Abstract: Secure inlays for secure documents such as a passport comprising an inlay substrate may have laser-ablated recesses within which a chip module is installed. The inlay substrate may include two layers, and the antenna wire may be between the two layers. A moisture-curing polyurethane hot melt adhesive may be used to laminate a cover layer and the additional inlay substrate layers. The adhesive layer may be used (i) as a sealant, to protect the interconnections, (ii) as a fixing mechanism for the chip module, and (iii) as an adhesive for joining the two substrates (inlay and leadframe substrates) together. Method and apparatus are disclosed.