Abstract: The multilayer wiring board is provided with a lower layer wiring (8), and an upper layer wiring (10) formed on the lower layer wiring (8) through an interlayer insulating layer (9). On the interlayer insulating layer (9), a contact hole (11) is provided for interconnecting the upper layer wiring (8) with the lower layer wiring (10). A region surrounded by an inner wall (13) which forms the contact hole (11) is permitted to have a linewidth region wherein a wide line region (13A) and protruding regions (13B, 13C) as regions having different linewidths are connected. Thus, film thickness distribution of an ink baked product (12) formed at the contact hole (11) rises at the protruding regions (13B, 13C), and highly reliable multilayer interconnection can be performed between the lower layer wiring (8) and the upper layer wiring (10).

Abstract: A mold of the present invention includes: a flexible polymer film; a curable resin layer provided on a surface of the polymer film; and a porous alumina layer provided on the curable resin layer, the porous alumina layer having an inverted moth-eye structure in its surface, the inverted moth-eye structure having a plurality of recessed portions whose two-dimensional size viewed in a direction normal to the surface is not less than 10 nm and less than 500 nm. According to the present invention, a method for easily forming a flexible moth-eye mold which can be deformed into the form of a roll is provided.

Abstract: The present invention provides a wiring material for forming wiring on a substrate by causing coalescence of conductive particles through heating, and including a binder layer and a wiring layer. The binder layer contains metal particles and having a binder function to be adhered to the substrate; and the wiring layer contains metal particles and laminated on the binder layer. The metal particles of the binder layer and the metal particles of the wiring layer are in contact with each other. With this arrangement, it is possible to provide a wiring material allowing use of a larger variety of materials, while also ensuring low resistance of wiring and improvement of adhesion between the wiring and the substrate.

Abstract: At least one embodiment of the present invention provides a roller imprinter that allows easy replacement of a transfer roller, and a method of producing an imprinted sheet. In at least one embodiment, a roller imprinter is disclosed for transferring a pattern on a surface of a transfer roller to a surface of a workpiece sheet through rotation of the transfer roller, the roller imprinter including an axis shaft or rotation for the transfer roller, and the axis of the shaft being non-coincident with the rotation axis of the transfer roller.

Abstract: The present invention provides an anti-reflective film that prevents wavelength dispersion from being applied to light transmitted through an anti-reflective film. The present invention is an anti-reflective film, which reduces reflection of visible light on a surface of a substrate by being mounted on the substrate, has a wavelength dispersion structure for applying first wavelength dispersion to visible light transmitting through the anti-reflective film, and contains a wavelength dispersion material for applying second wavelength dispersion to the visible light transmitting through the anti-reflective film, wherein visible light transmitted through the anti-reflective film has flat transmission wavelength dispersion in a visible light region.

Abstract: The present invention provides a roller nanoimprint apparatus capable of preventing a workpiece film with nanostructures having been transferred from the mold roller from being uneven in thickness and allowing easy replacement of the mold roller. The present invention is a roller nanoimprint apparatus including a mold roller and continuously transferring nanosized protrusions to a surface of a workpiece film by rotating the mold roller, wherein the mold roller is a cylindrical body, having an outer circumference surface with nanosized recesses formed thereon, the roller nanoimprint apparatus further includes a fluid container having an elastic film inflatable by injecting fluid into the container, the fluid container being arranged in a region defined by an inner circumference surface of the mold roller, the mold roller is mounted or demounted when the elastic film is shrunken, and the mold roller is supported from the inside when the elastic film is inflated.

Abstract: An antireflection film of the present invention includes a plurality of first raised portions, each of which has a two-dimensional size of not less than 1 ?m and less than 100 ?m when seen in a direction normal to the film, and a plurality of second raised portions, each of which has a two-dimensional size of not less than 10 nm and less than 500 nm when seen in a direction normal to the film. In at least one embodiment, the antireflection film has a first surface shape or a second surface shape that is inverse to the first surface shape relative to a film surface. In the first surface shape, the second raised portions are provided on the first raised portions and between the plurality of first raised portions, and the elevation angle ? of a surface of the first raised portions relative to the film surface is about 90° or more. The antireflection film of the present invention has a more excellent antiglare function than conventional ones.

