Abstract: The present invention concerns a handpiece for dental or surgical use including a body via which the practitioner holds the instrument, characterized in that the body is made of a titanium-molybdenum alloy.

Abstract: The electronic assembly (20) includes an electronic unit (24), formed of an electronic module (26) and two conductive tongues (28, 30) defining two electric contact pads of said electronic unit, and a coil (22). The body (40) of the coil (22) is partially superposed onto the two tongues and fixed to the latter in a durable manner by means of a solidified binder material. The two ends of the coil are bonded respectively onto the two tongues (28, 30).

Abstract: Electronic identification device, notably a key, intended to be used with an electronic lock and comprising in a conducting body (16) two recesses (8,10) arranged facing each other and separated by an intermediate wall (14), an opening (12) being provided in the intermediate wall between the two recesses. Two conducting elements (22,28) are arranged in the two recesses and in the opening, these two elements being electrically and mechanically connected to each other with the aid of a stud (26) driven into a blind hole (34) respectively associated with the two conducting elements (22,28). The electronic unit (2) is electrically connected to the body (16) and to the two conducting elements (22,28) with the aid of conducting pads (48,50) arranged on a sheet (38) placed in one of the two recesses (8) between one plate (24) and the intermediate wall (14). The conducting elements (22,28) are electrically insulated from the conducting body (16).

Abstract: The card with microcircuits of this invention includes an electronic module having standardized electrodes. To make up this module a first unit is fabricated including a first insulating substrate covered by the electrodes. Under each electrode is located a first hole. Next there is fabricated a second unit which includes an integrated circuit chip the connection terminals of which are coupled to conductors printed onto a second insulating substrate. One of the free ends of each conductor falls directly over a second hole provided in the second insulating substrate. The arrangement is such that the first hole is coaxial with the second hole corresponding thereto when the units are superposed. The two units are then assembled by superposing them and soldering the free ends of the conductors of the second unit to the electrodes of the first unit by introducing a soldering tool into the second hole. The module is employed in particular in a microcircuit card of standardized dimensions.

Abstract: A small electronic unit for use especially in the manufacture of microcircuit cards, e.g. credit cards, carpark cards, telephone call payment cards, etc. which includes an integrated circuit positioned in an aperature in a flexible sheet of insulating material which sheet carries a plurality of electrical conductive strips that extends into the aperature and are fastened, soldered or adhesively bonded to the terminals of the chip. The flexible sheet is carried either directly or through the intermediary of the conductive strips by a support member which is deformable under bending and twisting stresses. At least a major sector of the area of the flexible sheet surrrounding the aperature is free to move with respect to the support for substantially isolating the chip and the conductive strips from stresses resulting from the deformations of the support member.

Abstract: The assembling of integrated circuits takes place in a welding post in which a film bearing circuit units advances step by step. Each integrated circuit is brought into the welding post by a rotating platform driven step by step in synchronism with the film. The integrated circuits are loaded in a loading post angularly separated from the welding post and very slightly separated from the exact position they should occupy following their transfer to the welding post. The position error is corrected in an alignment post by simply sliding the integrated ciruit over the platform surface. Thus three operations may be simultaneously performed (loading, alignment and welding) on three individual integrated circuits.