Abstract: The present disclosure generally relates to a tape drive comprising one or more tape head modules. Each tape head module comprises 65 data elements disposed in a first row, each data element being a write element or a read element, and at least 5 servo element pairs disposed in a second row, the second row being disposed parallel to the first row. The second row is spaced a distance in a first direction from the first row. One or more data elements and one or more servo element pairs may be unwired and non-operable. The tape drive may comprise three tape head modules, where the second tape head module is disposed between the first and third tape head modules. Each data element of the first tape head module and the third tape head module are write elements, and each data element of the second module is a read element.

Abstract: A delivery apparatus includes a steerable guide sheath. The steerable guide sheath has a steerable portion, a pull ring located in the distal portion, and a pull wire coupled at one end to the pull ring and coupled at the opposite end to a control handle. The pull wire extends longitudinally through a pull-wire conduit. The steerable guide sheath further includes a compression-resistance portion made of metal and located in the distal portion.

Abstract: A method of making a semiconductor assembly may include providing a plurality of components, providing a one or more intermediate carriers, and mounting the plurality of components to the one or more intermediate carriers. The method may further include providing a temporary carrier, mounting the one or more intermediate carriers to the temporary carrier, and disposing an encapsulant over the one or more intermediate carriers and over the plurality of components mounted to the temporary carrier to form a reconstituted panel. The encapsulant may be disposed around four side surfaces of each of the plurality of components.

Abstract: Thermoplastic bicomponent binder fiber can be combined with other media, fibers and other filtration components to form a thermally bonded filtration media. The filtration media can be used in filter units, such as breather caps. Such filter units can be placed in the stream of a mobile fluid and can remove a particulate and/or fluid mist load from the mobile stream. The unique combination of media fiber, bicomponent binder fiber and other filtration additives and components provide a filtration media having unique properties in filtration applications.

Abstract: Various embodiments concern a handheld paint sprayer for spraying a paint. The sprayer can comprise a shell body comprising a door that, when opened, exposes an opening into an interior of the shell body, the door configured to close over the opening. The sprayer can further comprise a trigger connected to a handle, a motor in the interior, and a paint reservoir connected to the shell body. The sprayer can further comprise a nozzle in fluid communication with the reservoir and a pump located in the interior of the shell body. The pump is operated by the motor, the pump configured to pump the paint from the reservoir out of the nozzle as a spray. The pump is removable from the interior of the shell body through the opening when the door is opened but is not removable through the opening when the door is closed.

Abstract: Microelectronic devices include a lower deck and an upper deck, each comprising a stack structure with a vertically alternating sequence of insulative structures and conductive structures arranged in tiers. First and second arrays of pillars extend through the stack structure of the lower and upper decks, respectively. In one or more of the first and second pillar arrays, at least some pillars exhibit a greater degree of bending away from a vertical orientation than at least some other pillars. The pillars of the first array align with the pillars of the second array along an interface between the lower and upper decks. Related methods are also disclosed.

Abstract: A fluid sprayer includes a spray gun that is configured to output a spray of fluid for application on a substrate. A trigger of the spray gun is operatively connected to a controller to control actuation of a pump that drives the spray fluid to the spray gun. A solenoid is connected to a spray valve of the spray gun to actuate the spray valve open to cause spraying by the fluid sprayer.

Abstract: An electronic assembly component may comprise at least one fan-out device comprising a first encapsulant disposed around a memory device or function and a processor device or function, and a fan-out interconnect structure disposed over the first encapsulant and the at least one fan-out device. Input output pads may be disposed over the fan-out interconnect structure. A structural support may comprise electrical routing and structural support pads, the structural support further comprising at least one mounting site to which the at least one fan-out device is coupled. An electrical connector may be configured to electrically couple the input output pads of the at least one fan-out device to the structural support pads. A second encapsulant may be disposed over at least a portion of the at least one fan-out device and the structural support.

Abstract: The disclosure concerns devices and methods of forming an electronic assembly or semiconductor assembly, such as fully molded structures, comprising at least two components of a same or differing heights, which may further comprise a backside conductive material. The backside conductive material may be a good thermal conductor, a good electrical conductor, or both.

Abstract: An electronic assembly component may comprise at least one fan-out device comprising a first encapsulant disposed around a memory device or function and a processor device or function, and a fan-out interconnect structure disposed over the first encapsulant and the at least one fan-out device. Input output pads may be disposed over the fan-out interconnect structure. A structural support may comprise electrical routing and structural support pads, the structural support further comprising at least one mounting site to which the at least one fan-out device is coupled. An electrical connector may be configured to electrically couple the input output pads of the at least one fan-out device to the structural support pads. A second encapsulant may be disposed over at least a portion of the at least one fan-out device and the structural support.

