Abstract: A target for use in an ion beam sputtering apparatus made of at least two target tiles where at least two of the target tiles are made of different chemical compositions and are mounted on a main tile and geometrically arranged on the main tile to yield a desired chemical composition on a sputtered substrate. In an alternate embodiment, the tiles are of varied thickness according to the desired chemical properties of the sputtered film. In yet another alternate embodiment, the target is comprised of plugs pressed in a green state which are disposed in cavities formed in a main tile also formed in a green state and the assembly can then be compacted and then sintered.

Abstract: A target for use in an ion beam sputtering apparatus made of at least two target tiles where at least two of the target tiles are made of different chemical compositions and are mounted on a main tile and geometrically arranged on the main tile to yield a desired chemical composition on a sputtered substrate. In an alternate embodiment, the tiles are of varied thickness according to the desired chemical properties of the sputtered film. In yet another alternate embodiment, the target is comprised of plugs pressed in a green state which are disposed in cavities formed in a main tile also formed in a green state and the assembly can then be compacted and then sintered.

Abstract: A system and method for producing material characteristics are described. A magnetic treatment chamber with a high magnetic field treats workpieces; and a conveyor or transporter continuously moves the workpieces through the high magnetic field in the magnetic chamber. A frictional or mechanical engagement system extracts the workpieces through and out of the high magnetic field.

Abstract: A nozzle assembly for a kinetic spray system includes a convergent portion, a throat portion, and a divergent portion, each cooperating together to define a passage therethrough for passing a mixture of powder particles suspended in a flow of a high pressure heated gas. The nozzle assembly further includes an extension portion attached to the divergent portion and extending to a distal end a pre-determined length from the divergent portion of the nozzle assembly. The extension portion permits a dragging force exerted on the powder particles by the flow of high pressure heated gas to act upon the powder particles for a longer duration of time, thereby permitting the powder particles to accelerate to a greater velocity than has been previously achievable.

Abstract: A nozzle assembly for a kinetic spray system includes a convergent portion, a throat portion, and a divergent portion, each cooperating together to define a passage therethrough for passing a mixture of powder particles suspended in a flow of a high pressure heated gas. The nozzle assembly further includes an extension portion attached to the divergent portion and extending to a distal end a pre-determined length from the divergent portion of the nozzle assembly. The extension portion permits a dragging force exerted on the powder particles by the flow of high pressure heated gas to act upon the powder particles for a longer duration of time, thereby permitting the powder particles to accelerate to a greater velocity than has been previously achievable.

Abstract: The invention concerns a copper-based circuit having an electrically insulative substrate, a bond layer including silver formed over select portions of the substrate according to a desired shape of the circuit, and an electrically conductive layer including plastically deformed particles of copper deposited on the bond layer.

Abstract: A low cost transistor package is provided for high power applications. The package provides high thermal conductivity and dissipation for a silicon transistor die, high current carrying capability and isolation, and high power and thermal cycle life performance and reliability. A dielectric layer is fixed to a silicon transistor die, for coupling to a heat conducting buffer and attachment to a substrate. The dielectric layer is fixed to the die by growing the dielectric layer, depositing the dielectric layer, or applying the dielectric layer using a plasma spray. In an aspect, a conductive layer is formed to the silicon transistor die by a thermal or kinetic spray process, and the dielectric layer is applied to the conductive layer. The dielectric layer may also be established either before or after the transistor fabrication. Electrical and thermal interconnects are advantageously positioned from opposite sides of the silicon transistor die.

Abstract: Disclosed is a method for repairing defects in kinetically sprayed surfaces. The typical defects comprise isolated or connected conical shaped holes in the kinetic spray coating. The repair involves thermally spraying a molten material into the defective area to fill in the cone followed by continued kinetic spraying to complete the coating.

Abstract: A brake assembly is provided that includes a wear-resistant surface, or a surface prone to corrosion, wherein the surface is coated with a coating that optimizes wear-resistance, corrosion-resistance, adhesiveness, and friction factors of the coating. The coating includes a sacrificial corrosion constituent and a second constituent that is relatively harder than the sacrificial corrosion constituent wherein typical metals often employed as sacrificial anodes for example are contemplated. These include aluminum, zinc, and alloys thereof. The second constituent is potentially formed from a carbide, nitride, oxide, transitional metals and alloys thereof, and mixtures thereof.

Abstract: A nozzle assembly for a kinetic spray system includes a convergent portion, a throat portion, and a divergent portion, each cooperating together to define a passage therethrough for passing a mixture of powder particles suspended in a flow of a high pressure heated gas. The nozzle assembly further includes an extension portion attached to the divergent portion and extending to a distal end a pre-determined length from the divergent portion of the nozzle assembly. The extension portion permits a dragging force exerted on the powder particles by the flow of high pressure heated gas to act upon the powder particles for a longer duration of time, thereby permitting the powder particles to accelerate to a greater velocity than has been previously achievable.

