Abstract: The invention relates to an aqueous electroplating solution for alkaline electroplating, comprising: [M(NH3)4]2+ ions, wherein M is selected from the group consisting of Pd or Pt; and organic anions selected from the group consisting of bicarbonate, carbonate, or a mixture thereof; wherein the following species, if present, are present in the following amounts: alkali metals in an amount of less than 5 g/L; compounds comprising phosphorus in an amount of less than 5 g/L; compounds comprising boron in an amount of less than 5 g/L. The invention also relates to an electroplating bath comprising the electroplating solution, and a method of forming a metal layer on a substrate by electroplating using the electroplating solution.

Abstract: A method of manufacturing a plating solution comprising a platinum (II) complex, comprising the steps of: (i) preparing an acidic aqueous solution comprising a chloride-free platinum (IV) compound and a source of nitrous acid (HNO2) as a reducing agent; (ii) heating the solution from step (i) in order to promote the reduction of platinum (IV) to platinum (II) and decomposition of residual nitrous acid. Also described is a platinum plating solution produced by this process.

Abstract: Aqueous electroplating solution for alkaline electroplating, comprising: [M(NH3)4]2+ ions, wherein M is selected from the group consisting of Pd or Pt; and organic anions selected from the group consisting of bicarbonate, carbonate, or a mixture thereof; wherein the following species, if present, are present in the following amounts: alkali metals in an amount of less than 5 g/L; compounds comprising phosphorus in an amount of less than 5 g/L; compounds comprising boron in an amount of less than 5 g/L. The invention also relates to an electroplating bath comprising the electroplating solution, and a method of forming a metal layer on a substrate by electroplating using the electroplating solution.

Abstract: The invention relates to an aqueous electroplating solution for alkaline electroplating, comprising: [M(NH3)4]2+ ions, wherein M is selected from the group consisting of Pd or Pt; and organic anions selected from the group consisting of bicarbonate, carbonate, or a mixture thereof; wherein the following species, if present, are present in the following amounts: alkali metals in an amount of less than 5 g/L; compounds comprising phosphorus in an amount of less than 5 g/L; compounds comprising boron in an amount of less than 5 g/L. The invention also relates to an electroplating bath comprising the electroplating solution, and a method of forming a metal layer on a substrate by electroplating using the electroplating solution.

Abstract: An electrochemical sensor cell is disclosed. The cell comprised of a diffusion membrane, a cathode, an anode, an electrolyte, electronic circuit board with electronic leads contained in housing. The anode is made of substantially pure bismuth. The electrolyte may be either solid or aqueous solution of potassium hydroxide (KOH) solution or acetic acid (CH3COOH). The cathode may be a carbon fiber substrate with gold deposited thereon. The sensor may be RoHS compliant.

Abstract: An aqueous platinum electroplating bath includes: a) a source of platinum ions; and b) a source of borate ions. The aqueous platinum electroplating bath may optionally include one or more levellers. A method of using the platinum electroplating bath for electroplating platinum or a platinum alloy onto a substrate is also described.

Abstract: An electrochemical sensor cell is disclosed. The cell comprised of a diffusion membrane, a cathode, an anode, an electrolyte, electronic circuit board with electronic leads contained in housing. The anode is made of substantially pure bismuth. The electrolyte may be either solid or aqueous solution of potassium hydroxide (KOH) solution or acetic acid (CH3COOH). The cathode may be a carbon fiber substrate with gold deposited thereon. The sensor may be RoHS compliant.

Abstract: The present invention provides an aqueous platinum electroplating bath including: a) a source of platinum ions; and b) a source of polyphosphate anions, and wherein the bath has a pH in the range from about 2 to about 9 when it is in use or ready for use. The aqueous platinum electroplating bath may optionally include one or more levellers. The invention also provides the use of the platinum electroplating bath and platinum salts suitable for use in the bath.