Abstract: A fuel tank (10) includes: a lower panel (12) made of steel and an upper panel (11) made of steel; and at least one pillar (100) made of steel which is disposed in an interior space (V) formed by the lower panel (12) and the upper panel (11) facing each other and of which a first end portion is fixed to the lower panel (12) and a second end portion is fixed to the upper panel (11) in a state where the second end portion is disposed in a hole formed in the upper panel (11).

Abstract: A substrate processing apparatus includes: a spin base rotatable in a horizontal plane about a centered rotary axis; a holder to hold a substrate above the spin base; a lower surface processing unit to discharge a processing liquid toward a lower surface of the substrate held by the holder. The holder includes: a plurality of first abutting members that abut the substrate from a position obliquely below said substrate and that hold the substrate in a horizontal posture in a position spaced from an upper surface of said spin base; a plurality of second abutting members that abut the substrate from a position lateral to said substrate and that hold said substrate in a horizontal posture in a position spaced from the upper surface of said spin base.

Abstract: A substrate processing apparatus includes: a spin base rotatable in a horizontal plane about a centered rotary axis; a holder to hold a substrate above the spin base; a lower surface processing unit to discharge a processing liquid toward a lower surface of the substrate held by the holder. The holder includes: a plurality of first abutting members that abut the substrate from a position obliquely below said substrate and that hold the substrate in a horizontal posture in a position spaced from an upper surface of said spin base; a plurality of second abutting members that abut the substrate from a position lateral to said substrate and that hold said substrate in a horizontal posture in a position spaced from the upper surface of said spin base.

Abstract: A substrate processing apparatus includes: a spin base rotatable in a horizontal plane about a centered rotary axis; a holder to hold a substrate above the spin base; a lower surface processing unit to discharge a processing liquid toward a lower surface of the substrate held by the holder. The holder includes: a plurality of first abutting members that abut the substrate from a position obliquely below said substrate and that hold the substrate in a horizontal posture in a position spaced from an upper surface of said spin base; a plurality of second abutting members that abut the substrate from a position lateral to said substrate and that hold said substrate in a horizontal posture in a position spaced from the upper surface of said spin base.

Abstract: A substrate processing apparatus includes: a substrate holder to hold a substrate in a horizontal posture while rotating the substrate about a vertical rotary axis passing through the center of a plane of the substrate; a guard member having a shape extending along at least part of a surface peripheral area of the substrate, the guard member being placed in a position close to the surface peripheral area of the substrate held by the substrate holder in a noncontact manner; a cup being a tubular member with an open top end, the cup being provided so as to surround the substrate held by the substrate holder and the guard member together; and a nozzle from which a processing liquid is discharged to the surface peripheral area of the substrate held by the substrate holder. The nozzle is placed on a side opposite the cup with respect to at least part of the guard member.

Abstract: An upper end of a tubular member surrounding a common pipe line is closed by a lid member. The lid member has an opening formed therein for supplying liquids to adjacent the rotation center on the back surface of a wafer. Deionized water supplied at normal temperature to the interior of the tubular member, after serving to cool the common pipe line, flows out of a lower end of the tubular member.

Abstract: A substrate processing apparatus has a base part facing a surface of a rotation table, and the base part is equipped with a plate member which is rotated by a rotation drive unit together with the rotation table while the base member is being disposed between the rotation table and a substrate W held by a plurality of substrate holding members. The substrate processing apparatus is further equipped with: a heating fluid supply unit and a cooling fluid supply unit each of which is provided between the rotation table and the plate member and supplies a temperature regulating fluid for temperature regulation of the plate member; and a controller which controls supply of the temperature regulating fluids from the heating fluid supply unit and the cooling fluid supply unit.

Abstract: A substrate processing apparatus includes: a substrate holder to hold a substrate in a horizontal posture while rotating the substrate about a vertical rotary axis passing through the center of a plane of the substrate; a guard member having a shape extending along at least part of a surface peripheral area of the substrate, the guard member being placed in a position close to the surface peripheral area of the substrate held by the substrate holder in a noncontact manner; a cup being a tubular member with an open top end, the cup being provided so as to surround the substrate held by the substrate holder and the guard member together; and a nozzle from which a processing liquid is discharged to the surface peripheral area of the substrate held by the substrate holder. The nozzle is placed on a side opposite the cup with respect to at least part of the guard member.

Abstract: A substrate processing apparatus includes: a substrate holder to hold a substrate in a horizontal posture while rotating the substrate about a vertical rotary axis passing through the center of a plane of the substrate; a guard member having a shape extending along at least part of a surface peripheral area of the substrate, the guard member being placed in a position close to the surface peripheral area of the substrate held by the substrate holder in a noncontact manner; a cup being a tubular member with an open top end, the cup being provided so as to surround the substrate held by the substrate holder and the guard member together; and a nozzle from which a processing liquid is discharged to the surface peripheral area of the substrate held by the substrate holder. The nozzle is placed on a side opposite the cup with respect to at least part of the guard member.

Abstract: A substrate processing apparatus has a base part facing a surface of a rotation table, and the base part is equipped with a plate member which is rotated by a rotation drive unit together with the rotation table while the base member is being disposed between the rotation table and a substrate W held by a plurality of substrate holding members. The substrate processing apparatus is further equipped with: a heating fluid supply unit and a cooling fluid supply unit each of which is provided between the rotation table and the plate member and supplies a temperature regulating fluid for temperature regulation of the plate member; and a controller which controls supply of the temperature regulating fluids from the heating fluid supply unit and the cooling fluid supply unit.

