Patents by Inventor Alan E. Humphrey
Alan E. Humphrey has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11756811Abstract: A device, mechanism, and methodology for regular and consistent cleaning of the vacuum aperture, nozzle, and contacting surfaces of a pick-and-place apparatus and the pick-up tools of automated or manual semiconductor device and die handling machines are disclosed. The cleaning material may include a cleaning pad layer with one or more intermediate layers that have predetermined characteristics, regular geometrical features, and/or an irregular surface morphology.Type: GrantFiled: July 2, 2019Date of Patent: September 12, 2023Assignee: International Test Solutions, LLCInventors: Alan E. Humphrey, Bret A. Humphrey, Jerry J. Broz, Wayne C. Smith
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Patent number: 11434095Abstract: Novel materials and devices can remove small defects from long rolls of flexible electronics material while they are in continuous motion. The cleaning materials are designed to remove small particles without transferring defects or damaging the flexible electronics. The device generally consists of variable speed, motor-driven cylinders mounted on moveable brackets. The cylinders are capable of matching the speed of the cleaning material such that the cleaning material is always in contact with the web roll to be cleaned. The brackets are capable of rotating so the same material can be used more than once. Another material is used to remove debris from the cleaning material. A similar device consisting of motor-driven cylinders and moveable is used to apply the debris removal film to the cleaning film, allowing the cleaning film to be used multiple times.Type: GrantFiled: February 22, 2019Date of Patent: September 6, 2022Assignee: International Test Solutions, LLCInventors: Mark M. Stark, Alan E. Humphrey
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Patent number: 11318550Abstract: A cleaning material, device, and method for predictably cleaning the capillary tube for a wire bonding machine in which the cleaning pad has a predetermined configuration appropriate for the particular wire bonding machine and a substrate having a defined functionalized surface topology and geometry which can be introduced into the wire bonding machine during the normal wire bonding operations. The cleaning material has a predetermined topography with a plurality of functional 3-dimensional (3D) microstructures that provide performance characteristics which are not possible with a non-functionalized and flat surface.Type: GrantFiled: April 22, 2020Date of Patent: May 3, 2022Assignee: International Test Solutions, LLCInventors: Alan E. Humphrey, Jerry J. Broz, Bret A. Humphrey, Alex S. Poles, Wayne C. Smith, Janakraj Shivlal
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Publication number: 20220093394Abstract: A cleaning material, device, and method for predictably cleaning the contact elements and support hardware of a tester interface, such as a probe card and a test socket, in which the cleaning pad has a predetermined configuration appropriate for the particular pin contact elements and a substrate having a defined functionalized surface topology and geometry which can be introduced into the testing apparatus during the normal testing operations. The cleaning material has a predetermined topography with a plurality of functional 3-dimensional (3D) microstructures that provide performance characteristics which are not possible with a non-functionalized and flat surface.Type: ApplicationFiled: December 2, 2021Publication date: March 24, 2022Applicant: INTERNATIONAL TEST SOLUTIONS, LLCInventors: Alan E. Humphrey, Jerry J. Broz, Bret A. Humphrey, Alex S. Poles
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Patent number: 11211242Abstract: A cleaning material, device, and method for predictably cleaning the contact elements and support hardware of a tester interface, such as a probe card and a test socket, in which the cleaning pad has a predetermined configuration appropriate for the particular pin contact elements and a substrate having a defined functionalized surface topology and geometry which can be introduced into the testing apparatus during the normal testing operations. The cleaning material has a predetermined topography with a plurality of functional 3-dimensional (3D) microstructures that provide performance characteristics which are not possible with a non-functionalized and flat surface.Type: GrantFiled: November 14, 2019Date of Patent: December 28, 2021Assignee: INTERNATIONAL TEST SOLUTIONS, LLCInventors: Alan E. Humphrey, Jerry J. Broz, Bret A. Humphrey, Alex S. Poles
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Patent number: 11155428Abstract: Novel materials and devices can remove small defects from long rolls of flexible electronics material while they are in continuous motion. The cleaning materials are designed to remove small particles without transferring defects or damaging the flexible electronics. The device generally consists of variable speed, motor-driven cylinders mounted on moveable brackets. The cylinders are capable of matching the speed of the cleaning material such that the cleaning material is always in contact with the web roll to be cleaned. The brackets are capable of rotating so the same material can be used more than once. Another material is used to remove debris from the cleaning material. A similar device consisting of motor-driven cylinders and moveable is used to apply the debris removal film to the cleaning film, allowing the cleaning film to be used multiple times.Type: GrantFiled: February 22, 2019Date of Patent: October 26, 2021Assignee: INTERNATIONAL TEST SOLUTIONS, LLCInventors: Mark M. Stark, Alan E. Humphrey
