Patents by Inventor Alan Duboust

Alan Duboust has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polishing method that suppresses hillock formation
    Publication number: 20070235345
    Abstract: An ECMP method that suppresses hillock formation on a substrate includes the step of buffing a substrate before a two-step electrochemical mechanical polishing process. The buffing step prevents hillocks from forming around the features of the substrate and does not interfere with the protrusion formation. The buffing step includes contacting the substrate with a polishing pad and rotating the substrate and the polishing pad in opposite directions.
    Type: Application
    Filed: April 7, 2006
    Publication date: October 11, 2007
    Inventors: Tianbao Du, Feng Liu, May Yu, Alan Duboust, Wei-Yung Hsu