Abstract: Methods, systems, and computer-readable media are provided for configuration-driven application deployments. An example method can include obtaining a platform-agnostic application configuration including a plurality of application components that can be interpreted by a plurality of system-specific application platforms to dynamically render different applications; based on the platform-agnostic application configuration, generating, by a computing device using a system-specific application platform, an application including a platform-specific interpretation of the platform-agnostic application configuration; and executing the application at the computing device.

Abstract: Example compute-in-memory (CIM) or processor-in-memory (PIM) techniques using repurposed or dedicated static random access memory (SRAM) rows of an SRAM sub-array to store look-up-table (LUT) entries for use in a multiply and accumulate (MAC) operation.

Abstract: Implementations described herein utilize an independent server for facilitating secure exchange of data between multiple disparate parties. The independent server receives client data, via an automated assistant application executing at least in part at a client device, that is to be transmitted to a given third-party application. The independent server processes the client data, using a first encoder-decoder model, to generate opaque client data, and transmits the opaque client data to the given third-party application and without transmitting any of the client data. Further, the independent server receives response data, via the given third-party application, that is generated based on the opaque client data and that is to be transmitted back to the client device. The independent server processes the response data, using a second encoder-decoder model, to generate opaque response data, and transmits the opaque response data to the client device and without transmitting any of the response data.

Abstract: Techniques for managing coverage constraints are provided for determining an improved camera coverage plan including a number, a placement, and a pose of cameras that are arranged to track puts and takes of items by subjects in a three-dimensional real space. The method includes receiving an initial camera coverage plan including a three-dimensional map of a real space, an initial number and initial pose of a plurality of cameras and a camera model including characteristics of the cameras. The method can iteratively apply a machine learning process to an objective function of number and poses of cameras, and subject to a set of constraints, obtain an improved camera coverage plan. The improved camera coverage plan is provided to an installer to arrange cameras to track puts and takes of items by subjects in the three-dimensional real space.

Abstract: Techniques associated with exchanging data between clusters are disclosed. A data packet can be received from a first pod in a first cluster of a cluster set that targets a second pod or service in a second cluster of the cluster set. A label identity is determined for the first pod from a table of pods and label identities. The label identity for the first pod is added in a virtual network identifier field of a data packet header. The data packet is communicated from a first virtual switch to the second cluster through a tunnel interface and gateway node. Upon receipt of the data packet, the label identity is extracted from the data packet header, and an ingress rule associated with the label identity can be determined. Access to the second pod is controlled based on the rule.

Abstract: Methods, systems, and computer-readable media are provided for configuration-driven application deployments. An example method can include obtaining a platform-agnostic application configuration including a plurality of application components that can be interpreted by a plurality of system-specific application platforms to dynamically render different applications; based on the platform-agnostic application configuration, generating, by a computing device using a system-specific application platform, an application including a platform-specific interpretation of the platform-agnostic application configuration; and executing the application at the computing device.

Abstract: Methods, systems, and computer-readable media are provided for configuration-driven application deployments. An example method can include obtaining a platform-agnostic application configuration including a plurality of application components that can be interpreted by a plurality of system-specific application platforms to dynamically render different applications; based on the platform-agnostic application configuration, generating, by a computing device using a system-specific application platform, an application including a platform-specific interpretation of the platform-agnostic application configuration; and executing the application at the computing device.

Abstract: Methods, systems, and computer-readable media are provided for configuration-driven application deployments. An example method can include obtaining a platform-agnostic application configuration including a plurality of application components that can be interpreted by a plurality of system-specific application platforms to dynamically render different applications; based on the platform-agnostic application configuration, generating, by a computing device using a system-specific application platform, an application including a platform-specific interpretation of the platform-agnostic application configuration; and executing the application at the computing device.

Abstract: A nanoadsorbent based filter is used for purification of fluoride and arsenic contaminated water. 140-150 g low cost (˜10 USD/kg) nanoparticles of gamma alumina of 20-25 mg/g fluoride and 25-30 mg/g arsenic adsorption capacity is incorporated in propylene filter without susceptibility of leaching incorporated nanoparticles in water. The cost of domestic defluoridation device containing low cost nanoalumina incorporated filters/cartridges along with housing, overhead tank, tubing and treated water storage container etc. is of very low cost of around 25 USD/device. The fluoride treatment cost would be <0.5 USD/100 lit for 4-5 mg/l fluoride water after 2-3 regenerations while, the arsenic treatment cost using domestic filtration device would be <0.25 USD/100 lit for 90-100 ?g/l arsenic (III) water.