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Patent number: 11035898Abstract: A thermally conductive material, device, and method for predictably maintaining the temperature state and condition of the contact elements and support hardware of a tester interface, such as a probe card, for a testing apparatus, such as automated test equipment (ATE), that has a predetermined configuration applicable for the particular pin contact elements, thermal conditions. The thermally conductive device also has a substrate having a predefined form factor which can be readily introduced into the testing apparatus during normal testing operations. Unlike a patterned substrate that is constrained to specific probe element layouts, the unpatterned surface of the heat conductive device facilitates use with multiple probe card designs within numerous automated test equipment (ATE) tools.Type: GrantFiled: May 11, 2020Date of Patent: June 15, 2021Assignee: International Test Solutions, Inc.Inventors: Alan E. Humphrey, Jerry J. Broz, Wayne C. Smith, Mark M. Stark
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Publication number: 20210146464Abstract: A cleaning material, device, and method for predictably cleaning the capillary tube for a wire bonding machine in which the cleaning pad has a predetermined configuration appropriate for the particular wire bonding machine and a substrate having a defined functionalized surface topology and geometry which can be introduced into the wire bonding machine during the normal wire bonding operations. The cleaning material has a predetermined topography with a plurality of functional 3-dimensional (3D) microstructures that provide performance characteristics which are not possible with a non-functionalized and flat surface.Type: ApplicationFiled: April 22, 2020Publication date: May 20, 2021Inventors: Alan E. Humphrey, Jerry J. Broz, Bret A. Humphrey, Alex S. Poles, Wayne C. Smith, Janakraj Shivlal
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Publication number: 20210151317Abstract: A cleaning material, device, and method for predictably cleaning the contact elements and support hardware of a tester interface, such as a probe card and a test socket, in which the cleaning pad has a predetermined configuration appropriate for the particular pin contact elements and a substrate having a defined functionalized surface topology and geometry which can be introduced into the testing apparatus during the normal testing operations. The cleaning material has a predetermined topography with a plurality of functional 3-dimensional (3D) microstructures that provide performance characteristics which are not possible with a non-functionalized and flat surface.Type: ApplicationFiled: November 14, 2019Publication date: May 20, 2021Inventors: Alan E. Humphrey, Jerry J. Broz, Bret A. Humphrey, Alex S. Poles
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Patent number: 10896828Abstract: A cleaning wafer or substrate for use in cleaning, or in combination with, components of, for example, integrated chip manufacturing apparatus. The cleaning substrate can include a substrate having varying predetermined surface features, such as one or more predetermined adhesive, non-tacky, electrostatic, projection, depression, or other physical sections. The predetermined features can provide for more effective cleaning of the components with which they are used, such as an integrated chip manufacturing apparatus in the place of the integrated chip wafer. The cleaning substrate can be urged into cleaning or other position by vacuum, mechanical, electrostatic, or other forces. The cleaning substrate can adapted to accomplish a variety of functions, including abrading or polishing. The cleaning substrate may be made by a novel method of making, and it may then be used in a novel method of use I combination with chip manufacturing apparatus.Type: GrantFiled: June 8, 2020Date of Patent: January 19, 2021Assignee: International Test Solutions, Inc.Inventors: Alan E. Humphrey, James H. Duvall, Jerry Broz
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Publication number: 20210005499Abstract: A device, mechanism, and methodology for regular and consistent cleaning of the vacuum aperture, nozzle, and contacting surfaces of a pick-and-place apparatus and the pick-up tools of automated or manual semiconductor device and die handling machines are disclosed. The cleaning material may include a cleaning pad layer with one or more intermediate layers that have predetermined characteristics, regular geometrical features, and/or an irregular surface morphology.Type: ApplicationFiled: July 2, 2019Publication date: January 7, 2021Inventors: Alan E. Humphrey, Bret A. Humphrey, Jerry J. Broz, Wayne C. Smith
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Publication number: 20210005484Abstract: A device, mechanism, and methodology for regular and consistent cleaning of the vacuum aperture, nozzle, and contacting surfaces of a pick-and-place apparatus and the pick-up tools of automated or manual semiconductor device and die handling machines are disclosed. The cleaning material may include a cleaning pad layer with one or more intermediate layers that have predetermined characteristics, regular geometrical features, and/or an irregular surface morphology.Type: ApplicationFiled: February 18, 2020Publication date: January 7, 2021Inventors: Alan E. Humphrey, Bret A. Humphrey, Jerry J. Broz, Wayne C. Smith
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Publication number: 20210001378Abstract: A device, mechanism, and methodology for regular and consistent cleaning of the vacuum aperture, nozzle, and contacting surfaces of a pick-and-place apparatus and the pick-up tools of automated or manual semiconductor device and die handling machines are disclosed. The cleaning material may include a cleaning pad layer with one or more intermediate layers that have predetermined characteristics, regular geometrical features, and/or an irregular surface morphology.Type: ApplicationFiled: July 2, 2019Publication date: January 7, 2021Inventors: Alan E. Humphrey, Bret A. Humphrey, Jerry J. Broz, Wayne C. Smith
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Publication number: 20210005483Abstract: A device, mechanism, and methodology for regular and consistent cleaning of the vacuum aperture, nozzle, and contacting surfaces of a pick-and-place apparatus and the pick-up tools of automated or manual semiconductor device and die handling machines are disclosed. The cleaning material may include a cleaning pad layer with one or more intermediate layers that have predetermined characteristics, regular geometrical features, and/or an irregular surface morphology.Type: ApplicationFiled: July 2, 2019Publication date: January 7, 2021Inventors: Alan E. Humphrey, Bret A. Humphrey, Jerry J. Broz, Wayne C. Smith
