Abstract: Provided herein are debondable adhesive compositions comprising (A) one or more bis-maleimide (BMI), nadimide or itaconimide oligomer(s), (B) at least one ethylenically unsaturated co-monomer (e.g. co-monomers selected from the group consisting of acrylates, methacrylates, vinyl ethers, vinyl esters, styrenic compounds, allyl compounds, polybutadienes, cinnamates, crotonates, and mixtures of any two or more thereof), and (C) a photoinitiator. In another embodiment, the present invention is directed to an assembly of a substrate and a carrier for the substrate in which the debondable adhesive composition temporarily bonds the substrates, and a method for fabricating the assembly. The debondable adhesive compositions maintain their adhesion at temperatures of 300° C. or greater, are easily and cleanly debondable at ambient conditions, permit temporary bonding at high processing conditions, and do not compromise handling or performance of the substrates.

Abstract: The present invention is directed to methods of measuring the degree of cure or solidification of a composition. Desirably, such methods are quantitative and ascertain the degree of cure or solidification in a non-destructive manner such that they are adaptable for on-line, real-time monitoring.

Abstract: The present invention relates to curable compositions which are capable of safely and sufficiently bonding components of electrical devices. In particular, the invention relates to two-part, halogen-free curable compositions which are capable of rapidly curing at room temperatures as well as at elevated temperatures.

Abstract: The present invention relates to curable compositions which are capable of safely and sufficiently bonding components of electrical devices. In particular, the invention relates to two-part, halogen-free curable compositions which are capable of rapidly curing at room temperatures as well as at elevated temperatures.

Abstract: A curable composition having enhanced cure speed which includes a curable component, a cure system and an additive for enhancing cure speed. The additive includes an alkali metal halide salt and the reaction product of: (a) a polyfunctional isocyanate and a member selected from the group consisting of an hydroxy and an amine; or (b) a phosgene or phosgene derivative, and a compound having 3 to 7 polyethylene glycol ether units terminated at one end with an ether group and at the other end with a reactive functional group selected from the group consisting of an amine, an amide, a thiol and an alcohol; or (c) a monohydroxy compound, a diisocyanate and a polyamine. Alternatively, in place of or in combination with the cure speed enhancing additive, an aromatic substituted (meth)acryl functionalized component may be incorporated into the curable component to achieve enhanced cure speed.

Abstract: Curable (meth)acrylate adhesives are formulated with aliphatic urethane (meth)acrylate resins. The resins are urethane (meth)acrylate capped polyols wherein the urethane acrylate capping is derived from isophorone diisocyanate and a hydroxyalkyl (meth)acrylate and the polyol is an oligomeric aliphatic diol or triol having a number average molecular weight of from about 1500 to about 3500. The hydroxyalkyl (meth)acrylate may be hydroxy ethyl acrylate. The polyol may be a member selected from the group consisting of polyoxypropylene triols, polyTHF diols, polycaprolactone/polyTHF block copolymers, and polycaprolactone diols. The adhesives give good adhesion to common DVD substrate materials, and display excellent corrosion resistance in dissimilar metal bonding applications.

Abstract: A curable composition and method for making hollow shell molds, such as those employed to make hearing aids. The curable composition includes a (meth)acryl functionalized curable component, a cure system, a pigment composition, and a dispersion stabilizing additive. The pigment composition includes at least one pigment disbursed within the curable composition. The dispersion additive maintains the pigment in a disbursed form prior to cure. The dispersion additive includes an alkali metal cation and a reaction product.

Abstract: Cyanoacrylate compositions which employ fumed silicas treated with polydimethylsiloxane or trialkoxyalkyl silane are stable and exhibit an unexpectedly high thixotropic ratio. Such compositions are useful in adhesive applications or, when stabilized so as to prevent polymerization in contact with moisture, in latent fingerprint developing applications.

Abstract: Cyanoacrylate compositions which employ fumed silicas treated with polydimethylsiloxane or trialkoxyalkylsilane are stable and exhibit an unexpectedly high thixotropic ratio. Such compositions are useful in adhesive applications or, when stabilized so as to prevent polymerization in contact with moisture, in latent fingerprint developing applications.

Abstract: Cyanoacrylate compositions which employ fumed silicas treated with polydimethylsiloxane or trialkoxyalkylsilane are stable and exhibit an unexpectedly high thixotropic ratio. Such compositions are useful in adhesive applications or, when stabilized so as to prevent polymerizaton in contact with moisture, in latent fingerprint developing applications.