Abstract: A two-terminal fuse-antifuse structure comprises a horizontal B-fuse portion and a vertical A-fuse portion disposed between two metallization layers of an integrated circuit device. The two-terminal fuse-antifuse can be programmed with a relatively high current applied across the two terminals to blow the B-fuse, or with a high voltage applied across the two terminals to program the A-fuse. Such a device, connected between two circuit nodes, initially does not provide an electrical connection between the two circuit nodes. It may then be programmed with a relatively high voltage to blow the A-fuse, causing it to conduct between the two circuit nodes. Then, upon application of a relatively high current between the two circuit nodes, the B-fuse will blow, making the device permanently non-conductive.

Abstract: A stackable semiconductor package is described which has external contact points (pins, pads, solder-bumps, etc.), which are arranged in arrays on the top and bottom surfaces of the package. This package also has internal contact points (bond pads) for connection to an integrated circuit die. The external and internal connection points are connected by a programmable interconnection matrix, which may be manufactured separately from the package body and then assembled within the package. The internal contact points can each be selectively connected to the external contact points, and selective connections can also be made linking pairs of the external contact points. Stacks of such packages, containing different dice, may be formed, creating large, tightly-coupled circuit blocks. A presently-preferred embodiment of the programmable package is described in which the package body and programmable matrix are manufactured as a unit.

Abstract: A first passive ESD protection device for an electronic component in a microcircuit includes a fuse element shunting the component to be protected and includes a passive programming path from the outside of the microcircuit to the fuse element. A second passive ESD protection device is deactivatable and reactivatable and includes a first fuse element shunted by a second fuse element in series with a first antifuse element. Shunting the second fuse element with a third fuse element in series with a second antifuse element permits a second deactivation and reactivation to be performed. Additional deactivation/reactivation cycles may be permitted by providing additional series combinations of fuse elements and antifuse elements shunting the preceding fuse element. Combinations of the passive protection device and dual elements comprise ESD protection schemes which may be deactivated and activated multiple times.