Patents by Inventor Alain Harrus

Alain Harrus has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for uniform electroplating of integrated circuits using a variable field shaping element
    Patent number: 6402923
    Abstract: An electrochemical reactor is used to electrofill damascene architecture for integrated circuits. A shield is used to screen the applied field during electroplating operations to compensate for potential drop along the radius of a wafer. The shield establishes an inverse potential drop in the electrolytic fluid to overcome the resistance of a thin film seed layer of copper on the wafer.
    Type: Grant
    Filed: March 27, 2000
    Date of Patent: June 11, 2002
    Inventors: Steven T. Mayer, Richard Hill, Alain Harrus, Evan Patton, Robert Contolini, Steve Taatjes, Jon Reid
  • Chuck for substrate processing and method for depositing a film in a radio frequency biased plasma chemical depositing system
    Patent number: 5841623
    Abstract: A chuck for processing a substrate includes a chuck body having a dielectric layer, the dielectric layer including a substrate receiving surface, the substrate receiving surface being at least as large as a substrate to be processed on the chuck. The chuck further includes an electrode buried in the chuck body, the electrode being larger than the substrate receiving surface such that edges of a radio frequency field generated by the electrode are all disposed beyond the substrate receiving surface. A method for depositing a film in a radio frequency biased plasma chemical deposition system is also disclosed.
    Type: Grant
    Filed: December 22, 1995
    Date of Patent: November 24, 1998
    Assignee: Lam Research Corporation
    Inventors: Dean R. Denison, David R. Pirkle, Alain Harrus