Patents by Inventor Alain Dreyfus

Alain Dreyfus has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronics package on a plate, and a method of making such a package
    Patent number: 6212072
    Abstract: An electronic package has a plate of aluminum or aluminum alloy supporting electronic microcomponents. Trenches, and possibly cavities, are formed on a major surface of the plate. An insulating oxide layer covers the major surface, including the trenches and cavities. A network of equipotential electrically conductive connection tracks are formed on the major surfaces and receive contacts of the electronic microcomponents. Some tracks are above the trenches and thicker than the others.
    Type: Grant
    Filed: May 18, 2000
    Date of Patent: April 3, 2001
    Assignee: Sagem SA
    Inventors: Xavier Boutin, Alain Dreyfus, Jean Hoche, Alain Prolonge