Abstract: This invention is directed to a process of coating metal in a trivalent chromium conversion-electrolyte coating wherein the metal anode or cathode is subjected to a current density ranging up to about 3.0 amperes per square foot for a period ranging up to 60 minutes.

Abstract: This invention is directed to a process of coating metal in a trivalent chromium conversion-electrolyte coating wherein the metal anode or cathode is subjected to a current density ranging up to about 3.0 amperes per square foot for a period ranging up to 60 minutes.

Abstract: An aluminum anode alloy consisting essentially of an aluminum base and effective amounts of tin and indium. The aluminum alloy is useful particularly as a sacrificial metallic coating, as a protective aluminum anode, and as pigment in polymeric and other organic coatings.

Abstract: The aluminum anode alloy consists essentially of an aluminum base and effective amounts of tin and indium. The aluminum alloy is useful as a sacrificial metallic coating, as a protective aluminum anode, and as a pigment in polymeric coatings.

Abstract: A thermally conductive adhesive composition includes a powder of a high melting point metal or metal alloy, a powder of a low melting point metal or metal alloy, and a polymerizable fluxing polymer matrix composition having a polyepoxide polymer resin and a low-melting solid or liquid acid-anhydride and a polymer diluent or diluents with carbon carbon double bonds and/or functional hydroxyl groups. The ratio by weight of the low melting point powder to high melting point powder ranges from about 0.50 to about 0.80, and may range from about 0.64 to about 0.75, and may be 0.665. Heretofore unpredicted substantially higher thermal conductivity improvements in performance have been found using these ratios of low melting point powder to high melting point powder.

Abstract: A thermally conductive adhesive composition includes a powder of a high melting point metal or metal alloy, a powder of a low melting point metal or metal alloy, and a polymerizable fluxing polymer matrix composition having a polyepoxide polymer resin and a low-melting solid or liquid acid-anhydride and a polymer diluent or diluents with carbon carbon double bonds and/or functional hydroxyl groups. The ratio by weight of the low melting point powder to high melting point powder ranges from about 0.50 to about 0.80, and may range from about 0.64 to about 0.75, and may be 0.665. Heretofore unpredicted substantially higher thermal conductivity improvements in performance have been found using these ratios of low melting point powder to high melting point powder.

Abstract: Thermally conductive, sinterable, adhesive compositions, free of fugitive solvents, that include a powder of a relatively high melting point metal or metal alloy, a powder of a relatively low melting point metal or metal alloy powder and a thermally curable adhesive flux composition that comprises (i) a polymerizable fluxing agent; (ii) an inerting agent to react with the fluxing agent at elevated temperature, rendering it inert. The fluxing agent preferably comprises a compound with formula RCOOH, wherein R comprises a moiety having one or more polymerizable carbon-carbon double bonds. Optionally, the inventive compositions also include (a) a diluent that is capable of polymerizing with the fluxing agent's polymerizable carbon-carbon double bonds; (b) free radical initiators; (c) a curable resin; and (d) crosslinking agents and accelerators.

Abstract: Compositions having high moisture resistance and flexibility comprise an organic component and a filler. The organic component comprises a long-chain cycloaliphatic epoxy resin, a short-chain cycloaliphatic epoxy resin, a cyanate ester, and a lewis acid catalyst. Preferably the organic component further comprises a bronsted acid co-catalyst and/or a flexibilizing modifier. The compositions are useful in various semiconductor applications, including as die attach adhesives, underfills, encapsulants, via fills, prepreg binders, polymer solder masks and polymer bumps on flip chip or BGA assemblies.

Abstract: Compositions having high moisture resistance and flexibility comprise an organic component and a filler. The organic component comprises a long-chain cycloaliphatic epoxy resin, a short-chain cycloaliphatic epoxy resin, a cyanate ester, and a Lewis acid catalyst. Preferably the organic component further comprises a Bronsted acid co-catalyst and/or a flexibilizing modifier. The compositions are useful in various semiconductor applications, including as die attach adhesives, underfills, encapsulants, via fills, prepreg binders, polymer solder masks and polymer bumps on flip chip or BGA assemblies.

