Abstract: In order to interconnect an unprotected bare chip of MMIC (microwave monolithic integrated circuit), a ceramic substrate carries a double-face circuit. A network of microstrip lines which radiate from the center to the periphery is disposed on the first face of said double-face circuit. The bare MMIC chip and its microwave environment is fixed on the second face which is metallized as a ground plane. The microwave circuit is interconnected with the network of microstrips by means of plugged metallized holes. A sole-piece provided with a housing for the MMIC is fixed on the ground plane. The first face can carry self-protected components.

Abstract: A method for the welding by laser, of two metallic parts having a clearance between them. This method is characterized by a dual laser discharge operation. A first laser discharge, done with a first offset with respect to the lateral face of one part, melts a strip of metal which comes into contact with the metal of the other part. A second laser discharge, done with a second offset, smaller than the first offset, heats the two parts and forms a weld joint.