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Patent number: 10843885Abstract: Novel materials and devices can remove small defects from long rolls of flexible electronics material while they are in continuous motion. The cleaning materials are designed to remove small particles without transferring defects or damaging the flexible electronics. The device generally consists of variable speed, motor-driven cylinders mounted on moveable brackets. The cylinders are capable of matching the speed of the cleaning material such that the cleaning material is always in contact with the web roll to be cleaned. The brackets are capable of rotating so the same material can be used more than once. Another material is used to remove debris from the cleaning material. A similar device consisting of motor-driven cylinders and moveable is used to apply the debris removal film to the cleaning film, allowing the cleaning film to be used multiple times.Type: GrantFiled: February 22, 2019Date of Patent: November 24, 2020Assignee: INTERNATIONAL TEST SOLUTIONS, INC.Inventors: Mark M. Stark, Alan E. Humphrey
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Patent number: 10792713Abstract: A device, mechanism, and methodology for regular and consistent cleaning of the vacuum aperture, nozzle, and contacting surfaces of a pick-and-place apparatus and the pick-up tools of automated or manual semiconductor device and die handling machines are disclosed. The cleaning material may include a cleaning pad layer with one or more intermediate layers that have predetermined characteristics, regular geometrical features, and/or an irregular surface morphology.Type: GrantFiled: July 2, 2019Date of Patent: October 6, 2020Assignee: International Test Solutions, Inc.Inventors: Alan E. Humphrey, Bret A. Humphrey, Jerry J. Broz, Wayne C. Smith
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Publication number: 20200303217Abstract: A cleaning wafer or substrate for use in cleaning, or in combination with, components of, for example, integrated chip manufacturing apparatus. The cleaning substrate can include a substrate having varying predetermined surface features, such as one or more predetermined adhesive, non-tacky, electrostatic, projection, depression, or other physical sections. The predetermined features can provide for more effective cleaning of the components with which they are used, such as an integrated chip manufacturing apparatus in the place of the integrated chip wafer. The cleaning substrate can be urged into cleaning or other position by vacuum, mechanical, electrostatic, or other forces. The cleaning substrate can adapted to accomplish a variety of functions, including abrading or polishing. The cleaning substrate may be made by a novel method of making, and it may then be used in a novel method of use I combination with chip manufacturing apparatus.Type: ApplicationFiled: June 8, 2020Publication date: September 24, 2020Applicant: International Test Solutions, Inc.Inventors: Alan E. Humphrey, James H. Duvall, Jerry Broz
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Patent number: 10741420Abstract: A cleaning wafer or substrate for use in cleaning, or in combination with, components of, for example, integrated chip manufacturing apparatus. The cleaning substrate can include a substrate having varying predetermined surface features, such as one or more predetermined adhesive, non-tacky, electrostatic, projection, depression, or other physical sections. The predetermined features can provide for more effective cleaning of the components with which they are used, such as an integrated chip manufacturing apparatus in the place of the integrated chip wafer. The cleaning substrate can be urged into cleaning or other position by vacuum, mechanical, electrostatic, or other forces. The cleaning substrate can adapted to accomplish a variety of functions, including abrading or polishing. The cleaning substrate may be made by a novel method of making, and it may then be used in a novel method of use I combination with chip manufacturing apparatus.Type: GrantFiled: September 20, 2018Date of Patent: August 11, 2020Assignee: International Test Solutions, Inc.Inventors: Alan E. Humphrey, James H. Duvall, Jerry Broz
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Patent number: 10717618Abstract: Novel materials and devices can remove small defects from long rolls of flexible electronics material while they are in continuous motion. The cleaning materials are designed to remove small particles without transferring defects or damaging the flexible electronics. The device generally consists of variable speed, motor-driven cylinders mounted on movable brackets. The cylinders are capable of matching the speed of the cleaning material such that the cleaning material is always in contact with the web roll to be cleaned. The brackets are capable of rotating so the same material can be used more than once. Another material is used to remove debris from the cleaning material. A similar device consisting of motor-driven cylinders and movable is used to apply the debris removal film to the cleaning film, allowing the cleaning film to be used multiple times.Type: GrantFiled: February 22, 2019Date of Patent: July 21, 2020Assignee: INTERNATIONAL TEST SOLUTIONS, INC.Inventors: Mark M. Stark, Alan E. Humphrey
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APPARATUSES, DEVICE, AND METHODS FOR CLEANING TESTER INTERFACE CONTACT ELEMENTS AND SUPPORT HARDWARE
Publication number: 20200200800Abstract: A medium for predictably cleaning the contact elements and support hardware of a tester interface, such as a probe card and a test socket, while it is still in manual, semi-automated, and automated handling device and the electrical test equipment is disclosed so that the functionality and performance of the individual die or IC package may be electrically evaluated.Type: ApplicationFiled: December 20, 2018Publication date: June 25, 2020Inventors: Jerry J. Broz, Bret A. Humphrey, Alan E. Humphrey, James H. Duvall