Patents by Inventor Alan Frederick Becknell

Alan Frederick Becknell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8580076
    Abstract: A plasma apparatus, various components of the plasma apparatus, and an oxygen free and nitrogen free processes for effectively removing photoresist material and post etch residues from a substrate with a carbon and/or hydrogen containing low k dielectric layer(s).
    Type: Grant
    Filed: May 22, 2003
    Date of Patent: November 12, 2013
    Assignee: LAM Research Corporation
    Inventors: Alan Frederick Becknell, Thomas James Buckley, David Ferris, Richard E. Pingree, Jr., Palanikumaran Sakthivel, Aseem Kumar Srivastava, Carlo Waldfried
  • Publication number: 20040238123
    Abstract: A plasma apparatus, various components of the plasma apparatus, and an oxygen free and nitrogen free processes for effectively removing photoresist material and post etch residues from a substrate with a carbon and/or hydrogen containing low k dielectric layer(s).
    Type: Application
    Filed: May 22, 2003
    Publication date: December 2, 2004
    Applicant: AXCELIS TECHNOLOGIES, INC.
    Inventors: Alan Frederick Becknell, Thomas James Buckley, David Ferris, Richard E. Pingree, Palanikumaran Sakthivel, Aseem Kumar Srivastava, Carlo Waldfried
  • Patent number: 6524936
    Abstract: A process for stripping a photoresist layer after exposure to an ion implantation process. The process includes subjecting a substrate having the ion implanted photoresist layer thereon to a UV radiation exposure and subsequently removing the ion implanted photoresist by conventional stripping processes.
    Type: Grant
    Filed: December 22, 2000
    Date of Patent: February 25, 2003
    Assignee: Axcelis Technologies, Inc.
    Inventors: John Scott Hallock, Alan Frederick Becknell, Palani Sakthivel
  • Publication number: 20020151156
    Abstract: A process for stripping a photoresist layer after exposure to an ion implantation process. The process includes subjecting a substrate having the ion implanted photoresist layer thereon to a UV radiation exposure and subsequently removing the ion implanted photoresist by conventional stripping processes.
    Type: Application
    Filed: December 22, 2000
    Publication date: October 17, 2002
    Inventors: John Scott Hallock, Alan Frederick Becknell, Palani Sakthivel
  • Patent number: 5981147
    Abstract: Disclosed are waterborne, stable photoresist compositions and methods of their preparation and use. The compositions are characterized by increased shear and storage stability. The photoresist composition comprises an aqueous emulsion of a 22% or less neutralized carboxylated resin and non-ionic surfactant containing poly(ethylene-oxide) segments, photopolymerizable monomer and photoinitiator. Neutralization is accomplished using either an organic or an inorganic base or mixtures thereof. The photoresist compositions are useful to selectively coat and protect surfaces subjected to corrosive environments, e.g., etchant processes, in the production of circuit traces for electronic circuit boards.
    Type: Grant
    Filed: April 8, 1997
    Date of Patent: November 9, 1999
    Assignee: Mac Dermid Incorporated
    Inventors: John Scott Hallock, Alan Frederick Becknell, Cynthia Louise Ebner, Daniel Joseph Hart