Abstract: At least one embodiment of the present invention provides a roller imprinter that allows easy replacement of a transfer roller, and a method of producing an imprinted sheet. IN at least one embodiment, a roller imprinter is disclosed for transferring a pattern on a surface of a transfer roller to a surface of a workpiece sheet through rotation of the transfer roller, the roller imprinter including an axis shaft of rotation for the transfer roller, and the axis of the shaft being non-coincident with the rotation axis of the transfer roller.

Abstract: An illuminator according to the present invention includes a backlight (110) for emitting light containing first and second polarization components having polarization directions which are orthogonal to each other; and a selective reflection polarizer (120) having a reflectance for the first polarization component which is higher than a transmittance for the first polarization component, and having a transmittance for the second polarization component which is higher than a reflectance for the second polarization component. The selective reflection polarizer (120) includes a transparent substrate (122) and a plurality of metal wires (124) arrayed on the transparent substrate (122). The ratio of a width of the metal wires (124) to a pitch of the metal wires (124) is greater than 30% and equal to or less than 42%, and the backlight (110) has a reflectance of 0.6 or more.

Abstract: To provide an optical element having excellent adhesion to a lamination film, a roller nanoimprint apparatus, and a production method of a mold roller are disclosed. In at least one embodiment of the present invention, an optical element includes a nanostructure film including recesses and protrusions in nanometer size formed continuously on a surface of the nanostructure film and a lamination film laminated on the nanostructure film. The nanostructure film includes a nanostructure-free region free from the recesses and protrusions in nanometer size in both ends along a longitudinal direction of the nanostructure film.

Abstract: The present invention provides a roller nanoimprint apparatus capable of preventing a workpiece film with nanostructures having been transferred from the mold roller from being uneven in thickness and allowing easy replacement of the mold roller. The present invention is a roller nanoimprint apparatus including a mold roller and continuously transferring nanosized protrusions to a surface of a workpiece filmby rotating the mold roller, wherein the mold roller is a cylindrical body, having an outer circumference surface with nanosized recesses formed thereon, the roller nanoimprint apparatus further includes a fluid container having an elastic film inflatable by injecting fluid into the container, the fluid container being arranged in a region defined by an inner circumference surface of the mold roller, the mold roller is mounted or demounted when the elastic film is shrunken, and the mold roller is supported from the inside when the elastic film is inflated.

Abstract: A roller nanoimprint apparatus is disclosed which is capable of preventing a workpiece film with nanostructures having been transferred from the mold roller from being uneven in thickness and allowing easy replacement of the mold roller. At least one embodiment of the present invention is directed to a roller nanoimprint apparatus including a mold roller and continuously transferring nanosized protrusions to a surface of a workpiece film by rotating the mold roller, wherein the mold roller is a cylindrical body having an outer circumference surface with nanosized recesses formed thereon, the roller nanoimprint apparatus further includes a fluid container having an elastic film inflatable by injecting fluid into the container, the fluid container being arranged in a region defined by an inner circumference surface of the mold roller, the mold roller is mounted or demounted when the elastic film is shrunken, and the mold roller is supported from the inside when the elastic film is inflated.

Abstract: The component placement substrate of the present invention can be produced easily with suppressed cracks in a thin film formed on a pattern film of the substrate. The present invention provides a component placement substrate provided with one or more pattern films on a substrate, wherein at least one of the pattern film(s) has a cross-sectional shape composed of a semi-elliptical circular upper part, and one of a forward taper shaped lower part and a approximately vertical taper shaped lower part and the average thickness of the lower part is 50 ? or larger and 3,000 ? or smaller.

