Patents by Inventor Alain V. Guery

Alain V. Guery has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10257610
    Abstract: A microphone module has a substrate with an aperture to allow sound waves to pass through the substrate, a lid mounted to the substrate to define a first interior volume, a microphone mounted to the substrate within the first interior volume, and a housing coupled to the substrate and covering the aperture. The housing forms a second interior volume and includes an acoustic port configured to allow sound to enter the second interior volume. The module further includes a pipe extending from the acoustic port in the housing, and at least one exterior interface pad outside of the second interior volume. The pipe has an open end to receive sound waves and direct them toward the acoustic port in the housing. Moreover, the at least one exterior interface pad electrically couples to the microphone.
    Type: Grant
    Filed: April 7, 2017
    Date of Patent: April 9, 2019
    Assignee: INVENSENSE, INC.
    Inventors: Kieran P. Harney, Dipak Sengupta, Brian Moss, Alain V. Guery
  • Publication number: 20170215001
    Abstract: A microphone module has a substrate with an aperture to allow sound waves to pass through the substrate, a lid mounted to the substrate to define a first interior volume, a microphone mounted to the substrate within the first interior volume, and a housing coupled to the substrate and covering the aperture. The housing forms a second interior volume and includes an acoustic port configured to allow sound to enter the second interior volume. The module further includes a pipe extending from the acoustic port in the housing, and at least one exterior interface pad outside of the second interior volume. The pipe has an open end to receive sound waves and direct them toward the acoustic port in the housing. Moreover, the at least one exterior interface pad electrically couples to the microphone.
    Type: Application
    Filed: April 7, 2017
    Publication date: July 27, 2017
    Inventors: Kieran P. Harney, Dipak Sengupta, Brian Moss, Alain V. Guery
  • Publication number: 20160044409
    Abstract: A microphone module has a substrate with an aperture to allow sound waves to pass through the substrate, a lid mounted to the substrate to define a first interior volume, a microphone mounted to the substrate within the first interior volume, and a housing coupled to the substrate and covering the aperture. The housing forms a second interior volume and includes an acoustic port configured to allow sound to enter the second interior volume. The module further includes a pipe extending from the acoustic port in the housing, and at least one exterior interface pad outside of the second interior volume. The pipe has an open end to receive sound waves and direct them toward the acoustic port in the housing. Moreover, the at least one exterior interface pad electrically couples to the microphone.
    Type: Application
    Filed: October 22, 2015
    Publication date: February 11, 2016
    Inventors: Kieran P. Harney, Dipak Sengupta, Brian Moss, Alain V. Guery
  • Patent number: 9173015
    Abstract: A microphone module has a substrate with an aperture to allow sound waves to pass through the substrate, a lid mounted to the substrate to define a first interior volume, a microphone mounted to the substrate within the first interior volume, and a housing coupled to the substrate and covering the aperture. The housing forms a second interior volume and includes an acoustic port configured to allow sound to enter the second interior volume. The module further includes a pipe extending from the acoustic port in the housing, and at least one exterior interface pad outside of the second interior volume. The pipe has an open end to receive sound waves and direct them toward the acoustic port in the housing. Moreover, the at least one exterior interface pad electrically couples to the microphone.
    Type: Grant
    Filed: March 24, 2014
    Date of Patent: October 27, 2015
    Assignee: INVENSENSE, INC.
    Inventors: Kieran P. Harney, Dipak Sengupta, Brian Moss, Alain V. Guery
  • Publication number: 20140294221
    Abstract: A microphone module has a substrate with an aperture to allow sound waves to pass through the substrate, a lid mounted to the substrate to define a first interior volume, a microphone mounted to the substrate within the first interior volume, and a housing coupled to the substrate and covering the aperture. The housing forms a second interior volume and includes an acoustic port configured to allow sound to enter the second interior volume. The module further includes a pipe extending from the acoustic port in the housing, and at least one exterior interface pad outside of the second interior volume. The pipe has an open end to receive sound waves and direct them toward the acoustic port in the housing. Moreover, the at least one exterior interface pad electrically couples to the microphone.
    Type: Application
    Filed: March 24, 2014
    Publication date: October 2, 2014
    Inventors: Kieran P. Harney, Dipak Sengupta, Brian Moss, Alain V. Guery
  • Patent number: 8767982
    Abstract: A microphone module has a substrate with an aperture to allow sound waves to pass through the substrate, a lid mounted to the substrate to define a first interior volume, a microphone mounted to the substrate within the first interior volume, and a housing coupled to the substrate and covering the aperture. The housing forms a second interior volume and includes an acoustic port configured to allow sound to enter the second interior volume. The module further includes a pipe extending from the acoustic port in the housing, and at least one exterior interface pad outside of the second interior volume. The pipe has an open end to receive sound waves and direct them toward the acoustic port in the housing. Moreover, the at least one exterior interface pad electrically couples to the microphone.
    Type: Grant
    Filed: October 26, 2012
    Date of Patent: July 1, 2014
    Assignee: Invensense, Inc.
    Inventors: Kieran P. Harney, Dipak Sengupta, Brian Moss, Alain V. Guery
  • Patent number: 7729890
    Abstract: A method of estimating a change of a variable over a measurement window, including the steps of taking multiple samples of the variable during the measurement window, defining a weight to be associated with each sample, the weight varying as a function of position of the sample within the measurement window, processing the samples taking account of their weight to form an estimate of the change in the variable.
    Type: Grant
    Filed: March 19, 2007
    Date of Patent: June 1, 2010
    Assignee: Analog Devices, Inc.
    Inventors: Robert John Brewer, Michael C. W. Coln, Colin Gerard Lyden, Alain V. Guery
  • Publication number: 20080052045
    Abstract: A method of estimating a change of a variable over a measurement window, comprising the steps of taking multiple samples of the variable during the measurement window, defining a weight to be associated with each sample, the weight varying as a function of position of the sample within the measurement window, processing the samples taking account of their weight to form an estimate of the change in the variable.
    Type: Application
    Filed: March 19, 2007
    Publication date: February 28, 2008
    Applicant: Analog Devices, Inc.
    Inventors: Robert John Brewer, Michael C.W. Coln, Alain V. Guery, Colin G. Lyden