Abstract: An array of localized auto-focus sensors provides direct measurement of the working distance between each microscope column in the array and the substrate being imaged below. The auto-focus sensors measure the working distance between each column and the imaging substrate as it passes over a point on the substrate to be imaged. The working distance measurement from the sensors is input into a control system, which in turn outputs the required working distance adjustment to the microscope column. The control system independently adjusts microscope working distance and/or physical distance of an individual microscope column in a multi-column microscope based on auto-focus sensor input. The individual microscope columns in the multi-column microscope can also be used as the auto-focus sensor itself.

Abstract: An example device may include a housing with a number of latches with curved faces to permit contact and manipulation when in contact with a surface. The example may include a housing having spring-loaded angled and sloped latches disposed along the outside of the housing, and a face plate on a bottom portion of the housing.

Abstract: An array of localized auto-focus sensors provides direct measurement of the working distance between each microscope column in the array and the substrate being imaged below. The auto-focus sensors measure the working distance between each column and the imaging substrate as it passes over a point on the substrate to be imaged. The working distance measurement from the sensors is input into a control system, which in turn outputs the required working distance adjustment to the microscope column. The control system independently adjusts microscope working distance and/or physical distance of an individual microscope column in a multi-column microscope based on auto-focus sensor input. The individual microscope columns in the multi-column microscope can also be used as the auto-focus sensor itself.

Abstract: An example device may include a housing with a number of latches with curved faces to permit contact and manipulation when in contact with a surface. The example may include a housing having spring-loaded angled and sloped latches disposed along the outside of the housing, and a face plate on a bottom portion of the housing.

Abstract: A miniature electron beam column in combination with magnetostatic lenses to produce very high-performance miniature electron or ion beam columns. Silicon-based electron optical components provide high-accuracy formation and alignment of critical optical elements and the magnetic lenses provide low-aberration focusing or condensing elements. Accurate assembly of the silicon and magnetic components is achievable via the multilayered assembly techniques and allows for achieving high performance.

Abstract: An example device may include a housing with a number of latches with curved faces to permit contact and manipulation when in contact with a surface. The example may include a housing having spring-loaded angled and sloped latches disposed along the outside of the housing, and a face plate on a bottom portion of the housing.

Abstract: A segmented detector device with backside illumination. The detector is able to collect and differentiate between secondary electrons and backscatter electrons. The detector includes a through-hole for passage of a primary electron beam. After hitting a sample, the reflected secondary and backscatter electrons are collected via a vertical structure having a P+/P?/N+ or an N+/N?/P+ composition for full depletion through the thickness of the device. The active area of the device is segmented using field isolation insulators located on the front side of the device.

Abstract: A segmented detector device with backside illumination. The detector is able to collect and differentiate between secondary electrons and backscatter electrons. The detector includes a through-hole for passage of a primary electron beam. After hitting a sample, the reflected secondary and backscatter electrons are collected via a vertical structure having a P+/P?/N+ or an N+/N?/P+ composition for full depletion through the thickness of the device. The active area of the device is segmented using field isolation insulators located on the front side of the device.

Abstract: An example device may include a housing with a number of latches with curved faces to permit contact and manipulation when in contact with a surface. The example may include a housing having spring-loaded angled and sloped latches disposed along the outside of the housing, and a face plate on a bottom portion of the housing.

Abstract: Multi-beam e-beam columns and inspection systems that use such multi-beam e-beam columns are disclosed. A multi-beam e-beam column configured in accordance with the present disclosure may include an electron source and a multi-lens array configured to produce a plurality of beamlets utilizing electrons provided by the electron source. The multi-lens array may be further configured to shift a focus of at least one particular beamlet of the plurality of beamlets such that the focus of the at least one particular beamlet is different from a focus of at least one other beamlet of the plurality of beamlets.

Abstract: Light-emitting devices, such as LEDs, are tested using a photometric unit. The photometric unit, which may be an integrating sphere, can measure flux, color, or other properties of the devices. The photometric unit may have a single port or both an inlet and outlet. Light loss through the port, inlet, or outlet can be reduced or calibrated for. These testing systems can provide increased reliability, improved throughput, and/or improved measurement accuracy.

