Abstract: A fluid sprayer includes a spray gun that is configured to output a spray of fluid for application on a substrate. A trigger of the spray gun is operatively connected to a controller to control actuation of a pump that drives the spray fluid to the spray gun. A solenoid is connected to a spray valve of the spray gun to actuate the spray valve open to cause spraying by the fluid sprayer.

Abstract: A fluid sprayer includes a spray gun that is configured to output a spray of fluid for application on a substrate. A trigger of the spray gun is operatively connected to a controller to control actuation of a pump that drives the spray fluid to the spray gun. A solenoid is connected to a spray valve of the spray gun to actuate the spray valve open to cause spraying by the fluid sprayer.

Abstract: An electronic device comprising multilevel bitlines comprising first bitlines and second bitlines. The first bitlines and the second bitlines are positioned at different levels. Pillar contacts are electrically connected to the first bitlines and to the second bitlines. Level 1 contacts are electrically connected to the first bitlines and level 2 contacts are electrically connected to the second bitlines. A liner is between the first bitlines and the level 2 contacts. Each bitline of the first bitlines is electrically connected to a single pillar contact in a subblock adjacent to the level 1 contacts and each bitline of the second bitlines is electrically connected to a single pillar contact adjacent to the level 2 contacts. Methods of forming an electronic device and related systems are also disclosed.

Abstract: Medical devices and systems for treating a stricture along the biliary and/or pancreatic tract are disclosed. An example medical device may include a guidewire for use along the biliary and/or pancreatic tract. The guidewire may include an elongate core member having a proximal end region and a distal end region. A coil member may be disposed along the distal end region. An actuation member may be coupled to the coil member. The actuation member may be configured to shift the coil member between a first configuration and a compressed configuration. The coil member may be configured to be advanced across a biliary and/or pancreatic stricture when in the compressed configuration. A sleeve may be disposed over the coil member.

Abstract: Methods of improving adhesion between a photoresist and conductive or insulating structures. The method comprises forming a slot through at least a portion of alternating conductive structures and insulating structures on a substrate. Portions of the conductive structures or of the insulating structures are removed to form recesses in the conductive structures or in the insulating structures. A photoresist is formed over the alternating conductive structures and insulating structures and within the slot. Methods of improving adhesion between a photoresist and a spin-on dielectric material are also disclosed, as well as methods of forming a staircase structure.

Abstract: A radio frequency signaling system includes a curable coating composition configured to be cured to form a cured coating and a sensor received in the curable coating composition. The sensor includes circuitry forming an inductor-capacitor circuit. The circuitry has a maximum outer diameter of 10 ?m-2.0 mm. The circuitry is configured to generate an electromagnetic field in response to an external radio frequency signal. A container configured to be monitored by a radio frequency signaling system is also provided. The container includes: a container body having an outer surface and an inner surface; a cured coating on the inner surface and/or the outer surface of the container body; and a sensor positioned in the cured coating configured to detect absorption of a fluid contained in the container body by the cured coating.

Abstract: The present invention relates to antisense oligonucleotides that are capable of modulating expression of Tau in a target cell. The oligonucleotides hybridize to MAPT mRNA. The present invention further relates to conjugates of the oligonucleotide and pharmaceutical compositions and methods for treatment of Tauopathies, Alzheimzer's disease, fronto-temporal dementia (FTD), FTDP-17, progressive supranuclear palsy (PSP), chronic traumatic encephalopathy (CTE), corticobasal ganglionic degeneration (CBD), epilepsy, Dravet syndrome, depression, seizure disorders and movement disorders.

Abstract: The disclosure describes a method for transferring components for an electronic assembly. The process involves providing a wafer coupled to an energy activated release layer, and singulating the wafer into multiple components. A portion of the energy activated release layer is then activated, allowing for the removal of a component from the layer. Activation of the energy activated release layer occurs through a change in temperature, not with ultraviolet light. The components are removed without the use of a conventional ejector pin or needle and may be removed using a gang pickup. The change in temperature of the energy activated release layer may be heating or cooling. The change in temperature may be driven from above, below, or both above and below the energy activated release layer, including from a bottom thermal probe that may also act as a temperature changing ejector needle.

Abstract: Methods, systems, and apparatus, including computer programs encoded on a computer storage medium, for optimizing a process of manufacturing a product. In one aspect, the method comprises repeatedly performing the following: i) selecting a configuration of input settings for manufacturing a product, based on a causal model that measures causal relationships between input settings and a measure of a quality of the product; ii) determining the measure of the quality of the product manufactured using the configuration of input settings; and iii) adjusting, based on the measure of the quality of the product manufactured using the configuration of input settings, the causal model.

