Abstract: A positioning system is provided for insertions and placements with increased accuracy and precision for the placement and insertion of components into elements. The system may utilize one or more sensors to provide individual images or data for each individual insertion of components into elements. The system may use known information to compare the individual images or data to provide increased accuracy and precision for insertion of components into elements.

Abstract: A method and apparatus for making chip assemblies is disclosed that prevent or reduce the cracking and delamination of ultra low-k dielectrics in the back-end-of-line in Si chips that can occur during the chip assembly process. The method and apparatus apply pressure to the top and bottom surfaces of a substrate during the chip bonding process so that the bending and warping of the assembled modules are reduced. The reduced bending and warping prevent or reduce the cracking and delamination of ultra low-k dielectrics.

Abstract: A method and apparatus for making chip assemblies is disclosed that prevent or reduce the cracking and delamination of ultra low-k dielectrics in the back-end-of-line in Si chips that can occur during the chip assembly process. The method and apparatus apply pressure to the top and bottom surfaces of a substrate during the chip bonding process so that the bending and warping of the assembled modules are reduced. The reduced bending and warping prevent or reduce the cracking and delamination of ultra low-k dielectrics.

Abstract: A method and apparatus for making chip assemblies is disclosed that prevent or reduce the cracking and delamination of ultra low-k dielectrics in the back-end-of-line in Si chips that can occur during the chip assembly process. The method and apparatus apply pressure to the top and bottom surfaces of a substrate during the chip bonding process so that the bending and warping of the assembled modules are reduced. The reduced bending and warping prevent or reduce the cracking and delamination of ultra low-k dielectrics.

Abstract: Ink jet printing apparatus is employed to form a non-polar ink stop line around a chip site on the polar surface of an organic laminate substrate. The non-polar ink stop line acts to confine polar liquid flux from spreading after application of the flux to the chip site prior to chip joining. Excessive flux spreading results in insufficient flux being present at the chip site for the formation of good electrical connections during solder reflow upon chip joining.

Abstract: A method is provided for creating solder connections between two surfaces which connections are relatively weak and thus can be readily fractured for separating the surfaces. The preferred application of the disclosed process is its use in connecting semiconductor chips to a carrier in order to conduct burn-in tests on the chips. The process consists of a series of steps to form a surface having a matrix of solder wettable and solder non-wettable areas on the pads of the carrier. Once the solder balls on the chip are attached to the treated pads on the carrier, electrical contacts are made and the chip can be readily removed after the test. The uniquely configured carrier can then be reused numerous times for testing or burning-in chips.

Abstract: A method is provided for creating solder connections between two surfaces which connections are relatively weak and thus can be readily fractured for separating the surfaces. The preferred application of the disclosed process is its use in connecting semiconductor chips to a carrier in order to conduct burn-in tests on the chips. The process consists of a series of steps to form a surface having a matrix of solder wettable and solder non-wettable areas on the pads of the carrier. Once the solder balls on the chip are attached to the treated pads on the carrier, electrical contacts are made and the chip can be readily removed after the test. The uniquely configured carrier can then be reused numerous times for testing or burning-in chips.