Abstract: The present invention provides a sealed-cavity miscrostructure and an associated method for manufacturing the microstructure. Specifically, the microstructure of the present invention includes first and second wafers that are positioned relative to one another so as to form a cavity between the wafers. The microstructure further includes a seal between the first and second wafers and surrounding the cavity to create a pressure seal for the cavity. This seal allows the cavity of the microstructure to be maintained at a predetermined pressure different from that of the atmosphere outside the cavity. Importantly, the microstructure of the present invention further includes a structrual bond between the first and second wafers that structurally intergrates the first and second wafers. The structural bond renders the microstructure more rugged such that the microstructure can withstand expansion, vibrational, and shock stresses experienced by the microstructure during subsequent manufacturing and use.

Abstract: A sealed cavity microstructure and an associated fabrication method are provided that incorporate both a tight pressure seal and a rugged structural bond. A rugged microstructure device incorporating a pressure-maintained cavity may thereby be fabricated. A vacuum cavity microbolometer is also provided that is fabricated using the associated method. The sealed cavity microstructure and the vacuum cavity microbolometer are thereby adapted to low-cost wafer-scale batch processing.

Abstract: A sealed-cavity microstructure and an associated method for manufacturing the microstructure. Specifically, the microstructure includes first and second wafers that are positioned relative to one another so as to form a cavity between the wafers. The microstructure further includes a seal between the first and second wafers and surrounding the cavity to create a pressure seal for the cavity. This seal allows the cavity of the microstructure to be maintained at a predetermined pressure different from that of the atmosphere outside the cavity. Importantly, the microstructure further includes a structural bond between the first and second wafers that structurally integrates the first and second wafers. The structural bond renders the microstructure more rugged such that the microstructure can withstand expansion, vibrational, and shock stresses experienced by the microstructure during subsequent manufacturing and use.