Abstract: The present invention relates to a curable precursor of a fire-retardant, low-density and essentially halogen-free epoxy composition comprising (i) 10 to 70 weight percent of at least one organic epoxide compound with an epoxide functionality of at least one, (ii) 1 to 55 weight percent of at least one epoxide hardener, (iii) 5 to 50 weight percent of an essentially halogen-free fire-retardant system that includes a mixture of: (1) at least one compound selected from the group comprising alkaline earth metal hydroxides and aluminium group hydroxides, and (2) at least one phosphorous-containing material, (iv) 10 to 60 weight percent of a filler system capable of reducing the density of the precursor that includes a mixture of (1) at least one low-density inorganic filler having a density of between 0.1 to 0.5 g cm?3?, (2) at least one low-density organic filler having a density of between 0.01 to 0.30 g/cm?3? and being compressible.

Abstract: The present invention relates to a method of deblocking (e.g. de-attaching) a non-metal-alloy lens block on a processed lens, wherein the lens block has a first end facing towards the processed lens. The method comprises cutting the lens block through its diameter near the first end. A lens block is used to hold a lens in place during processing, and in some applications is used in the manufacture of ophthalmic lenses.

Abstract: Precursor composition for room-temperature curable compositions comprising a first component (A) separated from a second component (B), the component (A) comprising one or more nitrile-butadiene rubber and a linear long chain diamine and the component (B) comprising an epoxy resin and a silicone resin or a resin comprising epoxy and silicone resins.

Abstract: Precursor of a toughened foamed film comprising a. 30-60 wt. % of at least one epoxy compound with an average epoxy equivalent weight of at least 350 g, b. 10-25 wt. % of at least one epoxy compound with an average epoxy equivalent weight of less than 200 g, c. 2-40 wt. % of at least one epoxy curing agent, d. 10-30 wt. % of at least one toughening agent, and e. at least one blowing agent wherein the mass ratio of the epoxy components a and b and the amount of the toughening component d is selected to provide a floating roller peel strength of the cured film of at least 150 N/25 mm at 23° C. and/or a shear impact strength of at least 12 kN/m2 at 23° C.

Abstract: The present invention relates to a curable precursor of a fire-retardant, low-density and essentially halogen-free epoxy composition comprising (i) 10 to 70 weight percent of at least one organic epoxide compound with an epoxide functionality of at least one, (ii) 1 to 55 weight percent of at least one epoxide hardener, (iii) 5 to 50 weight percent of an essentially halogen-free fire-retardant system that includes a mixture of: (1) at least one compound selected from the group comprising alkaline earth metal hydroxides and aluminium group hydroxides, and (2) at least one phosphorous-containing material, (iv) 10 to 60 weight percent of a filler system capable of reducing the density of the precursor that includes a mixture of (1) at least one low-density inorganic filler having a density of between 0.1 to 0.5 g cm?3?, (2) at least one low-density organic filler having a density of between 0.01 to 0.30 g/cm?3? and being compressible.

Abstract: The invention relates to a pressure-sensitive adhesive tape with improved room temperature handleability comprising an adhesive layer with at least one exposed surface and optionally a backing, wherein the pressure-sensitive adhesive layer comprises an epoxy/polyester based pressure sensitive adhesive which is crosslinkable upon exposure to actinic or e-beam irradiation and optionally heat, and comprises (i) 30-80% by weight of a polyester component comprising one or more amorphous polyesters compounds, (ii) 20-70% by weight of an epoxy component comprising one or more epoxy resins and/or monomers, (iii) 0-50% by weight of a hydroxyl-functional component containing one or more hydroxyl-containing compounds having a hydroxyl functionality of at least 1, and (iv) an effective amount of a photoinitiator component for crosslinking the pressure-sensitive adhesive, whereby the weight percentages refer to the total mass of components (i)-(iv) and add up to 100 wt.

Abstract: This invention is directed to a fire-resistant, essentially halogen-free epoxy composition that emits low amounts of smoke and toxic gas while burning. The one-part composition is particularly useful in aerospace applications for bonding, sealing and/or insulating metal, plastic and composite parts.