Abstract: The invention relates to an electronic module comprising a dielectric support film having a first side, conductor paths that are printed on said first side, and a semiconductor component which connects the conductor paths by means of electrical connections. The electronic module of the invention is characterized in that each electrical connection includes a lead wire that connects a contact of the semiconductor component to each path directly or via an island or an interconnection pad.

Abstract: The invention relates to a method for manufacturing a device with a secure integrated-circuit chip, said device having an insulating substrate, electrically conductive surfaces on the substrate, which surfaces are connected or coupled to said electronic chip, said electrically conductive surfaces being produced by a step of depositing or transferring conductive material; the method is characterised in that said step of depositing or transferring conductive material is carried out by a technique of directly depositing metal microparticles, which are free of polymer or solvent, onto the substrate, said deposit being obtained by coalescence of the microparticles forming at least one or more uniform cohesive layers that rest directly in contact with the substrate. The invention also relates to the device obtained.

Abstract: The invention relates to a method for manufacturing a device with a secure integrated-circuit chip, said device having an insulating substrate, electrically conductive surfaces on the substrate, which surfaces are connected or coupled to said electronic chip, said electrically conductive surfaces being produced by a step of depositing or transferring conductive material; the method is characterised in that said step of depositing or transferring conductive material is carried out by a technique of directly depositing metal microparticles, which are free of polymer or solvent, onto the substrate, said deposit being obtained by coalescence of the microparticles forming at least one or more uniform cohesive layers that rest directly in contact with the substrate. The invention also relates to the device obtained.

Abstract: The invention relates to an electronic module comprising a dielectric support film having a first side, conductor paths that are printed on said first side, and a semiconductor component which connects the conductor paths by means of electrical connections. The electronic module of the invention is characterized in that each electrical connection includes a lead wire that connects a contact of the semiconductor component to each path directly or via an island or an interconnection pad.

Abstract: A card body comprises a first card body (ID-1 card 1), a second card body (plug-in card 2) and a third card body (mini card 3). The first card body has a first shape (ID-1 shape). The second card body comprises a second shape (plug-in shape). The first card body encompasses the second card body. The third card body comprises a third shape (mini shape). The second card body encompasses the third card body. The third card body has a cavity for receiving an electronic module. A first boundary separates the first shape (ID-1 shape) from the second shape (plug-in shape), and comprises a first number of apertures (5, 6, 7, 17, 18) and a first number of notches (19 and 20) defining a first mechanical inter-card body coupling strength (link between ID-1 card 1 and plug-in card 2).

Abstract: A card body comprises a module-receiving part (3) having a cavity for receiving an electronic module ML. The card body comprises a first side part (4) coupled to the module-receiving part (3), the first side part being separated from the module-receiving part by a first separation line (6), and a second side part (5) coupled to the module-receiving part (3), the second side part being separated from the module-receiving part by a second separation line (7). The module-receiving part defines a third shape corresponding to a third card body (3) type when the first (4) and second (5) side parts are detached from the module-receiving part (3). The module-receiving part defines a second shape (2) corresponding to a second card body type when the first (4) and second (5) side parts are coupled to the module-receiving part (3).

Abstract: A card body comprises a first card body (ID-1 card 1), a second card body (plug-in card 2) and a third card body (mini card 3). The first card body has a first shape (ID-1 shape). The second card body comprises a second shape (plug-in shape). The first card body encompasses the second card body. The third card body comprises a third shape (mini shape). The second card body encompasses the third card body. The third card body has a cavity for receiving an electronic module. A first boundary separates the first shape (ID-1 shape) from the second shape (plug-in shape), and comprises a first number of apertures (5, 6, 7, 17, 18) and a first number of notches (19 and 20) defining a first mechanical inter-card body coupling strength (link between ID-1 card 1 and plug-in card 2).

Abstract: A card body comprises a first card body (ID-1 card 1), a second card body (plug-in card 2) and a third card body (mini card 3). The first card body has a first shape (ID-1 shape). The second card body comprises a second shape (plug-in shape). The first card body encompasses the second card body. The third card body comprises a third shape (mini shape). The second card body encompasses the third card body. The third card body has a cavity for receiving an electronic module. A first boundary separates the first shape (ID-1 shape) from the second shape (plug-in shape), and comprises a first number of apertures (5, 6, 7, 17, 18) and a first number of notches (19 and 20) defining a first mechanical inter-card body coupling strength (link between ID-1 card 1 and plug-in card 2).

Abstract: A card body comprises a module-receiving part (3) having a cavity for receiving an electronic module ML. The card body comprises a first side part (4) coupled to the module-receiving part (3), the first side part being separated from the module-receiving part by a first separation line (6), and a second side part (5) coupled to the module-receiving part (3), the second side part being separated from the module-receiving part by a second separation line (7). The module-receiving part defines a third shape corresponding to a third card body (3) type when the first (4) and second (5) side parts are detached from the module-receiving part (3). The module-receiving part defines a second shape (2) corresponding to a second card body type when the first (4) and second (5) side parts are coupled to the module-receiving part (3).

Abstract: A chip card includes a body of electrically insulating layers, one of which carries an open loop antenna having two ends. The body is equipped with a cavity for housing a micromodule adapted for connection to the antenna by two terminals. The micromodule includes an insulating substrate carrying, on a first side, a semiconductor component, and on a second side, several electrical contact pads. Two of the contact pads are disposed in a strip running through a center region of the substrate. The terminals are connected to the two contact pads through the substrate, and the two pads are respectively connected to ends of the antenna.

Abstract: The invention relates to a substrate for an electronic circuit (9), the electronic circuit carrying at least one contact pad, the substrate comprising an insulating element (3, 12) housing the electronic circuit and carrying, on an external side, a conductive layer defining at least one contact region (7, 8), said contact pad being connected to said contact region. The substrate comprises at least one fragile zone (5, 6) disposed in the insulating element (3, 12). The electronic circuit substrate may be constituted by a chip card wherein an external readable button contains the electronic circuit. The chip card may cooperate electrically with a card reader.

Abstract: An electronic microcircuit card and method for its manufacture are disclosed. Contacts 12 that are accessible through an opening 26 of the card 10 are raised by a boss 27 formed under the contacts in such a manner that they come approximately to the level of the outer face 22a of the card. The invention applies particularly to credit cards, the thickness of which meets the standard for credit cards as established by the International Standards Organization (ISO).

Abstract: A flexible printed circuit having contacts and associated leads which are connected to the contacts. The contacts are disposed at a first zone and the leads are for connection from this zone to a second zone of the circuit which is at a distance from the first zone. The leads run from the respective contacts substantially perpendicular to the axis of the printed circuit which connects the two zones. The leads in turn form bends or loops in relation to the axis, up to the second zone.