Patents by Inventor Alan Elliot

Alan Elliot has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus for in situ deposition of multilayer structures via atomic layer deposition and ultra-high vacuum physical or chemical vapor deposition
    Patent number: 9994956
    Abstract: An apparatus for in situ fabrication of multilayer heterostructures is provided comprising a first vacuum chamber adapted for atomic layer deposition and comprising a first stage docking assembly configured to dock a detachable stage configured to support a substrate; a second vacuum chamber adapted for ultra-high vacuum physical or chemical vapor deposition and comprising a second stage docking assembly configured to dock the detachable stage; a load lock vacuum chamber between the first and second vacuum chambers and comprising a third stage docking assembly configured to dock the detachable stage, the load lock vacuum chamber coupled to the first vacuum chamber via a first shared valve and coupled to the second vacuum chamber via a second shared valve; and a substrate transport vacuum chamber comprising a substrate transfer device, the substrate transfer device configured to detachably couple to the detachable stage and to transfer the substrate supported by the detachable stage in situ between the first v
    Type: Grant
    Filed: August 11, 2014
    Date of Patent: June 12, 2018
    Assignee: University of Kansas
    Inventors: Judy Z. Wu, Rongtao Lu, Alan Elliot, Allen Hase
  • APPARATUS FOR IN SITU DEPOSITION OF MULTILAYER STRUCTURES VIA ATOMIC LAYER DEPOSITION AND ULTRA-HIGH VACUUM PHYSICAL OR CHEMICAL VAPOR DEPOSITION
    Publication number: 20160040288
    Abstract: An apparatus for in situ fabrication of multilayer heterostructures is provided comprising a first vacuum chamber adapted for atomic layer deposition and comprising a first stage docking assembly configured to dock a detachable stage configured to support a substrate; a second vacuum chamber adapted for ultra-high vacuum physical or chemical vapor deposition and comprising a second stage docking assembly configured to dock the detachable stage; a load lock vacuum chamber between the first and second vacuum chambers and comprising a third stage docking assembly configured to dock the detachable stage, the load lock vacuum chamber coupled to the first vacuum chamber via a first shared valve and coupled to the second vacuum chamber via a second shared valve; and a substrate transport vacuum chamber comprising a substrate transfer device, the substrate transfer device configured to detachably couple to the detachable stage and to transfer the substrate supported by the detachable stage in situ between the first v
    Type: Application
    Filed: August 11, 2014
    Publication date: February 11, 2016
    Applicant: University of Kansas
    Inventors: Judy Z. Wu, Rongtao Lu, Alan Elliot, Allen Hase