Patents by Inventor Alan Carroll

Alan Carroll has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060231801
    Abstract: The present invention is directed to a thick film conductive composition comprising: (a) electrically conductive silver powder; (b) zinc-containing additive; (c) glass frit wherein said glass frit is lead-free; dispersed in (d) organic medium. The present invention is further directed to an electrode formed from the composition above wherein said composition has been fired to remove the organic vehicle and sinter said glass particles. Still further, the invention is directed to a method of manufacturing a semiconductor device from a structural element composed of a semiconductor having a p-n junction and an insulating film formed on a main surface of the semiconductor comprising the steps of (a) applying onto said insulating film the thick film composition detailed above; and (b) firing said semiconductor, insulating film and thick film composition to form an electrode.
    Type: Application
    Filed: April 14, 2005
    Publication date: October 19, 2006
    Inventors: Alan Carroll, Kenneth Hang
  • Publication number: 20060231804
    Abstract: The present invention is directed to a thick film conductive composition comprising: (a) electrically conductive silver powder; (b) Zn-containing additive wherein the particle size of said zinc-containing additive is in the range of 7 nanometers to less than 100 nanometers; (c) glass frit wherein said glass frit has a softening point in the range of 300 to 600° C.; dispersed in (d) organic medium. The present invention is further directed to a semiconductor device and a method of manufacturing a semiconductor device from a structural element composed of a semiconductor having a p-n junction and an insulating film formed on a main surface of the semiconductor comprising the steps of (a) applying onto said insulating film the thick film composition as describe above; and (b) firing said semiconductor, insulating film and thick film composition to form an electrode.
    Type: Application
    Filed: April 14, 2005
    Publication date: October 19, 2006
    Inventors: Yueli Wang, Richard John Young, Alan Carroll, Kenneth Hang
  • Publication number: 20060231800
    Abstract: The present invention is directed to a thick film conductive composition comprising: (a) electrically conductive silver powder; (b) Mn-containing additive; (c) glass frit wherein said glass frit has a softening point in the range of 300 to 600° C.; dispersed in (d) organic medium. The present invention is further directed to a semiconductor device and a method of manufacturing a semiconductor device from a structural element composed of a semiconductor having a p-n junction and an insulating film formed on a main surface of the semiconductor comprising the steps of (a) applying onto said insulating film the thick film composition as describe above; and (b) firing said semiconductor, insulating film and thick film composition to form an electrode.
    Type: Application
    Filed: April 14, 2005
    Publication date: October 19, 2006
    Inventors: Yueli Wang, Alan Carroll, Kenneth Hang, Richard Young
  • Publication number: 20050051207
    Abstract: This invention is directed to a process for the fabrication of features on a silicon wafer utilizing fibers comprising organic polymer and inorganic material.
    Type: Application
    Filed: October 18, 2004
    Publication date: March 10, 2005
    Inventors: Alan Carroll, Christopher Roach
  • Publication number: 20050051206
    Abstract: This invention is directed to a process for the fabrication of features on a silicon wafer utilizing ribbons comprising organic polymer and inorganic material.
    Type: Application
    Filed: October 18, 2004
    Publication date: March 10, 2005
    Inventors: Alan Carroll, Christopher Roach
  • Publication number: 20050051254
    Abstract: This invention is directed to a process for the fabrication of features on a silicon wafer utilizing ribbons comprising organic polymer and inorganic material.
    Type: Application
    Filed: October 18, 2004
    Publication date: March 10, 2005
    Inventors: Alan Carroll, Christopher Roach