Abstract: A structural connector is provided that limits transmissions of vibrations between connected structural elements in a building or structure. The structural connector is formed from two opposing sheets with a vibration damping material connecting the two.

Abstract: A structural connector is provided that limits transmissions of vibrations between connected structural elements in a building or structure. The structural connector is formed from two opposing sheets with a vibration damping material connecting the two.

Abstract: A structural connector is provided that limits transmissions of vibrations between connected structural elements in a building or structure. The structural connector is formed from two opposing sheets with a vibration damping material connecting the two.

Abstract: In an example embodiment, a mobile wireless device, such as a mobile telephone, is employed to configure a second wireless device such as an access point. The mobile wireless device determines its location and a regulatory domain corresponding to the location. The mobile wireless device configures the second wireless device to operate in the regulatory domain.

Abstract: A backside-illuminated image sensor is disclosed having improved quantum efficiency (QE) in the near infrared wavelengths (NIR: 750-1100 nm) with minimal optical interference fringes produced by multiple reflected rays within the photosensitive Si region of the sensor, which may be a charge-coupled device, a complementary metal oxide sensor or an electron-multiplication sensor. The invention comprises a fringe suppression layer applied to the backside surface of the photosensitive Si region of a detector (Si substrate) whereby the fringe suppression layer functions in concert with the Si substrate to reduce the occurrence of interference fringes in the NIR while maintaining a high QE over a broad range of wavelengths (300-1100 nm). The combination of a fringe suppression layer applied to a Si substrate provides a new class of back illuminated solid state detectors for imaging.

Abstract: In an example embodiment, a mobile wireless device, such as a mobile telephone, is employed to configure a second wireless device such as an access point. The mobile wireless device determines its location and a regulatory domain corresponding to the location. The mobile wireless device configures the second wireless device to operate in the regulatory domain.

Abstract: A backside-illuminated image sensor is disclosed having improved quantum efficiency (QE) in the near infrared wavelengths (NIR: 750-1100 nm) with minimal optical interference fringes produced by multiple reflected rays within the photosensitive Si region of the sensor, which may be a charge-coupled device, a complementary metal oxide sensor or an electron-multiplication sensor. The invention comprises a fringe suppression layer applied to the backside surface of the photosensitive Si region of a detector (Si substrate) whereby the fringe suppression layer functions in concert with the Si substrate to reduce the occurrence of interference fringes in the NIR while maintaining a high QE over a broad range of wavelengths (300-1100 nm). The combination of a fringe suppression layer applied to a Si substrate provides a new class of back illuminated solid state detectors for imaging.

Abstract: Polyethylene terephthalate (PET) produced by direct esterification of a mixture containing ethylene glycol and terephthalic acid in a mole ratio ranging from about 1.05 to about 1.35 dl/g, with at least about 325 parts of an antimony catalyst per million parts of polymer product, can be treated to reduce its acetaldehyde content and acetaldehyde generation rate and increase molecular weight to the levels required for the production of beverage bottles. After heat treatment to produce a crystallinity of at least about 10 percent, the PET can be used in molding after substantially conventional pre-drying and drying steps in air at the molding facility. The invention thus allows beverage bottle grade PET to be produced and prepared for molding without the conventional step of solid state polymerization or stabilization, saving energy, time, production costs and capital investment.