Patents by Inventor Alan B. Harker
Alan B. Harker has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9266733Abstract: A layered construction for application to a device or substrate or placement in an enclosed space for use in decontaminating the underlying surface or enclosed space comprises a cathode, an electrolyte layer, an anode and a protective surface layer. A compound that can be electrically decomposed to release on demand and over an extended period of time, an oxidant is included in the layered structure, preferably in the electrolyte layer. Preferred compounds are those which can release halogen ions which react with various different chemical or biological contaminants which may contact the protective layer, destroying, or devitalizing the contaminants.Type: GrantFiled: September 30, 2005Date of Patent: February 23, 2016Assignee: TELEDYNE SCIENTIFIC & IMAGING, LLCInventors: Martin W. Kendig, Young J. Chung, Alan B. Harker, Dennis R. Strauss
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Patent number: 8834687Abstract: A layered construction for use in decontaminating a surface or enclosed space is described. The construction is an electrochemical cell which includes a cathode, an electrolyte layer, an anode and a protective surface layer. A precursor compound that can be electrically decomposed to release an oxidant, on demand and over an extended period of time, is included in the layered structure, preferably in the electrolyte layer. The oxidant compounds react with various different chemical or biological contaminants in contact the protective layer, thereby deactivating, destroying or devitalizing the contaminants. The layered construction is suitable for application to a device or substrate, or placement in an enclosed space, and can be used on sensitive surfaces such as electronic components and human skin.Type: GrantFiled: September 28, 2006Date of Patent: September 16, 2014Assignee: Teledyne Licensing, LLCInventors: Martin W. Kendig, Young J. Chung, Alan B. Harker, Dennis R. Strauss, Walther Ellis, Linda S. Powers
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Publication number: 20120111719Abstract: A layered construction for use in decontaminating a surface or enclosed space is described. The construction is an electrochemical cell which includes a cathode, an electrolyte layer, an anode and a protective surface layer. A precursor compound that can be electrically decomposed to release an oxidant, on demand and over an extended period of time, is included in the layered structure, preferably in the electrolyte layer. The oxidant compounds react with various different chemical or biological contaminants in contact the protective layer, thereby deactivating, destroying or devitalizing the contaminants. The layered construction is suitable for application to a device or substrate, or placement in an enclosed space, and can be used on sensitive surfaces such as electronic components and human skin.Type: ApplicationFiled: September 28, 2006Publication date: May 10, 2012Inventors: Martin W. Kendig, Young J. Chung, Alan B. Harker, Dennis R. Strauss, Walther Ellis, Linda S. Powers
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Patent number: 7256943Abstract: A variable focus liquid-filled lens or microlens array is formed with an elastomer membrane and filled with a polyphenyl ether (PPE) liquid. PPE provides approximately twice the refractive power of water and exhibits better absorption/evaporation properties than water.Type: GrantFiled: August 24, 2006Date of Patent: August 14, 2007Assignee: Teledyne Licensing, LLCInventors: Paul H. Kobrin, Alan B. Harker
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Patent number: 7108819Abstract: A tool for embossing high aspect ratio microstructures is provided, wherein the microstructures provide decreased surface reflection and increased transmission through an optical component even at high incident angles. The tool is fabricated by a process that comprises anisotropic etching of columnar pits in a silicon substrate using inductively coupled plasma, followed by isotropic reactive ion etching of the columnar pits to create relatively pointed obelisks. The silicon substrate is then preferably rinsed to remove remaining photoresist prior to vapor depositing a conductive layer thereon. Finally, a metal is electroformed over the conductive layer to form the embossing tool. The embossing tool is then pressed against an optical coating, for example a polymer sheet, to create microstructures having aspect ratios from 1 to 5.Type: GrantFiled: May 16, 2003Date of Patent: September 19, 2006Assignee: The Boeing CompanyInventors: Alan B Harker, Jeffrey F DeNatale, Dennis R Strauss
