Abstract: In one embodiment, a stack device comprising a film interposer of a polyimide film material, for example, is assembled. In accordance with one embodiment of the present description, a front side of the film interposer is attached to a first element of the stack device, which may be an integrated circuit package, an integrated circuit die, a substrate such as a printed circuit board, or other structure used to fabricate electronic devices. In addition, a back side of the film interposer is attached to a second element which like the first element, may be an integrated circuit package, an integrated circuit die, a substrate such as a printed circuit board, or other structure used to fabricate electronic devices. Other aspects are described.

Abstract: In one embodiment, a stack device comprising a film interposer of a polyimide film material, for example, is assembled. In accordance with one embodiment of the present description, a front side of the film interposer is attached to a first element of the stack device, which may be an integrated circuit package, an integrated circuit die, a substrate such as a printed circuit board, or other structure used to fabricate electronic devices. In addition, a back side of the film interposer is attached to a second element which like the first element, may be an integrated circuit package, an integrated circuit die, a substrate such as a printed circuit board, or other structure used to fabricate electronic devices. Other aspects are described.

Abstract: In one embodiment, a stack device comprising a film interposer of a polyimide film material, for example, is assembled. In accordance with one embodiment of the present description, a front side of the film interposer is attached to a first element of the stack device, which may be an integrated circuit package, an integrated circuit die, a substrate such as a printed circuit board, or other structure used to fabricate electronic devices. In addition, a back side of the film interposer is attached to a second element which like the first element, may be an integrated circuit package, an integrated circuit die, a substrate such as a printed circuit board, or other structure used to fabricate electronic devices. Other aspects are described.

Abstract: A microelectronic substrate and a microelectronic package including the substrate and a die bonded thereto. The substrate includes a substrate panel having a die-side surface including a die-attach region; a system of interconnects extending through the substrate panel and adapted to allow a connection of the substrate to external circuitry; and a plurality of solder bumps including: die-attach solder bumps electrically coupled to the system of interconnects and disposed in the die-attach region; and barrier solder bumps isolated from the system of interconnects, the barrier solder bumps being disposed outside of the die-attach region and being adapted to substantially limit a flow of underfill away from the die-attach region.

Abstract: Systems and methods are described that provide a new type of application load unit for use in the secure loading of applications and/or data onto integrated circuit cards or smart cards. Plaintext key transformation units can be created for each of a plurality of smart cards that are to be loaded with a desired or selected application. A plaintext key transformation unit may be individually encrypted using the public keys associated with target smart cards. An application provider can create one or more application load unit using known means and can then create one or more additional plaintext key transformation unit, one for each target smart card using corresponding public keys which can be obtained taken from a database of card public keys.

Abstract: A microelectronic substrate and a microelectronic package including the substrate and a die bonded thereto. The substrate includes a substrate panel having a die-side surface including a die-attach region; a system of interconnects extending through the substrate panel and adapted to allow a connection of the substrate to external circuitry; and a plurality of solder bumps including: die-attach solder bumps electrically coupled to the system of interconnects and disposed in the die-attach region; and barrier solder bumps isolated from the system of interconnects, the barrier solder bumps being disposed outside of the die-attach region and being adapted to substantially limit a flow of underfill away from the die-attach region.

Abstract: A mechanical thermo-voltaic solar power system (MeTSoPoS) that uses a mechanical generator, instead of the photovoltaic panel commonly in use today, is disclosed. The system is comprised of three major subsystems: (1) a light collector array, (2) a mechanical thermo-voltaic generator, and (3) a storage and retrieval system. At the center of the system is the light collection array comprised of solar collector elements. These collector elements are connected to optical conduits (fiber optic cables) that carry the light energy to a mechanical generator. An automatic aiming system is used to align the collector elements directly at a light source for maximum light output. Each light collector element is comprised of a set of lenses that focus a larger area of light down to a point small enough to inject into an optical conduit. The optical conduit is then used to carry the light from each collector element to the generator.

Abstract: An optical data storage system directs a reference beam and a data beam to a storage material having an inhomogeneous linewidth. The data beam is modulated to contain data to be stored in the storage material. The reference beam and the data beam illuminate storage cells of the storage material, causing data to be stored. The reference beam and the data beam spatially scan the cells and are frequency swept during their respective spatial scans. Data is retrieved from the cells by illuminating the storage material with the reference beam to produce a reconstructed data beam. In an embodiment, the reference beam and the data beam overlap and illuminate the storage cells simultaneously. The reconstructed data beam is detected as a heterodyne signal produced by mixing the reconstructed data beam and the reference beam in a detector.

Abstract: Multiple Bragg gratings are fabricated in a single planar lightwave circuit platform. The gratings have nominally identical grating spacing but different center wavelengths, which are produced using controlled photolithographic processes and/or controlled doping to control the effective refractive index of the gratings. The gratings may be spaced closer together than the height of the UV light pattern used to write the gratings.

Abstract: An athermal package for fiber photonic devices includes three portions of at least three materials, each having a coefficient of thermal expansion that is different from the other two. In contrast, a conventional athermal packages typically has only two materials. In a typical application, an optical fiber containing a photonic device is attached to the athermal package. The three materials of the athermal package are selected and the three portions as sized to optimize a thermal response of the package to that of the optical fiber.

