Abstract: Methods, systems, and computer-readable media are provided for configuration-driven application deployments. An example method can include obtaining a platform-agnostic application configuration including a plurality of application components that can be interpreted by a plurality of system-specific application platforms to dynamically render different applications; based on the platform-agnostic application configuration, generating, by a computing device using a system-specific application platform, an application including a platform-specific interpretation of the platform-agnostic application configuration; and executing the application at the computing device.

Abstract: Methods, systems, and computer-readable media are provided for configuration-driven application deployments. An example method can include obtaining a platform-agnostic application configuration including a plurality of application components that can be interpreted by a plurality of system-specific application platforms to dynamically render different applications; based on the platform-agnostic application configuration, generating, by a computing device using a system-specific application platform, an application including a platform-specific interpretation of the platform-agnostic application configuration; and executing the application at the computing device.

Abstract: Methods, systems, and computer-readable media are provided for configuration-driven application deployments. An example method can include obtaining a platform-agnostic application configuration including a plurality of application components that can be interpreted by a plurality of system-specific application platforms to dynamically render different applications; based on the platform-agnostic application configuration, generating, by a computing device using a system-specific application platform, an application including a platform-specific interpretation of the platform-agnostic application configuration; and executing the application at the computing device.

Abstract: Methods, systems, and computer-readable media are provided for configuration-driven application deployments. An example method can include obtaining a platform-agnostic application configuration including a plurality of application components that can be interpreted by a plurality of system-specific application platforms to dynamically render different applications; based on the platform-agnostic application configuration, generating, by a computing device using a system-specific application platform, an application including a platform-specific interpretation of the platform-agnostic application configuration; and executing the application at the computing device.

Abstract: A nanoadsorbent based filter is used for purification of fluoride and arsenic contaminated water. 140-150 g low cost (˜10 USD/kg) nanoparticles of gamma alumina of 20-25 mg/g fluoride and 25-30 mg/g arsenic adsorption capacity is incorporated in propylene filter without susceptibility of leaching incorporated nanoparticles in water. The cost of domestic defluoridation device containing low cost nanoalumina incorporated filters/cartridges along with housing, overhead tank, tubing and treated water storage container etc. is of very low cost of around 25 USD/device. The fluoride treatment cost would be <0.5 USD/100 lit for 4-5 mg/l fluoride water after 2-3 regenerations while, the arsenic treatment cost using domestic filtration device would be <0.25 USD/100 lit for 90-100 ?g/l arsenic (III) water.

Abstract: A multi-port power conversion system can have a multi-winding transformer and at least three ports. Each port can be coupled to the multi-winding transformer. Each port can have a semiconductor bridge and a coupling network. For each port, the semiconductor bridge can have two or more levels and can comprise at least two switches. The coupling network for each port can comprise at least one inductor. The semiconductor bridge can be coupled to the multi-winding transformer via the respective coupling network. The multi-port power conversion system can have a multi-active bridge (MAB) architecture that is universally applicable to AC-DC, DC-DC, DC-AC, and AC-AC conversion applications and extendable to any number of ports.

Abstract: A set of multi-winding transformer designs that achieve leakage integration in multi-port power electronics systems is presented. The magnetic design structures are extendable to realize an N-port multi-winding transformer with or without leakage inductance integration, that interfaces different voltage levels (high-voltage and/or low-voltage) with galvanic isolation. The disclosed designs enable: (i) reduced number of discrete magnetic components (ii) high efficiency and high power density; (iii) reduced transformer parasitic capacitances. Furthermore, a global transformer optimization approach that considers magnetizing and leakage inductances, core and winding losses, and parasitic capacitances is presented to systemize the sophisticated multi-winding integrated leakage transformer design process.

Abstract: Methods, systems, and computer-readable media are provided for configuration-driven application deployments. An example method can include obtaining a platform-agnostic application configuration including a plurality of application components that can be interpreted by a plurality of system-specific application platforms to dynamically render different applications; based on the platform-agnostic application configuration, generating, by a computing device using a system-specific application platform, an application including a platform-specific interpretation of the platform-agnostic application configuration; and executing the application at the computing device.

Abstract: A nanoadsorbent based filter is used for purification of fluoride and arsenic contaminated water. 140-150 g low cost (˜10 USD/kg) nanoparticles of gamma alumina of 20-25 mg/g fluoride and 25-30 mg/g arsenic adsorption capacity is incorporated in propylene filter without susceptibility of leaching incorporated nanoparticles in water. The cost of domestic defluoridation device containing low cost nanoalumina incorporated filters/cartridges along with housing, overhead tank, tubing and treated water storage container etc. is of very low cost of around 25 USD/device. The fluoride treatment cost would be <0.5 USD/100 lit for 4-5 mg/l fluoride water after 2-3 regenerations while, the arsenic treatment cost using domestic filtration device would be <0.25 USD/100 lit for 90-100 ?g/l arsenic (III) water.

Abstract: A semiconductor die that includes a first die located on a first side of an interposer and a second die located on a second side of the interposer. Active sides of the first and second dies may each face the interposer. A bond wire may electrically connect the first die to the second side of the interposer and a bond wire may electrically connect the second die to the first side of the interposer. The bond wires may extend through a plurality of windows in the interposer. First and second dies may be attached to a first side of an interposer and may be electrically connected to a second side of the interposer through windows and third and fourth dies may be attached to a second side of the interposer and may be electrically connected to the first side of the interposer through windows.

Abstract: A semiconductor die that includes a first die located on a first side of an interposer and a second die located on a second side of the interposer. Active sides of the first and second dies may each face the interposer. A bond wire may electrically connect the first die to the second side of the interposer and a bond wire may electrically connect the second die to the first side of the interposer. The bond wires may extend through a plurality of windows in the interposer. First and second dies may be attached to a first side of an interposer and may be electrically connected to a second side of the interposer through windows and third and fourth dies may be attached to a second side of the interposer and may be electrically connected to the first side of the interposer through windows.

Abstract: A semiconductor die that includes a first die located on a first side of an interposer and a second die located on a second side of the interposer. Active sides of the first and second dies may each face the interposer. A bond wire may electrically connect the first die to the second side of the interposer and a bond wire may electrically connect the second die to the first side of the interposer. The bond wires may extend through a plurality of windows in the interposer. First and second dies may be attached to a first side of an interposer and may be electrically connected to a second side of the interposer through windows and third and fourth dies may be attached to a second side of the interposer and may be electrically connected to the first side of the interposer through windows.

Abstract: A semiconductor die that includes a first die located on a first side of an interposer and a second die located on a second side of the interposer. Active sides of the first and second dies may each face the interposer. A bond wire may electrically connect the first die to the second side of the interposer and a bond wire may electrically connect the second die to the first side of the interposer. The bond wires may extend through a plurality of windows in the interposer. First and second dies may be attached to a first side of an interposer and may be electrically connected to a second side of the interposer through windows and third and fourth dies may be attached to a second side of the interposer and may be electrically connected to the first side of the interposer through windows.