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Publication number: 20030201241Abstract: A tool for embossing high aspect ratio microstructures is provided, wherein the microstructures provide decreased surface reflection and increased transmission through an optical component. The tool is fabricated by a process that comprises etching columnar pits in a silicon substrate using inductively coupled plasma, followed by reactive ion etching of the columnar pits to create relatively pointed obelisks. The silicon substrate is then preferably rinsed prior to vapor depositing a conductive layer thereon. Finally, a metal is electroformed over the conductive layer to form the embossing tool. The embossing tool is then pressed against an optical coating, for example a polymer sheet, to create microstructures having aspect ratios from 1 to 5.Type: ApplicationFiled: May 16, 2003Publication date: October 30, 2003Inventors: Alan B. Harker, Jeffrey F. DeNatale, Dennis R. Strauss
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Publication number: 20030201249Abstract: A tool for embossing high aspect ratio microstructures is provided, wherein the microstructures provide decreased surface reflection and increased transmission through an optical component even at high incident angles. The tool is fabricated by a process that comprises anisotropic etching of columnar pits in a silicon substrate using inductively coupled plasma, followed by isotropic reactive ion etching of the columnar pits to create relatively pointed obelisks. The silicon substrate is then preferably rinsed to remove remaining photoresist prior to vapor depositing a conductive layer thereon. Finally, a metal is electroformed over the conductive layer to form the embossing tool. The embossing tool is then pressed against an optical coating, for example a polymer sheet, to create microstructures having aspect ratios from 1 to 5.Type: ApplicationFiled: May 16, 2003Publication date: October 30, 2003Inventors: Alan B. Harker, Jeffrey F. DeNatale, Dennis R. Strauss
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Publication number: 20030038033Abstract: A process for embossing high aspect ratio microstructures is provided, wherein the microstructures provide decreased surface reflection and increased transmission through an optical component. The process comprises etching columnar pits in a silicon substrate using inductively coupled plasma, followed by reactive ion etching of the columnar pits to create relatively pointed obelisks. The silicon substrate is then preferably rinsed prior to vapor depositing a conductive layer thereon. Further, a metal is electroformed over the conductive layer to form an embossing tool. The embossing tool is then used to form microstructures, for example in a polymer sheet, having aspect ratios greater than 5 to 1.Type: ApplicationFiled: August 27, 2001Publication date: February 27, 2003Inventors: Alan B. Harker, Jeffrey F. DeNatale, Dennis Strauss
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Publication number: 20030038105Abstract: A tool for embossing high aspect ratio microstructures is provided, wherein the microstructures provide decreased surface reflection and increased transmission through an optical component. The tool is fabricated by a process that comprises etching columnar pits in a silicon substrate using inductively coupled plasma, followed by reactive ion etching of the columnar pits to create relatively pointed obelisks. The silicon substrate is then preferably rinsed prior to vapor depositing a conductive layer thereon. Finally, a metal is electroformed over the conductive layer to form the embossing tool. The embossing tool is then pressed against an optical coating, for example a polymer sheet, to create microstructures having aspect ratios greater than 5 to 1.Type: ApplicationFiled: August 27, 2001Publication date: February 27, 2003Inventors: Alan B. Harker, Jeffrey F. DeNatale, Dennis Strauss
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Patent number: 5936150Abstract: A miniature chemical sensor using a thin film acoustic resonator coated with a chemically sensitive sorbent coating. The thin film acoustic resonator has electrodes separated by a thin piezoelectric layer and is supported by a multilayer resonant acoustic isolator. The resonant acoustic isolator has alternating layers of high and low acoustic impedance material, each layer being one quarter acoustic wavelength thick or an odd multiple thereof at the resonant frequency. The resonant acoustic isolator is solidly mounted on a substrate but provides acoustic isolation between the thin film acoustic resonator and the substrate at a resonant frequency.Type: GrantFiled: April 13, 1998Date of Patent: August 10, 1999Assignee: Rockwell Science Center, LLCInventors: Paul H. Kobrin, Charles W. Seabury, Alan B. Harker, Ronald P. O'Toole
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Patent number: 5349154Abstract: A swirl flow microwave plasma torch is provided for the growth of diamond films. The swirl flow torch incorporates an injection nozzle that directs reactant gases into a cylindrical flow tube extending through the center of a tuned microwave cavity. The outer surface of the nozzle comprises a contoured, conical shape that causes inert gas, directed tangentially against the outer surface of the nozzle, to swift in a helical path that surrounds and confines the reactant gas emerging from the nozzle. The tuned cavity is coupled to a microwave energy source to generate a highly localized plasma in the reactant gas in the center of the sheathing swirl of inert gas. The swirl of inert gas contains the plasma in a well-defined shape, prevents in-diffusion of undesirable gases, forms a boundary layer to prevent plasma migration, and provides flow tube cooling. The reactant gas flow forces the plasma out of the flow tube to form a plasma flame that can be impinged on a substrate to induce diamond growth.Type: GrantFiled: December 17, 1992Date of Patent: September 20, 1994Assignee: Rockwell International CorporationInventors: Alan B. Harker, Ira B. Goldberg
