Abstract: A handheld fluid sprayer is configured to draw spray fluid from a reservoir mounted on the fluid sprayer and eject the spray fluid through a nozzle. The reservoir is removably mounted to the fluid sprayer. A filling apparatus can connect to the reservoir at the same interfaced that the reservoir connects to the fluid sprayer. The filling apparatus can be used to refill the reservoir. A priming pathway extends through the fluid sprayer and routes air out of the reservoir to prime the pump. The priming pathway extends from the reservoir and to a side of the pump opposite the reservoir. The nozzle includes a spray tip having a tip piece seated within a pre-orifice piece.

Abstract: Microelectronic devices include a lower deck and an upper deck, each comprising a stack structure with a vertically alternating sequence of insulative structures and conductive structures arranged in tiers. First and second arrays of pillars extend through the stack structure of the lower and upper decks, respectively. In one or more of the first and second pillar arrays, at least some pillars exhibit a greater degree of bending away from a vertical orientation than at least some other pillars. The pillars of the first array align with the pillars of the second array along an interface between the lower and upper decks. Related methods are also disclosed.

Abstract: A QFN, DEN, SON, or LGA package without a leadframe, including a component comprising conductive studs disposed over a surface of the component, a single layer of encapsulant disposed around four side surfaces of the component and around at least a portion of the conductive studs, a layer of dielectric disposed over the single layer of encapsulant with via openings formed through the layer of dielectric, and a terminal conductive layer disposed over the layer of dielectric, the terminal conductive layer further comprising a lower surface that conformally follows contours of the layer of dielectric and the via openings, and the terminal conductive layer further comprises an upper surface having a flat surface, a slightly domed surface, a slightly concave surface or an upper surface that is flatter than the lower surface.

Abstract: Substituted derivatives of 5-(4-chlorophenyl)-2,3-dihydroimidazo[1,2-b]isoindol-5-ol and their uses in pharmaceutical compositions for the treatment of central nervous system diseases or disorders are provided.

Abstract: Various embodiments concern a handheld paint sprayer for spraying a paint. The sprayer can comprise a shell body comprising a door that, when opened, exposes an opening into an interior of the shell body, the door configured to close over the opening. The sprayer can further comprise a trigger connected to a handle, a motor in the interior, and a paint reservoir connected to the shell body. The sprayer can further comprise a nozzle in fluid communication with the reservoir and a pump located in the interior of the shell body. The pump is operated by the motor, the pump configured to pump the paint from the reservoir out of the nozzle as a spray. The pump is removable from the interior of the shell body through the opening when the door is opened but is not removable through the opening when the door is closed.

Abstract: A method of making a semiconductor device may include providing a carrier and forming a first photoresist over the carrier with first openings through the first photoresist. A non-planar conductive seed layer may be formed over the first photoresist and conformally extend into the first openings through the first photoresist. A second photoresist may be formed over the first photoresist and over the non-planar conductive seed layer. The second photoresist layer may be patterned to form second openings through the second photoresist that extend to the non-planar conductive seed layer. Conductive posts may be plated over the non-planar conductive seed layer and within the second openings. The second photoresist may be removed while leaving in place the first photoresist. A semiconductor die may be coupled to the carrier. The semiconductor die, the conductive posts, and the first photoresist may be encapsulated with mold compound.

Abstract: A fluid sprayer includes a spray gun that is configured to output a spray of fluid for application on a substrate. A trigger of the spray gun is operatively connected to a controller to control actuation of a pump that drives the spray fluid to the spray gun. A solenoid is connected to a spray valve of the spray gun to actuate the spray valve open to cause spraying by the fluid sprayer.

Abstract: A fluid sprayer includes a spray gun that is configured to output a spray of fluid for application on a substrate. A trigger of the spray gun is operatively connected to a controller to control actuation of a pump that drives the spray fluid to the spray gun. A solenoid is connected to a spray valve of the spray gun to actuate the spray valve open to cause spraying by the fluid sprayer.

Abstract: An electronic device comprising multilevel bitlines comprising first bitlines and second bitlines. The first bitlines and the second bitlines are positioned at different levels. Pillar contacts are electrically connected to the first bitlines and to the second bitlines. Level 1 contacts are electrically connected to the first bitlines and level 2 contacts are electrically connected to the second bitlines. A liner is between the first bitlines and the level 2 contacts. Each bitline of the first bitlines is electrically connected to a single pillar contact in a subblock adjacent to the level 1 contacts and each bitline of the second bitlines is electrically connected to a single pillar contact adjacent to the level 2 contacts. Methods of forming an electronic device and related systems are also disclosed.