Abstract: A handheld fluid sprayer (10) is configured to draw spray fluid from a reservoir (14) mounted on the fluid sprayer and eject the spray fluid through a nozzle (32). The reservoir is removably mounted to the fluid sprayer. A filling apparatus can connect to the reservoir at the same interfaced that the reservoir (14) connects to the fluid sprayer (10). The filling apparatus can be used to refill the reservoir (14).

Abstract: A method of making an assembly or package comprising 3D blocks may include forming a conductive element horizontally oriented over a first carrier, forming support material around the conductive element, and singulating the conductive element and the support material to form a plurality of 3D blocks. The method may further include rotating each of the plurality of 3D blocks and mounting the plurality of 3D blocks over a second carrier with the conductive traces of the 3D blocks vertically oriented to form a vertically oriented conductive element. A plurality of components may be disposed laterally offset from each of the plurality of 3D blocks, an encapsulant may be disposed thereover s to form a reconstituted panel that may be singulated to form a plurality of individual assemblies.

Abstract: A method of making a semiconductor assembly may include providing a plurality of components, providing a one or more intermediate carriers, and mounting the plurality of components to the one or more intermediate carriers. The method may further include providing a temporary carrier, mounting the one or more intermediate carriers to the temporary carrier, and disposing an encapsulant over the one or more intermediate carriers and over the plurality of components mounted to the temporary carrier to form a reconstituted panel. The encapsulant may be disposed around four side surfaces of each of the plurality of components.

Abstract: Various embodiments concern a handheld paint sprayer for spraying a paint. The sprayer can comprise a shell body comprising a door that, when opened, exposes an opening into an interior of the shell body, the door configured to close over the opening. The sprayer can further comprise a trigger connected to a handle, a motor in the interior, and a paint reservoir connected to the shell body. The sprayer can further comprise a nozzle in fluid communication with the reservoir and a pump located in the interior of the shell body. The pump is operated by the motor, the pump configured to pump the paint from the reservoir out of the nozzle as a spray. The pump is removable from the interior of the shell body through the opening when the door is opened but is not removable through the opening when the door is closed.

Abstract: Microelectronic devices include a lower deck and an upper deck, each comprising a stack structure with a vertically alternating sequence of insulative structures and conductive structures arranged in tiers. First and second arrays of pillars extend through the stack structure of the lower and upper decks, respectively. In one or more of the first and second pillar arrays, at least some pillars exhibit a greater degree of bending away from a vertical orientation than at least some other pillars. The pillars of the first array align with the pillars of the second array along an interface between the lower and upper decks. Related methods are also disclosed.

Abstract: A fluid sprayer includes a spray gun that is configured to output a spray of fluid for application on a substrate. A trigger of the spray gun is operatively connected to a controller to control actuation of a pump that drives the spray fluid to the spray gun. A solenoid is connected to a spray valve of the spray gun to actuate the spray valve open to cause spraying by the fluid sprayer.

Abstract: An electronic assembly component may comprise at least one fan-out device comprising a first encapsulant disposed around a memory device or function and a processor device or function, and a fan-out interconnect structure disposed over the first encapsulant and the at least one fan-out device. Input output pads may be disposed over the fan-out interconnect structure. A structural support may comprise electrical routing and structural support pads, the structural support further comprising at least one mounting site to which the at least one fan-out device is coupled. An electrical connector may be configured to electrically couple the input output pads of the at least one fan-out device to the structural support pads. A second encapsulant may be disposed over at least a portion of the at least one fan-out device and the structural support.

Abstract: The disclosure concerns devices and methods of forming an electronic assembly or semiconductor assembly, such as fully molded structures, comprising at least two components of a same or differing heights, which may further comprise a backside conductive material. The backside conductive material may be a good thermal conductor, a good electrical conductor, or both.

Abstract: An electronic assembly component may comprise at least one fan-out device comprising a first encapsulant disposed around a memory device or function and a processor device or function, and a fan-out interconnect structure disposed over the first encapsulant and the at least one fan-out device. Input output pads may be disposed over the fan-out interconnect structure. A structural support may comprise electrical routing and structural support pads, the structural support further comprising at least one mounting site to which the at least one fan-out device is coupled. An electrical connector may be configured to electrically couple the input output pads of the at least one fan-out device to the structural support pads. A second encapsulant may be disposed over at least a portion of the at least one fan-out device and the structural support.

Abstract: An electronic assembly may include a component comprising conductive studs disposed over an active layer of the component. A first encapsulant layer may be disposed around four side surfaces of the component, over the active layer of the component, and contacting at least a portion of the sides of the conductive studs. A substantially planar surface may be disposed over the active layer of the component, wherein the substantially planar surface comprises ends of the conductive studs and the first encapsulant layer. The first encapsulant layer comprises a roughness less than 500 nanometers. First conductive elements may be disposed over the encapsulant and coupled with the conductive studs. A second layer of encapsulant may be disposed over the first conductive elements.