Abstract: A process and apparatus for configuring one or more integrated circuits within a device in a manufacturing process is described. In an exemplary process, a device is manufactured by assembling a chip onto a board such as a printed circuit substrate and the chip is fused from power routed across the board to the chip. The power source for the fusing can be generated from the internal power supply on the board or received on a test point on the board itself or a connection interface (e.g. a USB interface) coupled to the board. In an exemplary apparatus, a device comprises a chip with a plurality of fuses that are used to configure the device and a board coupled to the chip, with the board capable of routing power from the board to the chip and the power is used to blow one or more of the plurality of fuses.