Patents by Inventor Alain Peytavy

Alain Peytavy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Secure connector grid array package
    Patent number: 7812428
    Abstract: Methods, systems, IC packages, and electrical devices for providing data security for ICs. A substrate-on-substrate connector grid array package with an electrical shield can protect sensitive information in a secure IC from being accessed by physical attacks. A current flow in the electrical shield can be monitored for disturbances which can indicate an attack on the IC package.
    Type: Grant
    Filed: December 5, 2007
    Date of Patent: October 12, 2010
    Assignee: Atmel Rousset S.A.S.
    Inventors: Alain Peytavy, Alexandre Croguennec
  • Security apparatus
    Patent number: 7791898
    Abstract: A method and device for data security including a printed circuit board and an integrated circuit each having a conductive trace layer shielded by a electrical shield layer. Tampering with either side of the device causes disturbance of a current flowing through a conductive trace layer used as an electrical shield. This triggers a security circuit to erase the data stored in the integrated circuit and stop data flow between the printed circuit board and the integrated circuit.
    Type: Grant
    Filed: October 21, 2005
    Date of Patent: September 7, 2010
    Assignee: Atmel Corporation
    Inventors: Alain Peytavy, Alexandre Croguennec
  • SECURE CONNECTOR GRID ARRAY PACKAGE
    Publication number: 20090146267
    Abstract: Methods, systems, IC packages, and electrical devices for providing data security for ICs. A substrate-on-substrate connector grid array package with an electrical shield can protect sensitive information in a secure IC from being accessed by physical attacks. A current flow in the electrical shield can be monitored for disturbances which can indicate an attack on the IC package.
    Type: Application
    Filed: December 5, 2007
    Publication date: June 11, 2009
    Applicant: ATMEL CORPORATION
    Inventors: Alain Peytavy, Alexandre Croguennec
  • Security method for data protection
    Publication number: 20070018334
    Abstract: A method and device for data security including a printed circuit board and an integrated circuit each having a conductive trace layer shielded by a electrical shield layer. Tampering with either side of the device causes disturbance of a current flowing through a conductive trace layer used as an electrical shield. This triggers a security circuit to erase the data stored in the integrated circuit and stop data flow between the printed circuit board and the integrated circuit.
    Type: Application
    Filed: October 21, 2005
    Publication date: January 25, 2007
    Inventors: Alain Peytavy, Alexandre Croguennec
  • Means for communicating with USB smart cards using full-speed or high-speed transfers
    Patent number: 6793144
    Abstract: The present invention allows the use of low speed USB reader/connector to be use for full speed and high-speed transmission by introducing an accurate clock element into the smart card. In addition, the present invention eliminate the need of having a clock element in any USB compatible reader/connector, making the reader/connector a much simpler device that can be manufactured in a lower cost.
    Type: Grant
    Filed: April 10, 2003
    Date of Patent: September 21, 2004
    Assignee: Atmel Corporation
    Inventors: Gregory Guez, Alain Peytavy
  • MEANS FOR COMMUNICATING WITH USB SMART CARDS USING FULL-SPEED OR HIGH-SPEED TRANSFERS
    Publication number: 20040134992
    Abstract: The present invention allows the use of low speed USB reader/connector to be use for full speed and high-speed transmission by introducing an accurate clock element into the smart card. In addition, the present invention eliminate the need of having a clock element in any USB compatible reader/connector, making the reader/connector a much simpler device that can be manufactured in a lower cost.
    Type: Application
    Filed: April 10, 2003
    Publication date: July 15, 2004
    Inventors: Gregory Guez, Alain Peytavy
  • Method for assembling an integrated circuit with raised contacts on a substrate, device thereby produced and an electronic microcircuit card incorporating said device
    Patent number: 4774633
    Abstract: A device in the form of a contact assembly or package (10) for use in a card (26), such as a credit card. The package includes a substrate (11) having contact holes (16) extending therethrough. The holes are covered by a metal layer (15) on the substrate. Terminals (14) of an integrated circuit (12) are soldered to the metal layer (15) through the holes (16) of the substrate (11). The terminals have a height approximately equal to the thickness of the substrate (11).
    Type: Grant
    Filed: June 24, 1986
    Date of Patent: September 27, 1988
    Assignee: Bull S.A.
    Inventors: Gerard Dehaine, Alain Peytavy