Abstract: An upper end of a tubular member surrounding a common pipe line is closed by a lid member. The lid member has an opening formed therein for supplying liquids to adjacent the rotation center on the back surface of a wafer. Deionized water supplied at normal temperature to the interior of the tubular member, after serving to cool the common pipe line, flows out of a lower end of the tubular member.

Abstract: A substrate processing apparatus includes a plurality of chuck pins and a heat source. The chuck pin includes a conductive member made of a material containing carbon, and a pin cover that covers the conductive member. The conductive member includes a gripping portion softer than the substrate, the gripping portion to be pressed onto a peripheral edge portion of the substrate, and protrudes outward from an outer peripheral edge of the substrate in a plan view in a state where the gripping portion is pressed onto the peripheral edge portion of the substrate. The pin cover covers, in a plan view, the entire region of a part of the conductive member protruding outward from the outer peripheral edge of the substrate in a plan view in a state where the gripping portion is pressed onto the peripheral edge portion of the substrate.

Abstract: An upper end of a tubular member surrounding a common pipe line is closed by a lid member. The lid member has an opening formed therein for supplying liquids to adjacent the rotation center on the back surface of a wafer. Deionized water supplied at normal temperature to the interior of the tubular member, after serving to cool the common pipe line, flows out of a lower end of the tubular member.

Abstract: A substrate processing apparatus includes: a substrate holder to hold a substrate in a horizontal posture while rotating the substrate about a vertical rotary axis passing through the center of a plane of the substrate; a guard member having a shape extending along at least part of a surface peripheral area of the substrate, the guard member being placed in a position close to the surface peripheral area of the substrate held by the substrate holder in a noncontact manner; a cup being a tubular member with an open top end, the cup being provided so as to surround the substrate held by the substrate holder and the guard member together; and a nozzle from which a processing liquid is discharged to the surface peripheral area of the substrate held by the substrate holder. The nozzle is placed on a side opposite the cup with respect to at least part of the guard member.

Abstract: A substrate processing apparatus includes a plurality of chuck pins and a heat source. The chuck pin includes a conductive member made of a material containing carbon, and a pin cover that covers the conductive member. The conductive member includes a gripping portion softer than the substrate, the gripping portion to be pressed onto a peripheral edge portion of the substrate, and protrudes outward from an outer peripheral edge of the substrate in a plan view in a state where the gripping portion is pressed onto the peripheral edge portion of the substrate. The pin cover covers, in a plan view, the entire region of a part of the conductive member protruding outward from the outer peripheral edge of the substrate in a plan view in a state where the gripping portion is pressed onto the peripheral edge portion of the substrate.

Abstract: The present invention provides a substrate treatment apparatus for performing a substrate periphery cleaning process. The substrate treatment apparatus includes substrate holding mechanism which holds a substrate, a brush having a cleaning surface inclined with respect to a longitudinal axis thereof extending perpendicularly to a front surface of the substrate held by the substrate holding mechanism, brush moving mechanism which moves the brush along the longitudinal axis and along a lateral axis orthogonal to the longitudinal axis, load detecting unit which detects a load applied along the longitudinal axis to the brush, and first judging unit which judges, based on an output of the load detecting unit, whether or not the brush is located at a reference position serving as a reference for guiding the brush to a treatment position at which the brush is located in the cleaning process.

Abstract: A substrate treatment apparatus includes a substrate holding mechanism for holding a substrate, a brush made of an elastically deformable material and having a cleaning surface formed in a shape tapered toward one side in a perpendicular direction perpendicular to one surface of the substrate held by the substrate holding mechanism and inclined with respect to the perpendicular direction, a brush moving mechanism for moving the brush with respect to the substrate held by the substrate holding mechanism, and a control unit for controlling the brush moving mechanism so that the cleaning surface is pushed to a peripheral area on the one surface and a peripheral end face of the substrate held by the substrate holding mechanism.

Abstract: A substrate treatment apparatus including a substrate holding mechanism for holding a substrate; a first brush made of an elastically deformable material and having a cleaning surface inclined with respect to a perpendicular direction perpendicular to one surface of the substrate held by the substrate holding mechanism; a first brush moving mechanism for moving the first brush with respect to the substrate held by the substrate holding mechanism; a controller for controlling the first brush moving mechanism so that the cleaning surface is made to contact with a peripheral area on the one surface and a peripheral end face of the substrate held by the substrate holding mechanism; and a first pushing pressure holding mechanism for holding a pushing pressure of the first brush in the perpendicular direction to the peripheral area on the one surface of the substrate at a preset pushing pressure.

Abstract: The present invention provides a substrate treatment apparatus for performing a substrate periphery cleaning process. The substrate treatment apparatus includes substrate holding mechanism which holds a substrate, a brush having a cleaning surface inclined with respect to a longitudinal axis thereof extending perpendicularly to a front surface of the substrate held by the substrate holding mechanism, brush moving mechanism which moves the brush along the longitudinal axis and along a lateral axis orthogonal to the longitudinal axis, load detecting unit which detects a load applied along the longitudinal axis to the brush, and first judging unit which judges, based on an output of the load detecting unit, whether or not the brush is located at a reference position serving as a reference for guiding the brush to a treatment position at which the brush is located in the cleaning process.

Abstract: A storage system and a power control method therefor, an adapter and power control therefor, and a storage controller and a control method therefor, that enable the enhancement of their reliability with simple configurations. The storage system and the power control method therefor are configured in such a manner that the storage controller transmits a predetermined start-up completion signal to the adapter and the adapter starts to operate after receiving the start-up completion signal. When the adapter initiates stop of operation, it transfers cache data to the storage controller and transmits a predetermined first signal to the storage controller, the storage controller makes storage devices store the cache data in response to the first signal from the adapter, transmits a predetermined second signal to the adapter, and stops operation, and the adapter stops operation after receiving the second signal.