Abstract: A multi-port power conversion system can have a multi-winding transformer and at least three ports. Each port can be coupled to the multi-winding transformer. Each port can have a semiconductor bridge and a coupling network. For each port, the semiconductor bridge can have two or more levels and can comprise at least two switches. The coupling network for each port can comprise at least one inductor. The semiconductor bridge can be coupled to the multi-winding transformer via the respective coupling network. The multi-port power conversion system can have a multi-active bridge (MAB) architecture that is universally applicable to AC-DC, DC-DC, DC-AC, and AC-AC conversion applications and extendable to any number of ports.

Abstract: A set of multi-winding transformer designs that achieve leakage integration in multi-port power electronics systems is presented. The magnetic design structures are extendable to realize an N-port multi-winding transformer with or without leakage inductance integration, that interfaces different voltage levels (high-voltage and/or low-voltage) with galvanic isolation. The disclosed designs enable: (i) reduced number of discrete magnetic components (ii) high efficiency and high power density; (iii) reduced transformer parasitic capacitances. Furthermore, a global transformer optimization approach that considers magnetizing and leakage inductances, core and winding losses, and parasitic capacitances is presented to systemize the sophisticated multi-winding integrated leakage transformer design process.

Abstract: Methods, systems, and computer-readable media are provided for configuration-driven application deployments. An example method can include obtaining a platform-agnostic application configuration including a plurality of application components that can be interpreted by a plurality of system-specific application platforms to dynamically render different applications; based on the platform-agnostic application configuration, generating, by a computing device using a system-specific application platform, an application including a platform-specific interpretation of the platform-agnostic application configuration; and executing the application at the computing device.

Abstract: A nanoadsorbent based filter is used for purification of fluoride and arsenic contaminated water. 140-150 g low cost (˜10 USD/kg) nanoparticles of gamma alumina of 20-25 mg/g fluoride and 25-30 mg/g arsenic adsorption capacity is incorporated in propylene filter without susceptibility of leaching incorporated nanoparticles in water. The cost of domestic defluoridation device containing low cost nanoalumina incorporated filters/cartridges along with housing, overhead tank, tubing and treated water storage container etc. is of very low cost of around 25 USD/device. The fluoride treatment cost would be <0.5 USD/100 lit for 4-5 mg/l fluoride water after 2-3 regenerations while, the arsenic treatment cost using domestic filtration device would be <0.25 USD/100 lit for 90-100 ?g/l arsenic (III) water.

Abstract: A semiconductor die that includes a first die located on a first side of an interposer and a second die located on a second side of the interposer. Active sides of the first and second dies may each face the interposer. A bond wire may electrically connect the first die to the second side of the interposer and a bond wire may electrically connect the second die to the first side of the interposer. The bond wires may extend through a plurality of windows in the interposer. First and second dies may be attached to a first side of an interposer and may be electrically connected to a second side of the interposer through windows and third and fourth dies may be attached to a second side of the interposer and may be electrically connected to the first side of the interposer through windows.

Abstract: A semiconductor die that includes a first die located on a first side of an interposer and a second die located on a second side of the interposer. Active sides of the first and second dies may each face the interposer. A bond wire may electrically connect the first die to the second side of the interposer and a bond wire may electrically connect the second die to the first side of the interposer. The bond wires may extend through a plurality of windows in the interposer. First and second dies may be attached to a first side of an interposer and may be electrically connected to a second side of the interposer through windows and third and fourth dies may be attached to a second side of the interposer and may be electrically connected to the first side of the interposer through windows.

Abstract: A semiconductor die that includes a first die located on a first side of an interposer and a second die located on a second side of the interposer. Active sides of the first and second dies may each face the interposer. A bond wire may electrically connect the first die to the second side of the interposer and a bond wire may electrically connect the second die to the first side of the interposer. The bond wires may extend through a plurality of windows in the interposer. First and second dies may be attached to a first side of an interposer and may be electrically connected to a second side of the interposer through windows and third and fourth dies may be attached to a second side of the interposer and may be electrically connected to the first side of the interposer through windows.

Abstract: A semiconductor die that includes a first die located on a first side of an interposer and a second die located on a second side of the interposer. Active sides of the first and second dies may each face the interposer. A bond wire may electrically connect the first die to the second side of the interposer and a bond wire may electrically connect the second die to the first side of the interposer. The bond wires may extend through a plurality of windows in the interposer. First and second dies may be attached to a first side of an interposer and may be electrically connected to a second side of the interposer through windows and third and fourth dies may be attached to a second side of the interposer and may be electrically connected to the first side of the interposer through windows.