Patents by Inventor Alain Tournereau

Alain Tournereau has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6524017
    Abstract: In the arrangement according to the invention, a photodiode (PD) mounted on a submount (SM) and contacted by contact wires (GW) has its photosensitive surface (PS) attached directly to one fiber end by means of an optically transparent adhesive (CG). The fiber (OF) is fastened on a circuit board (BD) to which the contact wires (GW) of the photodiode (PD) are connected. The adhesive joint (CG) between photodiode (PD) and fiber (OF) represents the only mechanical attachment of the photodiode (PD).
    Type: Grant
    Filed: April 24, 2001
    Date of Patent: February 25, 2003
    Assignee: Alcatel
    Inventors: Vincent Lecocq, Alain Tournereau
  • Publication number: 20010041033
    Abstract: In optical data communications, optical fibers are used as light guides, and photodiodes as receivers. The coupling between fiber and photodiode is of great importance. Conventionally, mechanical parts are used to hold the fiber and the photodiode in an optimum position relative to each other. These parts must be formed with high precision, so that their mass production is complex and expensive.
    Type: Application
    Filed: April 24, 2001
    Publication date: November 15, 2001
    Inventors: Vincent Lecocq, Alain Tournereau
  • Patent number: 6280101
    Abstract: A two-part device for protecting optoelectronic units formed or mounted on a substrate is disclosed wherein the units have at least one optical fiber pigtail, and wherein one part of the device has a cutout which corresponds to the shape and size of the optoelectronic unit and is filled with a curable substance adapted to the physical requirements of the optoelectronic unit.
    Type: Grant
    Filed: May 24, 1999
    Date of Patent: August 28, 2001
    Assignee: Alcatel
    Inventors: Alain Tournereau, Laurent Liévre
  • Patent number: 5210811
    Abstract: A method for the alignment of an optical fiber on the optical axis of a light-emitting or light-receiving semiconductor component uses only line contacts between the metal parts. With the component being fixed to a base provided with two grooves, and the fiber being provided with a sleeve, the position of the fiber is determined in polar coordinates by at least two plates which lie in grooves and form angles that are adjustable. The positions are fixed by laser soldering when the alignment is obtained. The device can be applied to optical heads.
    Type: Grant
    Filed: October 18, 1991
    Date of Patent: May 11, 1993
    Assignee: Thomson Hybrides
    Inventors: Gerome Avelange, Alain Tournereau
  • Patent number: 5177807
    Abstract: The disclosure relates to the field of optical components in which a fiber is aligned on a laser, LED or similar device. The fiber is fixed into a sleeve clamped by a "keyhole" shaped clamp. The optical component is fixedly joined to a base in which a slot is parallel to the optical axis of the component. The clips of the clamp are introduced into the slot which is designed to give three degrees of liberty. When the alignment is obtained in dynamic operation, the parts are fixed by solders made by laser. The device can be applied to optical heads.
    Type: Grant
    Filed: October 18, 1991
    Date of Patent: January 5, 1993
    Assignee: Thomson Hybrides
    Inventors: Gerome Avelange, Alain Tournereau
  • Patent number: 4807956
    Abstract: In an opto-electronic head, an optic fiber is coupled with a laser or a light-emitting diode. According to the invention, a plane ceramic substrate acts as a reference plane for the alignment. It is separated into two zones: one zone dedicated to the semi-conductor device and one zone dedicated to the fiber. The second zone supports a heating resistor placed between two insulating layers. A heat barrier, consisting of a slit in the substrate, reduces heat transfers towards the layer to the minimum. To align the two components, a solder preform or polymer preform is put on the resistor. When the preform melts, it forms a drop in which the fiber 4 can be moved in three directions. The invention can be applied to opto-electronic systems.
    Type: Grant
    Filed: October 16, 1987
    Date of Patent: February 28, 1989
    Assignee: Thomson Hybrides Et Microondes
    Inventors: Alain Tournereau, Alain Richard, Daniel Dumas, Guy Egea