Abstract: The disclosed computer-implemented method can include reaching, by a chiplet involved in carrying out an operation for a process, a synchronization barrier. The method can additionally include receiving, by the chiplet, dedicated control messages pushed to the chiplet by other chiplets involved in carrying out the operation for the process, wherein the dedicated control messages are pushed over a control network by the other chiplets. The method can also include advancing, by the chiplet, the synchronization barrier in response to receipt of the dedicated control messages. Various other methods, systems, and computer-readable media are also disclosed.

Abstract: An integrated circuit (IC) device includes a first IC die, a second IC die, an interposer die, and a third carrier substrate. The first IC die includes a first carrier substrate, first transistors, and a first power delivery network. The second IC die includes a second carrier substrate, second transistors, and a second power delivery network. A first surface of the first IC die and a first surface of the second IC die are disposed on the IC interposer die. The first power delivery network is between the IC interposer die and the first transistors and the second power delivery network is between the IC interposer die and the second transistors. The third carrier substrate is attached to a second surface of the first IC die and a second surface of the second IC die.

Abstract: Systems and methods for dynamic repartitioning of physical memory address mapping involve relocating data stored at one or more physical memory locations of one or more memory devices to another memory device or mass storage device, repartitioning one or more corresponding physical memory maps to include new mappings between physical memory addresses and physical memory locations of the one or more memory devices, then loading the relocated data back onto the one or more memory devices at physical memory locations determined by the new physical address mapping. Such dynamic repartitioning of the physical memory address mapping does not require a processing system to be rebooted and has various applications in connection with interleaving reconfiguration and error correcting code (ECC) reconfiguration of the processing system.

Abstract: Systems and methods for dynamic repartitioning of physical memory address mapping involve relocating data stored at one or more physical memory locations of one or more memory devices to another memory device or mass storage device, repartitioning one or more corresponding physical memory maps to include new mappings between physical memory addresses and physical memory locations of the one or more memory devices, then loading the relocated data back onto the one or more memory devices at physical memory locations determined by the new physical address mapping. Such dynamic repartitioning of the physical memory address mapping does not require a processing system to be rebooted and has various applications in connection with interleaving reconfiguration and error correcting code (ECC) reconfiguration of the processing system.

Abstract: Disclosed herein are chip packages and electronic devices that utilized an active silicon bridge having a memory controller to interface between a logic device having at least one compute die and one or more memory stacks within a singular chip package. In one example, a chip package is provided that includes a substrate, a logic device, a memory stack, and an active silicon bridge. The logic device is disposed over the substrate. The logic device includes one or more compute dies. The memory stack is disposed over the substrate adjacent the logic device. The active silicon bridge has a first portion and a second portion. The first portion is disposed between the substrate and the logic device, while the second portion is disposed between the substrate and the memory stack.

Abstract: Disclosed herein are chip packages that integrate multiple compute dies through a single interposer die to a memory stack. The interposer die includes memory controller circuitry that allowing multiple compute dies to access the memory stack in an efficient manner.

Abstract: A processing system includes one or more accelerator units (AUs) each having a modular architecture. To this end, each AU includes a connection circuitry and one or more memory stacks disposed on the connection circuitry. Further, each AU includes one or more interposer dies each disposed on the connection circuitry such that each interposer die of the one or more interposer dies is communicatively coupled to a corresponding memory stack of the memory stacks via the connection circuitry. Further, each interposer die of each AU includes circuitry configured to concurrently support two or more types of compute dies.

Abstract: A package device includes a processing device, memory dies and a memory controller. The memory controller die is coupled to the processing device and the memory dies. The memory controller die controls communication from the processing device to the memory dies and to an external memory device. The external memory device is external to the memory dies.

Abstract: A method for hardware management of DMA transfer commands includes accessing, by a first DMA engine, a DMA transfer command and determining a first portion of a data transfer requested by the DMA transfer command. Transfer of a first portion of the data transfer by the first DMA engine is initiated based at least in part on the DMA transfer command. Similarly, a second portion of the data transfer by a second DMA engine is initiated based at least in part on the DMA transfer command. After transferring the first portion and the second portion of the data transfer, an indication is generated that signals completion of the data transfer requested by the DMA transfer command.

Abstract: Integrated circuits and integrated circuit dies include TSVs laid out in symmetrical patterns. Because of the symmetrical arrangement of the TSVs and associated routing patterns, an integrated circuit is able to support operation of multiple similar dies that are placed in different positions in the integrated circuit. This in turn simplifies the design and production of the multiple similar dies, thus reducing development and manufacturing costs for the corresponding integrated circuits.