Abstract: A mounting platform provides support and packaging for one or more fiber Bragg gratings and electronic circuitry (e.g., heaters, coolers, piezoelectric strain providers, temperature and strain sensors, feedback circuitry, control loops), which may be printed on or on the mounting platform, embedded in the mounting platform, or may be an “off-board” chip solution (e.g., the electronic circuitry may be attached to the mounting platform, but not formed on or defined on the mounting platform). The fiber Bragg gratings are held in close proximity to the electronic circuitry, which applies local and global temperature and/or strain variations to the fiber Bragg gratings to, for example, stabilize and/or tune spectral properties of the fiber Bragg gratings so that spatial variations in the fiber Bragg gratings that result from processing and manufacturing fluctuations and tolerances can be compensated for.

Abstract: Optical communication systems include a central station that encodes data transmitted to multiplexing (mux) stations or user stations. The central station also decodes data received from the mux stations or user stations. Encoding and decoding are performed using codes, such as composite codes, that designate sources and destinations for data. The mux stations, user stations, and the central station have address encoders and decoders that use, for example, fiber Bragg gratings to encode or decode optical signals according to a code such as a composite code derived by combining codes from one or more sets of codes. A passive optical network comprises one or more levels of mux stations that use such address decoders and encoders to receive, decode, and encode data for transmission toward a central station or a user station.

Abstract: Multiple Bragg gratings are fabricated in a single planar lightwave circuit platform. The gratings have nominally identical grating spacing but different center wavelengths, which are produced using controlled photolithographic processes and/or controlled doping to control the effective refractive index of the gratings. The gratings may be spaced closer together than the height of the UV light pattern used to write the gratings.

Abstract: A mounting platform provides support and packaging for one or more fiber Bragg gratings and electronic circuitry (e.g., heaters, coolers, piezoelectric strain providers, temperature and strain sensors, feedback circuitry, control loops), which may be printed on or on the mounting platform, embedded in the mounting platform, or may be an “off-board” chip solution (e.g., the electronic circuitry may be attached to the mounting platform, but not formed on or defined on the mounting platform). The fiber Bragg gratings are held in close proximity to the electronic circuitry, which applies local and global temperature and/or strain variations to the fiber Bragg gratings to, for example, stabilize and/or tune spectral properties of the fiber Bragg gratings so that spatial variations in the fiber Bragg gratings that result from processing and manufacturing fluctuations and tolerances can be compensated for.

Abstract: An optical data storage system directs a reference beam and a data beam to a storage material having an inhomogeneous linewidth. The data beam is modulated to contain data to be stored in the storage material. The reference beam and the data beam illuminate storage cells of the storage material, causing data to be stored. The reference beam and the data beam spatially scan the cells and are frequency swept during their respective spatial scans. Data is retrieved from the cells by illuminating the storage material with the reference beam to produce a reconstructed data beam. In an embodiment, the reference beam and the data beam overlap and illuminate the storage cells simultaneously. The reconstructed data beam is detected as a heterodyne signal produced by mixing the reconstructed data beam and the reference beam in a detector.

Abstract: Communication systems and methods are disclosed that route, detect, and decode encoded optical signals at network nodes based on channel codes assigned to the network nodes. In an example communication system, a network hub includes a channel selector that encodes an optical signal with a channel code assigned to one or more network nodes. The channel selector is configured to encode based on a channel selection signal provided to the channel selector and can include one or more fiber Bragg coders. Code-switched communication systems can include one or more nodes configured in ring, tree, or bus architectures.

Abstract: An athermal package for fiber photonic devices includes a ferrule to attach the optical fiber to the package. The ferrule has an opening to receive the optical fiber. The ferule is collapsed to attach the optical fiber to the athermal package. Alternatively, the athermal package uses adhesive bonds disposed in pockets of the package. The pockets have a narrow end and a wide end, with the narrow ends facing each other. The adhesive bonds are disposed in the pockets in contact the narrow ends of the pockets but not with the wide ends. The narrow ends physically confine the adhesive bonds so that if the bonds expand or contract due to environmental conditions (or the curing process), the adhesive either expands or contracts near the wide ends of the pockets. This allows the strain on the optical fiber segment between the bonds to remain substantially constant.

Abstract: An athermal package for fiber photonic devices includes at least two bonding regions at each end of the optical fiber containing the photonic device. At each end of the optical fiber, the bonding region nearest the photonic device (i.e., the inner bonding region) has a width that is less than that of the other bonding region (i.e., the outer bonding region). The smaller widths of the inner bonding regions allow for relatively precise control of the positions on the optical fiber that the inner bonding regions are attached. The larger widths of the outer bonding regions help provide reliable attachments.

Abstract: An athermal package for fiber photonic devices includes three portions of at least three materials, each having a coefficient of thermal expansion that is different from the other two. In contrast, a conventional athermal packages typically has only two materials. In a typical application, an optical fiber containing a photonic device is attached to the athermal package. The three materials of the athermal package are selected and the three portions as sized to optimize a thermal response of the package to that of the optical fiber.

Abstract: Code-multiplexed communication systems, apparatus, and methods include coders that encode and decode data streams with synchronous, substantially orthogonal codes. Code-multiplexed communications systems encode data signals with such codes to control levels of decoding artifacts such as cross-talk at times or time intervals in which data is recovered. Some systems are based on synchronous, orthogonal codes that are obtained from complex orthogonal vectors. In an example, a three-level temporal-phase code that includes nine code chips and encodes and decodes data signals is a seven-channel communication system.