Abstract: A polarizing film comprising a polyvinyl alcohol-type film and a dichroic dye, a metallic ion and boric acid incorporated therein, and a process for producing the same, which comprises adsorbing a dichroic dye on a polyvinyl alcohol-type film, stretching the film substantially in one direction, immersing the stretched film in an aqueous solution containing a metallic ion and boric acid.

Abstract: A photosensitive polyimide precursor composed of the structural units (A) represented by the following general formula (I) and the structural units (B) represented by the following general formula (II), in which the ratio of the molar quantity of the structural units (A) to the sum of the molar quantity of the structural units (A) and that of the structural units (B) is 0.01 or greater, and having a viscosity of 100 cP or above as measured at 25.degree. C. in the state of a 10% by weight solution in N-methylpyrrolidone: ##STR1## wherein R.sub.1 represents a tetravalent aromatic hydrocarbon residue; R.sub.2 represents a divalent aromatic hydrocarbon residue; X, identical or different represents a halogen or an alkyl group; and m represents 0 or an integer from 1 to 4. The photosensitivity of the present photosensitive polyimide precursor is about 20 to 100 times that of conventional products. After heat dehydration cyclization, it shows a heat resistance of 400.degree. C. or above.

Abstract: A humidity-sensing component composition includes a metallic oxide and a chalcogen oxyacid salt represented by a general formula A.sub.x B.sub.y O.sub.z where A is one of an alkali metal and an alkaline earth metal, B is one of sulphur, selenium, and tellurium, O is oxygen, x is 1 to 2, y 1 to 5, and z 2 to 7. The chalcogen oxyacid salt is blended by an amount of 0.01 to 99.99 mol % in the metallic oxide with the sum of the metallic oxide and the chalcogen oxyacid salt as a reference. The metallic oxide and the chalcogen oxyacid salt are sintered under an atmosphere of molecular oxygen.

Abstract: A membrane for gas separation which comprises a silylated polyphenylene ether is disclosed. Said silylated polyphenylene ether contains a constituting unit containing an organosilane or siloxane group represented by the following formula in at least a part of the repeating unit thereof: ##STR1## wherein R.sub.1, R.sub.2, R.sub.3 and R.sub.4 each represents a hydrogen atom or a group of the formula --Si(R.sub.5)(R.sub.6)(R.sub.7), wherein R.sub.5, R.sub.6 and R.sub.7 each represents an alkyl group; l and n each represents 0 or an integer from 1 to 3; and m represent an integer of from 1 to 3; with the proviso that R.sub.1, R.sub.2, R.sub.3 and R.sub.4 do not simultaneously represent hydrogen atoms.

Abstract: A polyphenylene ether resin composition having excellent fire retardancy comprising(A) a polyphenylene ether resin, and(B) at least one phosphate compound selected from the group consisting of biphenyl phosphate compounds and naphthyl phosphate compounds.

Abstract: The photosensitive polyimide precursor of the invention has a recurring unit represented by the following general formula [I]: ##STR1## (R.sub.1 represents a tetravalent aromatic hydrocarbon residue; R.sub.2 and R.sub.3 each represent a divalent aromatic or aliphatic hydrocarbon residue; and R.sub.4 represents a divalent aromatic hydrocarbon residue represented by ##STR2## wherein R.sub.5, R.sub.6, R.sub.7, R.sub.8, R.sub.9, R.sub.10, R.sub.11 and R.sub.12, identical or different, each represent hydrogen atom, a halogen group or an alkyl group). The photosensitive polyimide precursor of the invention has a viscosity of 50 centipoises or above as measured at 23.degree. C. in the state of a 10% (by weight) solution in N,N-dimethylacetamide. Its photosensitivity is as high as about 20-100 times that of prior products. After heat cyclization, it exhibits a heat resistance of 400.degree. C. or above.

Abstract: A polyphenylene ether resin composition comprising(A) a polyphenylene ether resin,(B) a vinyl aromatic resin, and(C) a phenylformamidine derivative in a heat stabilizing amount.

Abstract: A polyphenylene ether resin composition containing (A) a polyphenylene ether resin, (B) an aromatic polyester resin, and (C) a phenoxy resin. The resin composition may further contain (D) an unsaturated carboxylic acid or (E) a vinyl copolymer derived from a styrene compound and an alpha,beta-unsaturated dicarboxylic acid anhydride as comonomer components. The resin composition has excellent mechanical strength, solvent resistance, oil resistance and moldability.

Abstract: A polyphenylene ether resin composition comprising:(a) a polyphenylene ether resin,(b) a polystyrene-type resin,(c) an A-B-A' type elastomeric block copolymer, wherein A and A' represent blocks resulting from polymerization of an aromatic vinyl compound, and B represents a block resulting from polymerization of a conjugated diene compound, and(d) an elastomeric stryene/butadiene random copolymer,which is suitable electroless plating. Molded articles formed by using the resin composition of this invention can be plated using conventional electroless plating processes for ABS resins.

