Patents by Inventor Alan David Tepe

Alan David Tepe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • INVERTER
    Publication number: 20240063084
    Abstract: A transistor package comprising: a substrate; a first transistor in thermal contact with the substrate, wherein the transistor comprises a gate; the substrate sintered to a heat sink through a sintered layer; an encapsulant that at least partially encapsulates the first transistor; and a Kelvin connection to the transistor gate.
    Type: Application
    Filed: October 31, 2023
    Publication date: February 22, 2024
    Inventors: Wenjun Liu, Robert James Ramm, Alan David Tepe, Colin Kenneth Campbell, Dino Sasaridis
  • Inverter
    Patent number: 11837523
    Abstract: A transistor package comprising: a substrate; a first transistor in thermal contact with the substrate, wherein the transistor comprises a gate; the substrate sintered to a heat sink through a sintered layer; an encapsulant that at least partially encapsulates the first transistor; and a Kelvin connection to the transistor gate.
    Type: Grant
    Filed: October 14, 2022
    Date of Patent: December 5, 2023
    Assignee: Tesla, Inc.
    Inventors: Wenjun Liu, Robert James Ramm, Alan David Tepe, Colin Kenneth Campbell, Dino Sasaridis
  • INVERTER
    Publication number: 20230037192
    Abstract: A transistor package comprising: a substrate; a first transistor in thermal contact with the substrate, wherein the transistor comprises a gate; the substrate sintered to a heat sink through a sintered layer; an encapsulant that at least partially encapsulates the first transistor; and a Kelvin connection to the transistor gate.
    Type: Application
    Filed: October 14, 2022
    Publication date: February 2, 2023
    Applicant: Tesla, Inc.
    Inventors: Wenjun Liu, Robert James Ramm, Alan David Tepe, Colin Kenneth Campbell, Dino Sasaridis
  • Inverter
    Patent number: 11476179
    Abstract: A transistor package comprising: a substrate; a first transistor in thermal contact with the substrate, wherein the transistor comprises a gate; the substrate sintered to a heat sink through a sintered layer; an encapsulant that at least partially encapsulates the first transistor; and a Kelvin connection to the transistor gate.
    Type: Grant
    Filed: October 25, 2016
    Date of Patent: October 18, 2022
    Assignee: Tesla, Inc.
    Inventors: Wenjun Liu, Robert James Ramm, Alan David Tepe, Colin Kenneth Campbell, Dino Sasaridis
  • INVERTER
    Publication number: 20180114740
    Abstract: A transistor package comprising: a substrate; a first transistor in thermal contact with the substrate, wherein the transistor comprises a gate; the substrate sintered to a heat sink through a sintered layer; an encapsulant that at least partially encapsulates the first transistor; and a Kelvin connection to the transistor gate.
    Type: Application
    Filed: October 25, 2016
    Publication date: April 26, 2018
    Applicant: Tesla Motors, Inc.
    Inventors: Wenjun Liu, Robert James Ramm, Alan David Tepe, Colin Kenneth Campbell, Dino Sasaridis