Abstract: Multi-beam e-beam columns and inspection systems that use such multi-beam e-beam columns are disclosed. A multi-beam e-beam column configured in accordance with the present disclosure may include an electron source and a multi-lens array configured to produce a plurality of beamlets utilizing electrons provided by the electron source. The multi-lens array may be further configured to shift a focus of at least one particular beamlet of the plurality of beamlets such that the focus of the at least one particular beamlet is different from a focus of at least one other beamlet of the plurality of beamlets.

Abstract: An electron microscope assembly suitable for enhancing an image of a lithography tool includes an electron microscope configured for positioning below a lithography stage of an e-beam lithography tool, the lithography stage of the e-beam lithography tool including an aperture for providing the microscope line-of-sight to the lithography optics of the lithography tool, a translation unit configured to selectively translate the microscope along the optical axis of the lithography optics of the lithography tool responsive to a translation control system, the translation unit further configured to position the microscope in an operational state such that the optics of the microscope are positioned proximate to the lithography optics, a docking unit configured to reversibly mechanically couple the microscope with the lithography tool, the microscope configured to magnify a virtual sample plane image generated by the lithography tool.

Abstract: An exemplary method of providing an optimized resolution to a problem in an infrastructure includes a step of determining at least one target configuration of the infrastructure wherein the target configuration is aligned with at least one template. The exemplary method also includes determining at least one resolution to the problem suitable for the at least one target configuration. The exemplary method also includes calculating at least one metric associated with at least one combination of at least one determined target configuration and at least one determined resolution. The exemplary method also includes selecting at least one combination of at least one determined transformation and at least one determined resolution based at least in part on the at least one calculated metric.

Abstract: An exemplary method of determining a target configuration of an infrastructure aligned with a template includes a step of representing the current configuration of the infrastructure as a graph having a plurality of vertices representing elements of the infrastructure and at least one edge representing at least one dependency between the elements, wherein a given element within a set of possible elements for the infrastructure has a set of possible equivalent elements for the given element. The exemplary method also includes a step of finding at least one cut vertex in the graph representing the current configuration of the infrastructure, wherein removal of the cut vertex will split the graph into two sub-graphs as close in size as possible.

Abstract: One embodiment relates to an electron source apparatus for an electron beam lithography tool or an electron beam inspection tool. A cathode is configured to emit electrons, and an anode is configured to accelerate the electrons so as to create an electron beam. There are no beam apertures in the electron source apparatus that are positioned at non-focal planes. An electron lens may be configured to focus the electron beam to form a cathode image at a focal plane, and a beam aperture may positioned at the focal plane. Other embodiments, aspects and features are also disclosed.

Abstract: Electron spectroscopy methods and apparatus are disclosed. A beam of primary electrons is applied to a measurement location on a surface of a sample. A pinning flux of electrons is applied to one or more pinning regions proximate the measurement location. The pinning flux is characterized by a location, size, shape, and electron flux configured such that contaminants preferentially migrate to the pinning region rather than the measurement location. Emissions from the surface resulting from interaction with the primary electrons and the surface of the sample at the measurement location are analyzed.

Abstract: A method for sharpening a metal carbide emitter tip is disclosed. The metal carbide emitter tip is exposed to an oxygen rich, low vacuum environment when the metal carbide emitter tip is at a first temperature. The metal carbide emitter tip is rapidly heated to a higher second temperature at regular intervals of time.

Abstract: An exemplary method of providing an optimized resolution to a problem in an infrastructure includes a step of determining at least one target configuration of the infrastructure wherein the target configuration is aligned with at least one template. The exemplary method also includes determining at least one resolution to the problem suitable for the at least one target configuration. The exemplary method also includes calculating at least one metric associated with at least one combination of at least one determined target configuration and at least one determined resolution. The exemplary method also includes selecting at least one combination of at least one determined transformation and at least one determined resolution based at least in part on the at least one calculated metric.

Abstract: An exemplary method of determining a target configuration of an infrastructure aligned with a template includes a step of representing the current configuration of the infrastructure as a graph having a plurality of vertices representing elements of the infrastructure and at least one edge representing at least one dependency between the elements, wherein a given element within a set of possible elements for the infrastructure has a set of possible equivalent elements for the given element. The exemplary method also includes a step of finding at least one cut vertex in the graph representing the current configuration of the infrastructure, wherein removal of the cut vertex will split the graph into two sub-graphs as close in size as possible. The method includes a step of, for each element within the set of possible equivalent elements for the cut vertex, replacing the cut vertex with a given element within the set of possible equivalent elements for the cut vertex.