Abstract: The disclosed computer-implemented method includes partitioning a cache structure into a plurality of cache partitions designated by a plurality of cache types, forwarding a memory request to a cache partition corresponding to a target cache type of the memory request, and performing, using the cache partition, the memory request. Various other methods, systems, and computer-readable media are also disclosed.

Abstract: The disclosed computer-implemented method can include reaching, by a chiplet involved in carrying out an operation for a process, a synchronization barrier. The method can additionally include receiving, by the chiplet, dedicated control messages pushed to the chiplet by other chiplets involved in carrying out the operation for the process, wherein the dedicated control messages are pushed over a control network by the other chiplets. The method can also include advancing, by the chiplet, the synchronization barrier in response to receipt of the dedicated control messages. Various other methods, systems, and computer-readable media are also disclosed.

Abstract: A method for hardware management of DMA transfer commands includes accessing, by a first DMA engine, a DMA transfer command and determining a first portion of a data transfer requested by the DMA transfer command. Transfer of a first portion of the data transfer by the first DMA engine is initiated based at least in part on the DMA transfer command. Similarly, a second portion of the data transfer by a second DMA engine is initiated based at least in part on the DMA transfer command. After transferring the first portion and the second portion of the data transfer, an indication is generated that signals completion of the data transfer requested by the DMA transfer command.

Abstract: A multi-die processor semiconductor package includes a first base integrated circuit (IC) die configured to provide, based at least in part on an indication of a configuration of a first plurality of compute dies 3D stacked on top of the first base IC die, a unique power domain to each of the first plurality of compute dies. In some embodiments, the semiconductor package also includes a second base IC die including a second plurality of compute dies 3D stacked on top of the second base IC die and an interconnect communicably coupling the first base IC die to the second base IC die.

Abstract: A semiconductor package includes a first die, a second die, and an interconnect die coupled to a first plurality of through-die vias in the first die and a second plurality of through-die vias in the second die. The interconnect die provides communications pathways the first die and the second die.

Abstract: Systems and methods for dynamic repartitioning of physical memory address mapping involve relocating data stored at one or more physical memory locations of one or more memory devices to another memory device or mass storage device, repartitioning one or more corresponding physical memory maps to include new mappings between physical memory addresses and physical memory locations of the one or more memory devices, then loading the relocated data back onto the one or more memory devices at physical memory locations determined by the new physical address mapping. Such dynamic repartitioning of the physical memory address mapping does not require a processing system to be rebooted and has various applications in connection with interleaving reconfiguration and error correcting code (ECC) reconfiguration of the processing system.

Abstract: A semiconductor package includes a first die, a second die, and an interconnect die coupled to a first plurality of through-die vias in the first die and a second plurality of through-die vias in the second die. The interconnect die provides communications pathways the first die and the second die.

Abstract: Integrated circuits and integrated circuit dies include TSVs laid out in symmetrical patterns. Because of the symmetrical arrangement of the TSVs and associated routing patterns, an integrated circuit is able to support operation of multiple similar dies that are placed in different positions in the integrated circuit. This in turn simplifies the design and production of the multiple similar dies, thus reducing development and manufacturing costs for the corresponding integrated circuits.

Abstract: Systems and methods for dynamic repartitioning of physical memory address mapping involve relocating data stored at one or more physical memory locations of one or more memory devices to another memory device or mass storage device, repartitioning one or more corresponding physical memory maps to include new mappings between physical memory addresses and physical memory locations of the one or more memory devices, then loading the relocated data back onto the one or more memory devices at physical memory locations determined by the new physical address mapping. Such dynamic repartitioning of the physical memory address mapping does not require a processing system to be rebooted and has various applications in connection with interleaving reconfiguration and error correcting code (ECC) reconfiguration of the processing system.

Abstract: A method for software management of DMA transfer commands includes receiving a DMA transfer command instructing a data transfer by a first processor device. Based at least in part on a determination of runtime system resource availability, a device different from the first processor device is assigned to assist in transfer of at least a first portion of the data transfer. In some embodiments, the DMA transfer command instructs the first processor device to write a copy of data to a third processor device. Software analyzes network bus congestion at a shared communications bus and initiates DMA transfer via a multi-hop communications path to bypass the congested network bus.