second border segment to the first border segment is not more than 400 ?m.
    Type: Grant
    Filed: December 10, 2021
    Date of Patent: September 5, 2023
    Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventor: Akitoshi Sakaue
  • Publication number: 20230269885
    Abstract: A wiring board includes a conductor pattern formed on a board, and an insulating film that covers at least part of the conductor pattern. A first insulating film is provided in a first region on the board, the first region covering at least part of the conductor pattern and having a first border segment. A second insulating film is provided in a second region on the board, the second region covering at least part of the first region and having a second border segment. The second border segment is located outside the first region, and the shortest distance from any point belonging to the second border segment to the first border segment is not more than 400 ?m.
    Type: Application
    Filed: April 28, 2023
    Publication date: August 24, 2023
    Applicant: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventor: Akitoshi SAKAUE
  • Patent number: 11711895
    Abstract: Provided is a wiring board including a fine-wire pattern made of cured conductive ink formed on a board surface, wherein assuming that two orthogonal directions on the board surface are directions X and Y, a line width of another fine wire that is included in the fine-wire pattern, passes through another point on the board surface not aligned in the direction X but aligned in the direction Y with one intersection where three or more fine wires included in the fine-wire pattern are centered at one spot, and does not form another intersection where three or more fine wires are centered at one spot at said another point is 1.5 times or more a minimum line width of the fine wires included in the fine-wire pattern.
    Type: Grant
    Filed: November 30, 2021
    Date of Patent: July 25, 2023
    Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventors: Akitoshi Sakaue, Kenji Matsumoto
  • Patent number: 11582868
    Abstract: A printed wiring line formed on a substrate connects two different points on the substrate which are connectable by another printed wiring line with a shape of a straight-line segment and has a shape corresponding to at least one of: 1) a shape with no linear part parallel to the straight-line segment; 2) a shape with line segments connected in series, each line segment having a shape with no linear part parallel to the straight-line segment; 3) a shape having a part parallel to the straight-line segment and a part not parallel to the straight-line segment, length of the part parallel to the straight-line segment being not more than length of the straight-line segment; and 4) a shape in which line segments are connected in series, each line segment having a shape having a part parallel to the straight-line segment and a part not parallel to the straight-line segment.
    Type: Grant
    Filed: October 2, 2020
    Date of Patent: February 14, 2023
    Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventors: Yutaro Kogawa, Mitsunori Sato, Yutaka Takezawa, Akitoshi Sakaue, Mitsutoshi Naito
  • Publication number: 20220217850
    Abstract: A wiring board includes a conductor pattern formed on a board, and an insulating film that covers at least part of the conductor pattern. A first insulating film is provided in a first region on the board, the first region covering at least part of the conductor pattern and having a first border segment. A second insulating film is provided in a second region on the board, the second region covering at least part of the first region and having a second border segment. The second border segment is located outside the first region, and the shortest distance from any point belonging to the second border segment to the first border segment is not more than 400 ?m.
    Type: Application
    Filed: December 10, 2021
    Publication date: July 7, 2022
    Applicant: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventor: Akitoshi SAKAUE
  • Publication number: 20220183159
    Abstract: Provided is a wiring board including a fine-wire pattern made of cured conductive ink formed on a board surface, wherein assuming that two orthogonal directions on the board surface are directions X and Y, a line width of another fine wire that is included in the fine-wire pattern, passes through another point on the board surface not aligned in the direction X but aligned in the direction Y with one intersection where three or more fine wires included in the fine-wire pattern are centered at one spot, and does not form another intersection where three or more fine wires are centered at one spot at said another point is 1.5 times or more a minimum line width of the fine wires included in the fine-wire pattern.
    Type: Application
    Filed: November 30, 2021
    Publication date: June 9, 2022
    Applicant: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventors: Akitoshi SAKAUE, Kenji MATSUMOTO
  • Patent number: 11310909
    Abstract: A printed wiring line formed on a substrate connects two different points on the substrate which are connectable by another printed wiring line with a shape of a straight-line segment and has a shape corresponding to at least one of: 1) a shape with no linear part parallel to the straight-line segment; 2) a shape with line segments connected in series, each line segment having a shape with no linear part parallel to the straight-line segment; 3) a shape having a part parallel to the straight-line segment and a part not parallel to the straight-line segment, length of the part parallel to the straight-line segment being not more than length of the straight-line segment; and 4) a shape in which line segments are connected in series, each line segment having a shape having a part parallel to the straight-line segment and a part not parallel to the straight-line segment.
    Type: Grant
    Filed: July 17, 2020
    Date of Patent: April 19, 2022
    Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventors: Yutaro Kogawa, Mitsunori Sato, Yutaka Takezawa, Akitoshi Sakaue, Mitsutoshi Naito
  • Patent number: 11301104
    Abstract: A wiring structure that includes first wiring parts which are formed of conductive wires and second wiring parts which are formed of thicker conductive wires than the conductive wires of the first wiring parts and are connected to the first wiring parts is formed by offset printing which includes the following processes. First printing process: First conductive ink for forming the first wiring parts is transferred from a first blanket to a base. Second printing process: Second conductive ink for forming the second wiring parts is transferred from a second blanket, which is different from the first blanket, to the base.
