Abstract: The present invention is drawn to a wire container comprising a plurality of spring-like wires having wave patterns forming a part support that minimize contact points between the container and one or more contained parts when the container is subjected to a vibration causing the wires and the parts to move, thereby eliminating any fixed contact points between the part and the supporting part support. Another aspect of the current invention is a process for removing penetrant from parts comprising: placing one or more parts with penetrant applied in a container having spring-like wire with wave patterns forming a part support; oscillating the container during a cleaning process thereby compressing and expanding one or more spring-like wires thus exposing part surfaces and removing the penetrant from the parts.

Abstract: The present invention is drawn to a wire container comprising a plurality of spring-like wires having wave patterns forming a part support that minimize contact points between the container and one or more contained parts when the container is subjected to a vibration causing the wires and the parts to move, thereby eliminating any fixed contact points between the part and the supporting part support. Another aspect of the current invention is a process for removing penetrant from parts comprising: placing one or more parts with penetrant applied in a container having spring-like wire with wave patterns forming a part support; oscillating the container during a cleaning process thereby compressing and expanding one or more spring-like wires thus exposing part surfaces and removing the penetrant from the parts.

Abstract: The present invention is drawn to a wire container comprising a plurality of spring-like wires having wave patterns forming a part support that minimize contact points between the container and one or more contained parts when the container is subjected to a vibration causing the wires and the parts to move, thereby eliminating any fixed contact points between the part and the supporting part support. Another aspect of the current invention is a process for removing penetrant from parts comprising: placing one or more parts with penetrant applied in a container having spring-like wire with wave patterns forming a part support; oscillating the container during a cleaning process thereby compressing and expanding one or more spring-like wires thus exposing part surfaces and removing the penetrant from the parts.