Abstract: The invention provides a new method and apparatus for electrically accessing a lapping sensor positioned along a row of slider sites on a wafer. The apparatus for accessing the lapping sensor may be positioned outside of the boundaries of the slider sites. The apparatus may also provide top conductors electrically connecting target pads to contact pads. The process for lapping rows of slider sites includes coupling a measurement device to a target pad, coupling a lapping sensor to the top conductor, and lapping the row until the measurement device detects a predetermined signal from the lapping sensor.

Abstract: Method and apparatus for supplying bias to a magnetoresistive element in an encapsulated thin film head for reducing the likelihood of generation of Barkhausen noise when reading flux from a magnetic storage disk. The invention achieves a relatively uniform easy axis bias field in an easy to implement manner by creating a magnetic bias structure on the encapsulated heat at the same time as providing the contact pads for the MR element.

Abstract: Method and apparatus for determining present machining height during machining of a workpiece includes an analog resistive sensor, a discrete resistive sensor and a resistive integrity sensor. Analog sensor preferably has a plurality of resistive elements. Discrete sensor includes contact break points on resistive legs, each leg having a different resistive value to create a step-wise incremental change in resistance of discrete sensor as contacts are lapped away. Integrity sensor has resistive value in fixed relation to resistive value of discrete sensor such that ratio is indicative of integrity before machining. Invention enables use of electronic lapping guide with electrically conductive lap without shorting out. Discrete sensor value used to determine location of rear plane of analog sensor and analog sensor value used to confirm identity of break point as part of method for determining current lapping height.

Abstract: Method and apparatus for determining present machining height during machining of a workpiece includes an analog resistive sensor, a discrete resistive sensor and a resistive integrity sensor. Analog sensor preferably has a plurality of resistive elements. Discrete sensor includes contact break points on resistive legs, each leg having a different resistive value to create a step-wise incremental change in resistance of discrete sensor as contacts are lapped away. Integrity sensor has resistive value in fixed relation to resistive value of discrete sensor such that ratio is indicative of integrity before machining. Invention enables use of electronic lapping guide with electrically conductive lap without shorting out. Discrete sensor value used to determine location of rear plane of analog sensor and analog sensor value used to confirm identity of break point as part of method for determining current lapping height.