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Patent number: 5334342Abstract: A high temperature resist process is combined with microlithographic patterning for the production of materials, such as diamond films, that require a high temperature deposition environment. For diamond films, a high temperature silicon nitride resist can be used for microlithographic patterning of a silicon substrate to provide a uniform distribution of diamond nucleation sites and to improve diamond film adhesion to the substrate. A fine-grained nucleation geometry, established at the nucleation sites, is maintained as the diamond film is deposited over the entire substrate after the silicon nitride resist is removed. The process can be extended to form surface relief features, such as "moth eye" surfaces, and microstructures of fine-grained polycrystalline diamond, such as rotatable microgears and surface relief patterns, that have the desirable characteristics of hardness, wear resistance, thermal conductivity, chemical inertness, anti-reflectance, and a low coefficient of friction.Type: GrantFiled: May 4, 1993Date of Patent: August 2, 1994Assignee: Rockwell International CorporationInventors: Alan B. Harker, Jeffrey F. DeNatale, Patrick J. Hood, John F. Flintoff
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Patent number: 5242711Abstract: A high temperature resist process is combined with microlithographic patterning for the production of materials, such as diamond films, that require a high temperature deposition environment. A conventional polymeric resist process may be used to deposit a pattern of high temperature resist material. With the high temperature resist in place and the polymeric resist removed, a high temperature deposition process may proceed without degradation of the resist pattern. After a desired film of material has been deposited, the high temperature resist is removed to leave the film in the pattern defined by the resist. For diamond films, a high temperature silicon nitride resist can be used for microlithographic patterning of a silicon substrate to provide a uniform distribution of diamond nucleation sites and to improve diamond film adhesion to the substrate.Type: GrantFiled: August 16, 1991Date of Patent: September 7, 1993Assignee: Rockwell International Corp.Inventors: Jeffrey D. DeNatale, John F. Flintoff, Alan B. Harker, Patrick J. Hood, Gerald D. Robinson
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Patent number: 4423623Abstract: A meter and a method are provided for measuring the composition and flow rate of a coal slurry and other similar mixtures. The meter is a waveguide through which the mixture flows. Microwaves are propagated in the waveguide from a transmitter probe. A detector probe spaced from the transmitter probe receives signals from the microwaves. Those signals are processed to determine a characteristic frequency of the waveguide or the wavelength of the propagating microwave, which are related to the composition of the mixture within the waveguide. A second transmitter and detector pair determines these properties for another portion of the waveguide. Differences in the frequencies resulting from inhomogenuities in the mixture are cross correlated to determine the flow rate of the mixture.Type: GrantFiled: August 24, 1981Date of Patent: January 3, 1984Assignee: Rockwell International CorporationInventors: William W. Ho, Alan B. Harker, Ira B. Goldberg, Kwang E. Chung
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Patent number: 4049383Abstract: A method for the detection and quantitative analysis of certain selected constituent parts of a gas stream. A gas stream containing the selected constituent is introduced into a reaction zone and contacted with metastable mercury (6.sup.3 P.sub.o) atoms to form an excited complex of the selected constituent and the metastable mercury atom, which decomposes emitting light. The intensity of the light emission is measured and directly correlatable to the concentration of the constituent in the gas stream. The method of the present invention is particularly applicable to the measurement of ambient air containing selected constituents in an amount or concentration in the 1-100 ppb range. The method can be used to measure trace amounts of numerous selected constituents contained in a gaseous stream including such constituents as ammonia, hydrazine, water vapor, alcohols and various amines.Type: GrantFiled: January 6, 1977Date of Patent: September 20, 1977Assignee: Rockwell International CorporationInventors: C. Shepherd Burton, Alan B. Harker, William W. Ho