Abstract: Embodiments of the present disclosure are directed towards techniques and configurations to provide solder contacts for electrical connection in socket assemblies. In one embodiment, a solder contact may be disposed on the bottom surface of a die package such that the solder contact is conductively coupled to electrical contacts of the die package. The solder contacts may be disposed to be coupled to pins of a socket assembly, to provide conductive coupling of the electrical contacts of the die package and the pins of the socket assembly. The solder may be selected to be sufficiently soft to provide for better electrical conduction. The pins may also be configured to penetrate the solder contact to provide for better electrical conduction. Other embodiments may be described and/or claimed.

Abstract: Embodiments of the present disclosure are directed towards techniques and configurations to provide solder contacts for electrical connection in socket assemblies. In one embodiment, a solder contact may be disposed on the bottom surface of a die package such that the solder contact is conductively coupled to electrical contacts of the die package. The solder contacts may be disposed to be coupled to pins of a socket assembly, to provide conductive coupling of the electrical contacts of the die package and the pins of the socket assembly. The solder may be selected to be sufficiently soft to provide for better electrical conduction. The pins may also be configured to penetrate the solder contact to provide for better electrical conduction. Other embodiments may be described and/or claimed.

Abstract: Embodiments of the present disclosure are directed towards techniques and configurations to provide solder contacts for electrical connection in socket assemblies. In one embodiment, a solder contact may be disposed on the bottom surface of a die package such that the solder contact is conductively coupled to electrical contacts of the die package. The solder contacts may be disposed to be coupled to pins of a socket assembly, to provide conductive coupling of the electrical contacts of the die package and the pins of the socket assembly. The solder may be selected to be sufficiently soft to provide for better electrical conduction. The pins may also be configured to penetrate the solder contact to provide for better electrical conduction. Other embodiments may be described and/or claimed.

Abstract: Embodiments of the present disclosure are directed towards techniques and configurations to provide solder contacts for electrical connection in socket assemblies. In one embodiment, a solder contact may be disposed on the bottom surface of a die package such that the solder contact is conductively coupled to electrical contacts of the die package. The solder contacts may be disposed to be coupled to pins of a socket assembly, to provide conductive coupling of the electrical contacts of the die package and the pins of the socket assembly. The solder may be selected to be sufficiently soft to provide for better electrical conduction. The pins may also be configured to penetrate the solder contact to provide for better electrical conduction. Other embodiments may be described and/or claimed.

Abstract: Manufacturers test printed circuit boards (PCB) to ensure that all components have been soldered to the correctly. Some tests cause the boards to deflect, which can damage component-to-board interfaces (i.e., solder joints) or components. Embodiments of the present invention measure the amount of PCB deflection before, during, and after the PCB is subject to mechanical load using photoelectric amplifiers, which send and receive light beams to targets mounted on the PCB surface through optical fibers and lenses mounted in a head assembly. The intensity of received light beams are proportional to analog voltages output by the photoelectric amplifiers and to the distance between the head assemblies and the targets. A data acquisition system converts the analog voltages to digital voltages and a software interface correlates the digital voltages to PCB deflection/displacement. A GUI displays deflection before, during, and after the PCB is subject to mechanical load.

Abstract: Manufacturers test printed circuit boards (PCB) to ensure that all components have been soldered to the correctly. Some tests cause the boards to deflect, which can damage component-to-board interfaces (i.e., solder joints) or components. Embodiments of the present invention measure the amount of PCB deflection before, during, and after the PCB is subject to mechanical load using photoelectric amplifiers, which send and receive light beams to targets mounted on the PCB surface through optical fibers and lenses mounted in a head assembly. The intensity of received light beams are proportional to analog voltages output by the photoelectric amplifiers and to the distance between the head assemblies and the targets. A data acquisition system converts the analog voltages to digital voltages and a software interface correlates the digital voltages to PCB deflection/displacement. A GUI displays deflection before, during, and after the PCB is subject to mechanical load.

Abstract: Manufacturers test printed circuit boards (PCB) to ensure that all components have been soldered to the correctly. Some tests cause the boards to deflect, which can damage component-to-board interfaces (i.e., solder joints) or components. Embodiments of the present invention measure the amount of PCB deflection before, during, and after the PCB is subject to mechanical load using photoelectric amplifiers, which send and receive light beams to targets mounted on the PCB surface through optical fibers and lenses mounted in a head assembly. The intensity of received light beams are proportional to analog voltages output by the photoelectric amplifiers and to the distance between the head assemblies and the targets. A data acquisition system converts the analog voltages to digital voltages and a software interface correlates the digital voltages to PCB deflection/displacement. A GUI displays deflection before, during, and after the PCB is subject to mechanical load.