Abstract: A first frame is supported by a heat sink plate, surrounds an unmounted region of the heat sink plate, contains a resin, and has a first surface. A second frame contains a resin, and has a second surface opposing the first surface. An external terminal electrode passes between the first surface and the second surface. An adhesive layer contains a resin, and includes a lower portion, an upper portion, and an intermediate portion. The lower portion connects the external terminal electrode and the first surface to each other. The upper portion connects the external terminal electrode and the second surface to each other. The intermediate portion is disposed within a through hole of the external terminal electrode, and connects the lower portion and the upper portion to each other.

Abstract: A first frame is supported by a heat sink plate, surrounds an unmounted region of the heat sink plate, contains a resin, and has a first surface. A second frame contains a resin, and has a second surface opposing the first surface. An external terminal electrode passes between the first surface and the second surface. An adhesive layer contains a resin, and includes a lower portion, an upper portion, and an intermediate portion. The lower portion connects the external terminal electrode and the first surface to each other. The upper portion connects the external terminal electrode and the second surface to each other. The intermediate portion is disposed within a through hole of the external terminal electrode, and connects the lower portion and the upper portion to each other.

Abstract: A package for high frequency usages 10 has a notched area 16 on each longitudinal end of a substantially rectangular heat sink plate 11 for fastening the package to a base 20 with a screw. The package includes a joined member 17 formed by joining a surface of a ring-like frame member 12 made of a ceramic material to the longitudinal center of a surface of heat sink plate 11 and joining another surface to an external connection terminal 15. The other surface of heat sink plate 11 presents a curved protruding shape 18 bowing from its longitudinal ends toward its longitudinal center, so that curved protruding shape 18 causes at least an area of the other surface heat sink plate 11 that corresponds to an area dedicated for mounting a semiconductor device 19 within ring-like frame member 12 to make a close contact with base 20 when the package is fastened to base 20 by the screw at notched areas 16.

Abstract: A package for high frequency usages 10 has a notched area 16 on each longitudinal end of a substantially rectangular heat sink plate 11 for fastening the package to a base 20 with a screw. The package includes a joined member 17 formed by joining a surface of a ring-like frame member 12 made of a ceramic material to the longitudinal center of a surface of heat sink plate 11 and joining another surface to an external connection terminal 15. The other surface of heat sink plate 11 presents a curved protruding shape 18 bowing from its longitudinal ends toward its longitudinal center, so that curved protruding shape 18 causes at least an area of the other surface heat sink plate 11 that corresponds to an area dedicated for mounting a semiconductor device 19 within ring-like frame member 12 to make a close contact with base 20 when the package is fastened to base 20 by the screw at notched areas 16.

Abstract: A package for high frequency usages 10 has a notched area 16 on each longitudinal end of a substantially rectangular heat sink plate 11 for fastening the package to a base 20 with a screw. The package includes a joined member 17 formed by joining a surface of a ring-like frame member 12 made of a ceramic material to the longitudinal center of a surface of heat sink plate 11 and joining another surface to an external connection terminal 15. The other surface of heat sink plate 11 presents a curved protruding shape 18 bowing from its longitudinal ends toward its longitudinal center, so that curved protruding shape 18 causes at least an area of the other surface heat sink plate 11 that corresponds to an area dedicated for mounting a semiconductor device 19 within ring-like frame member 12 to make a close contact with base 20 when the package is fastened to base 20 by the screw at notched areas 16.

Abstract: A high-frequency ceramic package 10 comprises a ceramic frame plate 12 brazed to a jointed metal plate 11 on the surface thereof, the jointed metal plate 11 including a substantially rectangular shaped first metal plate 17 which has a hollowed portion 19 at a central portion thereof and a second metal plate 18 which is fitted in the hollowed portion 19 in a state in which the first and second metal plate 17, 18 are jointed together in end-to-end relationship. The first metal 17 is close to the ceramic frame plate in thermal expansion coefficient, and the second metal plate 18 is made from a material having a high level of heat-sinking characteristics. A concave cavity 16 defined between the second metal plate 18 and the ceramic frame plate 12 has a semiconductor electronic component mounting portion on a bottom 16a of the cavity 16.