Patents by Inventor Alan E. Gickler

Alan E. Gickler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5837191
    Abstract: A lead-free solder pursuant to the invention consists essentially of, in weight %, about 0.75% to about 2% antimony, about 0.05% to about 0.6% copper, about 0.05% to about 0.6% silver, about 0.05% to about 0.6% nickel and balance essentially tin. An even more preferred solder consists essentially of, in weight %, about 0.8% to about 1.8% antimony, about 0.05% to about 0.15% copper, about 0.05% to about 0.15% silver, about 0.05% to about 0.15% nickel and balance essentially tin.
    Type: Grant
    Filed: October 22, 1996
    Date of Patent: November 17, 1998
    Assignee: Johnson Manufacturing Company
    Inventor: Alan E. Gickler
  • Patent number: D303918
    Type: Grant
    Filed: January 12, 1987
    Date of Patent: October 10, 1989
    Assignee: Johnson Manufacturing Company
    Inventor: Alan E. Gickler