Abstract: A die attach system is provided. The die attach system includes a verification substrate configured to receive a plurality of die, the verification substrate including a plurality of substrate reference markers. The die attach system also includes an imaging system for determining an alignment of the plurality of die with the verification substrate by imaging each of the plurality of die with respective ones of the plurality of substrate reference markers.

Abstract: A die attach system is provided. The die attach system includes a verification substrate configured to receive a plurality of die, the verification substrate including a plurality of substrate reference markers. The die attach system also includes an imaging system for determining an alignment of the plurality of die with the verification substrate by imaging each of the plurality of die with respective ones of the plurality of substrate reference markers.

Abstract: A die attach system is provided. The die attach system includes a verification substrate configured to receive a plurality of die, the verification substrate including a plurality of substrate reference markers. The die attach system also includes an imaging system for determining an alignment of the plurality of die with the verification substrate by imaging each of the plurality of die with respective ones of the plurality of substrate reference markers.

Abstract: A method and a device are provided for estimating at least one component placement position on a substrate at which a component is to be placed. The component placement position is estimated on the basis of the position of at least one mark on the substrate. The statistical measurement inaccuracies of the marks are determined. Subsequently, the positional accuracy of the component placement position on the substrate is estimated on the basis of the measurement inaccuracies of the marks. Subsequently, the estimated positional accuracy of the component placement position is compared with a desired positional accuracy. Subsequently, a determination is made regarding whether the component is to be placed on the substrate with the estimated positional accuracy of the component placement position.

Abstract: A method for calibrating at least one device (2) that comprises a camera, in which an object (3, 10) having at least one reference element (4, 11, 12, 13, 14) is brought into the image area of the camera. A first position of the reference element (4, 11, 12, 13, 14) relative to the device (2) is determined from an image (5, 6, 8, 9, 15, 16) made by the camera. Then a displacem relative to the device (2) is imposed on the object (3, 10). A second position of the reference element (4, 11, 12, 13, 14) relative to the device (2) is determined from a second image made by the camera (5, 6, 8, 9, 15, 16). A real displacement of the object (3, 10)(3) relative to the device (2) is determined from the first and second relative positions, which real displacement is compared with the imposed displacement.

Abstract: A method and a device are provided for estimating at least one component placement position on a substrate at which a component is to be placed. The component placement position is estimated on the basis of the position of at least one mark on the substrate. The statistical measurement inaccuracies of the marks are determined. Subsequently, the positional accuracy of the component placement position on the substrate is estimated on the basis of the measurement inaccuracies of the marks. Subsequently, the estimated positional accuracy of the component placement position is compared with a desired positional accuracy. Subsequently, a determination is made regarding whether the component is to be placed on the substrate with the estimated positional accuracy of the component placement position.