Abstract: A polyphenylene ether resin composition comprising(A) a polyphenylene ether resin,(B) a polystyrene resin,(C) an acrylonitrile/conjugated diene elastomeric copolymer,(D) a graft copolymer obtained by reacting butyl rubber and an unsaturated polyolefin in a bifunctional phenol as a reaction medium, and(E) an aromatic phosphate.

Abstract: A polyphenylene ether resin composition comprising(A) a polyphenylene ether resin and(B) poly(epsilon-caprolactone).

Abstract: A curable resin composition comprising (a) a polyphenylene resin, (b) a maleimide compound and/or a cyanate ester compound and (c) at least one compound selected from the group consisting of compounds having one or more acryloyl, methacryloyl, acryloxy or methacryloxy groups is disclosed. The curable resin composition can give a cured resin having resistance to heat, solvent and moisture and adhering property.

Abstract: A curable resin composition comprising:(a) a polyphenylene ether resin,(b) a maleimide component and/or a cyanate ester component, and(c) an epoxy compoundis disclosed. The cured resin composition can give a cured resin having resistance to heat, solvent and moisture, adhering property and electrical properties.

Abstract: A polyphenylene ether resin composition comprising(1) a polyphenylene ether resin,(2) an oxanilide represented by the following formula ##STR1## wherein R.sup.1 and R.sup.6 are identical or different and each represents a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, or an alkoxy group having 1 to 15 carbon atoms, R.sup.2 and R.sup.7 are identical or different and each represents a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, or an alkoxy group having 1 to 10 carbon atoms, R.sup.3 and R.sup.8 are identical or different and each represents a hydrogen atom or an alkyl group having 1 to 8 carbon atoms, and R.sup.4 and R.sup.5 are identical or different and each represents a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, or a dialkylaminoalkyl group with the alkyl moiety having 1 to 6 carbon atoms,(3) an organic phosphite, and(4) a hindered phenolic antioxidant.

Abstract: A polyphenylene ether resin composition comprising(A) a polyphenylene ether resin,(B) at least one compound selected from the group consisting of 2-(o-hydroxyphenyl)benzotriazoles represented by the following formula (I) ##STR1## wherein R.sup.1, R.sup.2, R.sup.3 and R.sup.4 are identical or different and each represents a hydrogen atom, a halogen atom, a hydroxyl group, an alkyl group, an alkoxy group, an alkoxycarbonylalkyl group, an aryl group or an aralkyl group, and X represents a halogen atom,and 2-hydroxybenzophenones represented by the following formula (II) ##STR2## wherein R.sup.5 represents a hydrogen atom, a hydroxyl group or an alkoxy group, R.sup.6 represents a hydrogen atom or a hydroxyl group, R.sup.7 represents a hydrogen atom or a sulfonic acid group, and R.sup.8 represents a hydrogen atom, an alkyl group or an aromatic acyl group,(C) an organic phosphite, and(D) a sterically hindered phenol.

Abstract: An improved method for the production of polyphenylene ethers is disclosed. The method comprises oxidatively coupling monohydric phenols in the presence of a complex catalyst and in a liquid medium which is a solvent for the monomer and catalyst and a non-solvent for the polyphenylene ether. The polyphenylene ether precipitates to form a slurry of particulate solids which is then washed with an aqueous solution of a chelating agent to remove catalyst residue.

Abstract: A resin composition comprising a polyphenylene ether resin and a rubber-modified polystyrene resin, wherein at least 80% of the rubber particles based on the total number of rubber particles in the elastomeric phase of the rubber-modified polystyrene resin have a particle diameter in the range of 0.5 to 4 microns, and the elastomeric phase has a particle size distribution index, SDI, defined by the equation ##EQU1## wherein x is the diameter in microns of the particles, and n is the number of particles having a particle diameter of x microns, of not more than 1.9.

Abstract: A polyphenylene ether resin composition having improved heat stability and good color, said composition comprising a polyphenylene ether resin matrix, and dispersed therein, a diphosphonite of the formula ##STR1## wherein R.sub.1 groups are identical or different and each represents a linear or branched alkyl group having 1 to 10 carbon atoms.

Abstract: A curable polyphenylene ether resin composition comprising(a) a polyphenylene ether resin, and(b) at least one polyfunctional compound selected from the group consisting of polyfunctional maleimides having at least two maleimide groups or the prepolymer thereof, polyfunctional cyanate esters having at least two cyanate ester groups or the prepolymer thereof, and pre-copolymers of the polyfunctional maleimides and the polyfunctional cyanate esters.The cured resin composition has utility in rustproofing paints, electrical insulating varnishes, adhesives and molding material.

Abstract: A polyphenylene ether resin composition having improved heat stability, said composition comprising a polyphenylene ether resin matrix, and dispersed therein, a phosphonic acid or its derivative of the formula ##STR1## wherein R.sub.1 represents an unsubstituted or substituted phenyl or naphthyl group, or a linear or branched alkyl group with 1 to 18 carbon atoms, or a group of the following formula (a) ##STR2## R.sub.2 and R.sub.3 are identical or different and each represents hydrogen atom, a metal, an unsubstituted or substituted phenyl group, or an alkyl group with 1 to 10 carbon atoms; and R.sub.4 is a divalent hydrocarbon group with 2 to 10 carbon atoms.