Patents by Inventor Alain R. Carre

Alain R. Carre has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Dip formation of flip-chip solder bumps
    Patent number: 6551650
    Abstract: A process for fabricating a solder bump (113) includes providing an inorganic de-wetting substrate (102). In order to form a composite substrate (20), having the desired wetting/dewetting composition, a wetting metal is first applied on the inorganic de-wetting substrate to create at least one wetting metal pad (52). The composite substrate (20) is then dipped or otherwise immersed into a reservoir of liquid solder (106). Next, the composite substrate (20) is redrawn (116), or otherwise removed, from the liquid solder to form solder bumps (113) on the at least one metal wetting pad (52).
    Type: Grant
    Filed: November 9, 2000
    Date of Patent: April 22, 2003
    Assignee: Corning Incorporated
    Inventors: Alain R. Carre, Jurriaan Gerretsen