Abstract: A fixed beam high gain antenna for generating high gain for satellite communication ground terminals includes a multi-layer PCB having a top surface forming a rear surface of the antenna and a bottom layer forming a front surface of the antenna; an antenna array including a plurality of antenna patches on the front surface of the antenna and a plurality of application-specific integrated circuits (ASICs) on the rear surface of the antenna; wherein the antenna array comprises at least one antenna unit cell each including one of the plurality of ASICs in connection with a corresponding plurality of the plurality of antenna patches; wherein each one of the plurality of ASICs is centrally positioned and surrounded by the corresponding plurality of antenna patches; and wherein a reduced length of the connection between each of the plurality of ASICs and the corresponding plurality of antenna patches minimizes RF transmission loss.

Abstract: A compensated via structure is utilized in a multi-layer printed circuit board (PCB) stackup to improve the radio frequency (RF) transmission performance of the PCB. The compensated via structure includes a compensating structure and a central via surrounded by multiple grounding posts, wherein both ends of the central via are connected to the input and the output transmission lines through pads. The compensating structure is within a ground plane located in between of the two layers within which the input and output transmission lines are. The increased coupling between the central via and the grounding posts and between the compensating structure and the ground plane results in reductions in both return and insertion losses and contributes to the improved RF transmission performance.

Abstract: A heatsink for heat dissipation amongst an active electronically steered array (AESA) on a printed circuit board (PCB) includes a metal plate having a first side and a second side; a plurality of integrally formed pockets on the first side of the metal plate each being sized and configured for congruent receipt of a corresponding one of a plurality of functional blocks of the AESA on the PCB; a plurality of waveguide manifolds on the second side of the metal plate including a plurality of holes that launch a wave transmission and a plurality of slots that guide the direction of the wave transmission; and wherein the metal plate prevents localized overheating amongst the AESA by positioning the metal plate on the PCB wherein the plurality of integrally formed pockets and the plurality of holes and the plurality of slots of the plurality of waveguide manifolds facilitate heat dissipation.

Abstract: A heatsink for heat dissipation amongst an active electronically steered array (AESA) on a printed circuit board (PCB) includes a metal plate having a first side and a second side; a plurality of integrally formed pockets on the first side of the metal plate each being sized and configured for congruent receipt of a corresponding one of a plurality of functional blocks of the AESA on the PCB; a plurality of waveguide manifolds on the second side of the metal plate including a plurality of holes that launch waveguide and a plurality of slots that guide the direction of the wave transmission; and wherein the metal plate prevents localized overheating amongst the AESA by positioning the metal plate on the PCB wherein the plurality of integrally formed pockets and the plurality of holes and the plurality of slots of the plurality of waveguide manifolds facilitate heat dissipation.

Abstract: A fixed beam high gain antenna for generating high gain for satellite communication ground terminals includes a multi-layer PCB having a top surface forming a rear surface of the antenna and a bottom layer forming a front surface of the antenna; an antenna array including a plurality of antenna patches on the front surface of the antenna and a plurality of application-specific integrated circuits (ASICs) on the rear surface of the antenna; wherein the antenna array comprises at least one antenna unit cell each including one of the plurality of ASICs in connection with a corresponding plurality of the plurality of antenna patches; wherein each one of the plurality of ASICs is centrally positioned and surrounded by the corresponding plurality of antenna patches; and wherein a reduced length of the connection between each of the plurality of ASICs and the corresponding plurality of antenna patches minimizes RF transmission loss.

Abstract: A compensated via structure is utilized in a multi-layer printed circuit board (PCB) stackup to improve the radio frequency (RF) transmission performance of the PCB. The compensated via structure includes a compensating structure and a central via surrounded by multiple grounding posts, wherein both ends of the central via are connected to the input and the output transmission lines through pads. The compensating structure is within a ground plane located in between of the two layers within which the input and output transmission lines are. The increased coupling between the central via and the grounding posts and between the compensating structure and the ground plane results in reductions in both return and insertion losses and contributes to the improved RF transmission performance.

Abstract: A sputter deposition method and system for producing a metal oxide film, especially a dielectric standoff layer of a thin film/nanolayer capacitor. A noble gas, such as argon, is used to sputter metal ions from a metal target, such as niobium, in the presence of a partial pressure of oxygen in a vacuum chamber. And an oxygen-to-noble gas flow ratio entering the vacuum chamber is controlled by a flow controller to be within an operating range defined between a predetermined lower limit (such as 30% O2/Ar for niobium oxide) associated with a minimum transparency/stoichiometric threshold and a predetermined upper limit (such as 80% O2/Ar for niobium oxide) associated with a maximum roughness/porosity threshold, so that a reaction between the sputtered metal ions and the oxygen produces a substantially transparent metal oxide film with a substantially smooth non-porous surface.

Abstract: A method of constructing a flexible panel display using gold as a conductive element and a matrix of carbon fibers as emitters is presented. The invention provides a novel defined pixel width of three emitter fibers per cell wherein each cell is positioned within three emulsion layers of suspended nano-crystals stack positioned vertically atop one-another. Each of these respective layers is excited by a single carbon fiber. In the preferred embodiment, fiber length ends from each cell are positioned at the mid-point of each respective polymer layer thickness and produce one of red, green, or blue colors required to complete the image formation.