Abstract: Methods of improving adhesion between a photoresist and conductive or insulating structures. The method comprises forming a slot through at least a portion of alternating conductive structures and insulating structures on a substrate. Portions of the conductive structures or of the insulating structures are removed to form recesses in the conductive structures or in the insulating structures. A photoresist is formed over the alternating conductive structures and insulating structures and within the slot. Methods of improving adhesion between a photoresist and a spin-on dielectric material are also disclosed, as well as methods of forming a staircase structure.

Abstract: The disclosure describes a method for transferring components for an electronic assembly. The process involves providing a wafer coupled to an energy activated release layer, and singulating the wafer into multiple components. A portion of the energy activated release layer is then activated, allowing for the removal of a component from the layer. Activation of the energy activated release layer occurs through a change in temperature, not with ultraviolet light. The components are removed without the use of a conventional ejector pin or needle and may be removed using a gang pickup. The change in temperature of the energy activated release layer may be heating or cooling. The change in temperature may be driven from above, below, or both above and below the energy activated release layer, including from a bottom thermal probe that may also act as a temperature changing ejector needle.

Abstract: A handheld fluid sprayer (10) is configured to draw spray fluid from a reservoir (14) mounted on the fluid sprayer and eject the spray fluid through a nozzle (32). The reservoir is removably mounted to the fluid sprayer. A filling apparatus can connect to the reservoir at the same interfaced that the reservoir (14) connects to the fluid sprayer (10). The filling apparatus can be used to refill the reservoir (14).

Abstract: A method of making an assembly or package comprising 3D blocks may include forming a conductive element horizontally oriented over a first carrier, forming support material around the conductive element, and singulating the conductive element and the support material to form a plurality of 3D blocks. The method may further include rotating each of the plurality of 3D blocks and mounting the plurality of 3D blocks over a second carrier with the conductive traces of the 3D blocks vertically oriented to form a vertically oriented conductive element. A plurality of components may be disposed laterally offset from each of the plurality of 3D blocks, an encapsulant may be disposed thereover s to form a reconstituted panel that may be singulated to form a plurality of individual assemblies.

Abstract: A method of making a semiconductor assembly may include providing a plurality of components, providing a one or more intermediate carriers, and mounting the plurality of components to the one or more intermediate carriers. The method may further include providing a temporary carrier, mounting the one or more intermediate carriers to the temporary carrier, and disposing an encapsulant over the one or more intermediate carriers and over the plurality of components mounted to the temporary carrier to form a reconstituted panel. The encapsulant may be disposed around four side surfaces of each of the plurality of components.

Abstract: Various embodiments concern a handheld paint sprayer for spraying a paint. The sprayer can comprise a shell body comprising a door that, when opened, exposes an opening into an interior of the shell body, the door configured to close over the opening. The sprayer can further comprise a trigger connected to a handle, a motor in the interior, and a paint reservoir connected to the shell body. The sprayer can further comprise a nozzle in fluid communication with the reservoir and a pump located in the interior of the shell body. The pump is operated by the motor, the pump configured to pump the paint from the reservoir out of the nozzle as a spray. The pump is removable from the interior of the shell body through the opening when the door is opened but is not removable through the opening when the door is closed.

Abstract: A fluid sprayer includes a spray gun that is configured to output a spray of fluid for application on a substrate. A trigger of the spray gun is operatively connected to a controller to control actuation of a pump that drives the spray fluid to the spray gun. A solenoid is connected to a spray valve of the spray gun to actuate the spray valve open to cause spraying by the fluid sprayer.

Abstract: Microelectronic devices include a lower deck and an upper deck, each comprising a stack structure with a vertically alternating sequence of insulative structures and conductive structures arranged in tiers. First and second arrays of pillars extend through the stack structure of the lower and upper decks, respectively. In one or more of the first and second pillar arrays, at least some pillars exhibit a greater degree of bending away from a vertical orientation than at least some other pillars. The pillars of the first array align with the pillars of the second array along an interface between the lower and upper decks. Related methods are also disclosed.

Abstract: An electronic assembly component may comprise at least one fan-out device comprising a first encapsulant disposed around a memory device or function and a processor device or function, and a fan-out interconnect structure disposed over the first encapsulant and the at least one fan-out device. Input output pads may be disposed over the fan-out interconnect structure. A structural support may comprise electrical routing and structural support pads, the structural support further comprising at least one mounting site to which the at least one fan-out device is coupled. An electrical connector may be configured to electrically couple the input output pads of the at least one fan-out device to the structural support pads. A second encapsulant may be disposed over at least a portion of the at least one fan-out device and the structural support.