Abstract: Disclosed is a method for forming a heat sink laminate and a heat sink laminate formed by the method. In the method a particle mixture is formed from a metal, an alloy or mixtures thereof with a ceramic or mixture of ceramics. The mixture is kinetically sprayed onto a first side of a dielectric material to form a metal matrix composite layer. The second side of the dielectric material is thermally coupled to a heat sink baseplate, thereby forming the heat sink laminate.

Abstract: A method for deposition of a metal layer onto plastic materials is disclosed. The method allows for formation of long length strain gauges and deposition of high melting temperature metals onto plastic materials. The method comprises initially depositing a pattern of powder particles onto the plastic material using a kinetic spray process. Then the high melting temperature metal layer is deposited using a thermal spray process. The metal layer only adheres to the pattern of the powder particles and not to the plastic substrate. To form a stain gauge the powder particles are deposited in a discontinuous non-electrically conductive density on the plastic material. Then a metal layer is deposited using a thermal spray process and a metal having a variable resistance. The metal forms a continuous and electrically conductive pathway having a resistance that changes as stress is applied to the substrate.

Abstract: The present invention is directed to a process for preparing aluminum and aluminum alloy surfaces in heat exchangers for brazing by depositing thereon a kinetic sprayed brazing composition. The process simultaneously deposits monolith or composite coatings that can include all braze materials and corrosion protection materials used in the brazing of aluminum fins to plates and tubes in a single stage.

Abstract: A method of maintaining a non-obstructed interior opening in a kinetic spray nozzle is disclosed. The method includes the steps of providing a mixture of particles including first particle population and a second particle population; entraining the mixture of particles into a flow of a gas at a temperature below the melt temperature of the particle populations; and directing the mixture of particles entrained in the flow of gas through a supersonic nozzle to accelerate the first particle population to a velocity sufficient to result in adherence of the first particle population on a substrate positioned opposite the nozzle. The operating conditions of the kinetic spray system are selected such that the second particle population is not accelerated to a velocity sufficient to result in adherence when it impacts the substrate.

Abstract: Disclosed is a method for forming a heat sink laminate and a heat sink laminate formed by the method. In the method a particle mixture is formed from a metal, an alloy or mixtures thereof with a ceramic or mixture of ceramics. The mixture is kinetically sprayed onto a first side of a dielectric material to form a metal matrix composite layer. The second side of the dielectric material is thermally coupled to a heat sink baseplate, thereby forming the heat sink laminate.

Abstract: Disclosed is a method for repairing defects in kinetically sprayed surfaces. The typical defects comprise isolated or connected conical shaped holes in the kinetic spray coating. The repair involves thermally spraying a molten material into the defective area to fill in the cone followed by continued kinetic spraying to complete the coating.

Abstract: Disclosed is a method for forming a heat sink laminate and a heat sink laminate formed by the method. In the method a particle mixture is formed from a metal, an alloy or mixtures thereof with a ceramic or mixture of ceramics. The mixture is kinetically sprayed onto a first side of a dielectric material to form a metal matrix composite layer. The second side of the dielectric material is thermally coupled to a heat sink baseplate, thereby forming the heat sink laminate.

Abstract: A method is disclosed for the aluminum metalization of ceramics using a kinetic spray system. The method is rapid, does not require any surface preparation of the ceramic substrate, and produces a coating having properties similar to bulk aluminum. The method permits aluminum coatings of from microns to centimeters in thickness. The method further more enables one to quickly apply copper or copper alloys to the aluminum metalization to provide for soldering pads to attach other components. The method finds special application in the area of high powered electronics.

Abstract: A thermal stack laminate and a process for producing the same are disclosed. The thermal stack laminate includes a baseplate formed from a heat sink material that has on a first surface a very thin thermally sprayed alumina layer to serve as a dielectric and attached to the alumina is a kinetic spray applied solderable layer. An electrical component is attached to the thermal stack laminate by solder. The thermal stack laminate optionally includes a kinetic spray applied first and/or second metal matrix composite layer between the baseplate and the alumina layer and between the alumina layer and the solderable material. In addition, one other optional layer comprises a first layer of the solderable material applied via a thermal spray process followed by the remainder of the solderable material applied by a kinetic spray process.

Abstract: The invention concerns a copper-based circuit having an electrically insulative substrate, a bond layer including silver formed over select portions of the substrate according to a desired shape of the circuit, and an electrically conductive layer including plastically deformed particles of copper deposited on the bond layer.