Abstract: An electronic assembly may include a component comprising conductive studs disposed over an active layer of the component. A first encapsulant layer may be disposed around four side surfaces of the component, over the active layer of the component, and contacting at least a portion of the sides of the conductive studs. A substantially planar surface may be disposed over the active layer of the component, wherein the substantially planar surface comprises ends of the conductive studs and the first encapsulant layer. The first encapsulant layer comprises a roughness less than 500 nanometers. First conductive elements may be disposed over the encapsulant and coupled with the conductive studs. A second layer of encapsulant may be disposed over the first conductive elements.

Abstract: A method of measuring thermal conductivity of a material includes aiming a modulated pump laser beam having a modulation frequency low enough to induce a cyclical steady-state temperature rise having “on” and “off” state at a spot of a material, aiming a CW probe laser beam at the spot and generating a reflected probe beam reflected from the spot on the material, the reflected probe beam having a magnitude of a reflectance signal as a function of the temperature of the material and being periodic corresponding to the cyclical temperature rise, measuring the pump power difference and the reflectance signal magnitude difference between the “on” and “off” states, and calculating the thermal conductivity by fitting the measured power difference and the measured reflectance signal magnitude difference to a thermal model which is a function of a thermal conductivity of the material relating the heat flux to the temperature rise.

Abstract: The present invention relates to antisense oligonucleotides that are capable of modulating expression of Tau in a target cell. The oligonucleotides hybridize to MAPT mRNA. The present invention further relates to conjugates of the oligonucleotide and pharmaceutical compositions and methods for treatment of Tauopathies, Alzheimer's disease, fronto-temporal dementia (FTD), FTDP-17, progressive supranuclear palsy (PSP), chronic traumatic encephalopathy (CTE), corticobasal ganglionic degeneration (CBD), epilepsy, Dravet syndrome, depression, seizure disorders and movement disorders.

Abstract: The disclosure concerns method of making an interconnect substrate that may comprise providing a core. The core may comprise a composite core, which may comprise a PCB, a laminate core with build-up layers, or molded core. A first patterned frontside conductive layer may be formed over a front side of the core. A first frontside molded dielectric layer may be disposed over the front side of the core and over the first patterned frontside conductive layer. One or more other dielectric layers (such as polyimide) may be disposed before (and under) the first frontside molded dielectric layer. The core may be flipped such that a back side of the core is presented or configured for processing. A first patterned frontside conductive layer may be formed over the back side of the core.

Abstract: Devices, systems, and techniques are disclosed for planning, updating, and delivering electric field therapy. In one example, a system comprises processing circuitry configured to receive a request to deliver alternating electric field (AEF) therapy and determine therapy parameter values that define the AEF therapy, wherein the AEF therapy comprises delivery of a first electric field and a second electric field. The processing circuitry may also be configured to control an implantable medical device to deliver the first electric field from a first electrode combination of implanted electrodes and control the implantable medical device to deliver, alternating with the first electric field, the second electric field from a second electrode combination of implanted electrodes different than the first electrode combination.

Abstract: A fluid sprayer includes a spray gun that is configured to output a spray of fluid for application on a substrate. A trigger of the spray gun is operatively connected to a controller to control actuation of a pump that drives the spray fluid to the spray gun. A solenoid is connected to a spray valve of the spray gun to actuate the spray valve open to cause spraying by the fluid sprayer.

Abstract: An electrical or semiconductor package may comprise an embedded component comprising embedded vertical interconnects (EVIs) extending through a base substrate material from a first surface to a second surface opposite the first surface. An encapsulant may be disposed around and contact four side surfaces of the embedded component. A first electrical interconnect structure comprising a conductive stud may be coupled to a first end of the EVI at the first surface of the embedded component. The encapsulant may contact at least a portion of the side of the conductive stud. A second electrical interconnect structure comprising a portion of a conductive RDL layer may be coupled to a second end of the EVI at the second surface of the embedded component. A component may be coupled to, and mounted over, the first electrical interconnect of the vertical interconnect.

Abstract: A head-mountable display device includes a housing defining a front opening and a rear opening, a display screen disposed in the front opening, a display assembly disposed in the rear opening, a first securement strap coupled to the housing, the first securement strap including a first electronic component, a second securement strap coupled to the housing, the second securement strap including a second electronic component, and a securement band extending between and coupled to the first securement strap and the second securement strap.

Abstract: Thermoplastic bicomponent binder fiber can be combined with other media, fibers and other filtration components to form a thermally bonded filtration media. The filtration media can be used in filter units. Such filter units can be placed in the stream of a mobile fluid and can remove a particulate load from the mobile stream. The unique combination of media fiber, bicomponent binder fiber and other filtration additives and components provide a filtration media having unique properties in filtration applications.