Abstract: The present invention provides a wiring material for forming wiring on a substrate by causing coalescence of conductive particles through heating, and including a binder layer and a wiring layer. The binder layer contains metal particles and having a binder function to be adhered to the substrate; and the wiring layer contains metal particles and laminated on the binder layer. The metal particles of the binder layer and the metal particles of the wiring layer are in contact with each other. With this arrangement, it is possible to provide a wiring material allowing use of a larger variety of materials, while also ensuring low resistance of wiring and improvement of adhesion between the wiring and the substrate.

Abstract: The present invention provides a wiring material for forming wiring on a substrate by causing coalescence of conductive particles through heating, and including a binder layer and a wiring layer. The binder layer contains metal particles and having a binder function to be adhered to the substrate; and the wiring layer contains metal particles and laminated on the binder layer. The metal particles of the binder layer and the metal particles of the wiring layer are in contact with each other. With this arrangement, it is possible to provide a wiring material allowing use of a larger variety of materials, while also ensuring low resistance of wiring and improvement of adhesion between the wiring and the substrate.

Abstract: The multilayer wiring board is provided with a lower layer wiring (8), and an upper layer wiring (10) formed on the lower layer wiring (8) through an interlayer insulating layer (9). On the interlayer insulating layer (9), a contact hole (11) is provided for interconnecting the upper layer wiring (8) with the lower layer wiring (10). A region surrounded by an inner wall (13) which forms the contact hole (11) is permitted to have a linewidth region wherein a wide line region (13A) and protruding regions (13B, 13C) as regions having different linewidths are connected. Thus, film thickness distribution of an ink baked product (12) formed at the contact hole (11) rises at the protruding regions (13B, 13C), and highly reliable multilayer interconnection can be performed between the lower layer wiring (8) and the upper layer wiring (10).

Abstract: A pattern formation substrate comprising a substrate having thereon a hydrophobic region exhibiting repellency to liquid drops and a hydrophilic line exhibiting affinity with liquid drops. The hydrophilic line has such a surface treatment that upon landing of a liquid drop thereon, the liquid drop moves in the arrowed direction. Thus, attachment of liquid drops to regions to which liquid drops should not be adhered can be prevented, thereby enabling forming a pattern of desired characteristics.

Abstract: A manufacturing method of a thin film transistor of the present invention includes the steps of (i) forming an electrode formation area in which a source electrode and a drain electrode are formed by applying a droplet of an electrode raw material, (ii) applying the droplet of the electrode raw material on drop-on positions located off a forming area of a semiconductor layer and in the electrode formation area, and (iii) forming the source electrode and the drain electrode in the electrode formation area. With this arrangement, it is possible to surely prevent adherence of a splash droplet on a channel section between each electrode, in forming the source electrode and the drain electrode by applying the droplet of the electrode raw material.

Abstract: A conductive ink composition is obtained by dispersing, in an organic solvent, a solid material made from metal fine particles each coated with protective colloids each made of at least two organic compounds, the metal fine particles consisting of an alloy containing at least a noble metal. Each of the protective colloids is made from, e.g., a raw material containing an (A) amine and a (B) carboxylic acid. By applying and baking the conductive ink composition, grain growth is restrained. This allows acquirement of a metal film whose surface smoothness is excellent, and whose adhesiveness to an application target is improved as compared with that of a metal film made from a conventional conductive ink composition.

Abstract: A manufacturing method of a thin film transistor of the present invention includes the steps of (i) forming an electrode formation area in which a source electrode and a drain electrode are formed by applying a droplet of an electrode raw material, (ii) applying the droplet of the electrode raw material on drop-on positions located off a forming area of a semiconductor layer and in the electrode formation area, and (iii) forming the source electrode and the drain electrode in the electrode formation area. With this arrangement, it is possible to surely prevent adherence of a splash droplet on a channel section between each electrode, in forming the source electrode and the drain electrode by applying the droplet of the electrode raw material.