    Type: Grant
    Filed: April 26, 2021
    Date of Patent: April 12, 2022
    Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventors: Akitoshi Sakaue, Yutaka Takezawa
  • Patent number: 11209945
    Abstract: In printed wiring that is formed, on a surface of a base member. by a film of cured electrically conductive ink and that includes: a wavy line; a first wiring element located at one side of both sides sandwiching the wavy line in a width direction; and a second wiring element located at the other side of the both sides and adjacently to the wavy line; a surplus wavy line is provided which is another wavy line, which extends along the wavy line adjacently to the wavy line between the wavy line and the first wiring element, and which is connected to the wavy line to have the same potential.
    Type: Grant
    Filed: July 6, 2020
    Date of Patent: December 28, 2021
    Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventor: Akitoshi Sakaue
  • Publication number: 20210333939
    Abstract: In printed wiring that is formed, on a surface of a base member, by a film of cured electrically conductive ink and that includes: a wavy line; a first wiring element located at one side of both sides sandwiching the wavy line in a width direction; and a second wiring element located at the other side of the both sides and adjacently to the wavy line; a surplus wavy line is provided which is another wavy line, which extends along the wavy line adjacently to the wavy line between the wavy line and the first wiring element, and which is connected to the wavy line to have the same potential.
    Type: Application
    Filed: July 8, 2021
    Publication date: October 28, 2021
    Applicant: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventor: Akitoshi SAKAUE
  • Patent number: 11093095
    Abstract: A wiring structure that includes first wiring parts which are formed of conductive wires and second wiring parts which are formed of thicker conductive wires than the conductive wires of the first wiring parts and are connected to the first wiring parts is formed by offset printing which includes the following processes. First printing process: First conductive ink for forming the first wiring parts is transferred from a first blanket to a base. Second printing process: Second conductive ink for forming the second wiring parts is transferred from a second blanket, which is different from the first blanket, to the base.
    Type: Grant
    Filed: November 20, 2019
    Date of Patent: August 17, 2021
    Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventors: Akitoshi Sakaue, Yutaka Takezawa
  • Publication number: 20210240306
    Abstract: A wiring structure that includes first wiring parts which are formed of conductive wires and second wiring parts which are formed of thicker conductive wires than the conductive wires of the first wiring parts and are connected to the first wiring parts is formed by offset printing which includes the following processes. First printing process: First conductive ink for forming the first wiring parts is transferred from a first blanket to a base. Second printing process: Second conductive ink for forming the second wiring parts is transferred from a second blanket, which is different from the first blanket, to the base.
    Type: Application
    Filed: April 26, 2021
    Publication date: August 5, 2021
    Applicant: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventors: Akitoshi SAKAUE, Yutaka TAKEZAWA
  • Patent number: 11029791
    Abstract: A touch panel comprises, a substrate, a layered structure formed in a sensing region defined on one side of the substrate, the layered structure including at least a first conductor layer made of a first hardened conductive ink, a second conductor layer made of a second hardened conductive ink and an insulating layer disposed therebetween, and an external connection terminal formed outside the sensing region on the one side of the substrate, wherein the external connection terminal comprises a first terminal layer made of the first hardened conductive ink and a second terminal layer made of the second hardened conductive ink, such that the first terminal layer and the second terminal layer are directly overlaid on each other.
    Type: Grant
    Filed: October 25, 2018
    Date of Patent: June 8, 2021
    Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventor: Akitoshi Sakaue
  • Patent number: 10928951
    Abstract: A touch panel includes two ground wires. One end portion (an end portion X1) of one of the two ground wires and one end portion (an end portion Y1) of the other of the two ground wires form a gap. When the touch panel is viewed from front, the following condition as an example is satisfied: a line segment Z1 intersects at least one of the two ground wires. The line segment Z1 is a line segment which connects any one point P1 on a first line segment and any one point Q1 on a second line segment, the first line segment connecting a site of the end portion X1 and a site of the end portion Y1 which are located on two sides of an outer gate of the gap, the second line segment connecting a site of the end portion X1 and a site of the end portion Y1.
    Type: Grant
    Filed: May 15, 2019
    Date of Patent: February 23, 2021
    Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventors: Akitoshi Sakaue, Hiroshi Okumura
  • Publication number: 20210022242
    Abstract: A printed wiring line formed on a substrate connects two different points on the substrate which are connectable by another printed wiring line with a shape of a straight-line segment and has a shape corresponding to at least one of: 1) a shape with no linear part parallel to the straight-line segment; 2) a shape with line segments connected in series, each line segment having a shape with no linear part parallel to the straight-line segment; 3) a shape having a part parallel to the straight-line segment and a part not parallel to the straight-line segment, length of the part parallel to the straight-line segment being not more than length of the straight-line segment; and 4) a shape in which line segments are connected in series, each line segment having a shape having a part parallel to the straight-line segment and a part not parallel to the straight-line segment.
    Type: Application
    Filed: October 2, 2020
    Publication date: January 21, 2021
    Applicant: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventors: Yutaro KOGAWA, Mitsunori SATO, Yutaka TAKEZAWA, Akitoshi SAKAUE, Mitsutoshi NAITO