Abstract: Compositions having high moisture resistance and flexibility comprise an organic component and a filler. The organic component comprises a long-chain cycloaliphatic epoxy resin, a short-chain cycloaliphatic epoxy resin, a cyanate ester, and a lewis acid catalyst. Preferably the organic component further comprises a bronsted acid co-catalyst and/or a flexibilizing modifier. The compositions are useful in various semiconductor applications, including as die attach adhesives, underfills, encapsulants, via fills, prepreg binders, polymer solder masks and polymer bumps on flip chip or BGA assemblies.

Abstract: Compositions having high moisture resistance and flexibility comprise an organic component and a filler. The organic component comprises a long-chain cycloaliphatic epoxy resin, a short-chain cycloaliphatic epoxy resin, a cyanate ester, and a Lewis acid catalyst. Preferably the organic component further comprises a Bronsted acid co-catalyst and/or a flexibilizing modifier. The compositions are useful in various semiconductor applications, including as die attach adhesives, underfills, encapsulants, via fills, prepreg binders, polymer solder masks and polymer bumps on flip chip or BGA assemblies.

Abstract: An attachment (3) for a vacuum gun (2), for evacuating and containing a fluid from a reservoir of fluid, such as brake fluid from a brake system. The attachment (3) has a body (21, 25) with an inlet (22) for the fluid and an outlet (24) that may be sealingly attached to a front end of a gun (2). The attachment (3) also has a coupling (26), a container (27) which is releasably attachable to the coupling (26), a first passage (33, 34) extending between the inlet (22) and the container (27), a second passage (35, 36) extending between the container (27) and the outlet (24), and a tap (70) which may be moved to either close or open the said passages (33, 34, 35, 36). In use, the gun (2) generates a vacuum within the attachment (3) and when the tap (70) is in the open position, the fluid may be collected within the container (27). A float valve (83) within the second passage (35) ensures that the container (27) cannot overfill with fluid.

Abstract: An attachment (3) for a vacuum gun (2), for evacuating and containing a fluid from a reservoir of fluid, such as brake fluid from a brake system. The attachment (3) has a body (21, 25) with an inlet (22) for the fluid and an outlet (24) that may be sealingly attached to a front end of a gun (2). The attachment (3) also has a coupling (26), a container (27) which is releasably attachable to the coupling (26), a first passage (33, 34) extending between the inlet (22) and the container (27), a second passage (35, 36) extending between the container (27) and the outlet (24), and a tap (70) which may be moved to either close or open the said passages (33, 34, 35, 36). In use, the gun (2) generates a vacuum within the attachment (3) and when the tap (70) is in the open position, the fluid may be collected within the container (27). A float valve (83) within the second passage (35) ensures that the container (27) cannot overfill with fluid.

Abstract: A via fill formulation including electrically and/or thermally conductive particulate filler, or non-conductive, electrically conductive polymer and a resin vehicle.

Abstract: Compositions having high moisture resistance and flexibility comprise an organic component and a filler. The organic component comprises a long-chain cycloaliphatic epoxy resin, a short-chain cycloaliphatic epoxy resin, a cyanate ester, and a Lewis acid catalyst. Preferably the organic component further comprises a Bronsted acid co-catalyst and/or a flexibilizing modifier. The compositions are useful in various semiconductor applications, including as die attach adhesives, underfills, encapsulants, via fills, prepreg binders, polymer solder masks and polymer bumps on flip chip or BGA assemblies.

Abstract: Compositions having high moisture resistance and flexibility comprise an organic component and a filler. The organic component comprises a long-chain cycloaliphatic epoxy resin, a short-chain cycloaliphatic epoxy resin, a cyanate ester, and a Lewis acid catalyst. Preferably the organic component further comprises a Bronsted acid co-catalyst and/or a flexibilizing modifier. The compositions are useful in various semiconductor applications, including as die attach adhesives, underfills, encapsulants, via fills, prepreg binders, polymer solder masks and polymer bumps on flip chip or BGA assemblies.

Abstract: Described is an adhesive composition suitable for bonding a semiconductor device to a substrate comprising about 60-90 wt. % particulate silver; about 10-40 wt. % of an adhesive material comprising at least one nonelectrically conductive organic compound; and a filler comprising at least one electrically conductive organic compound capable of forming a conductivity bridge between silver particles. The adhesive composition may additionally include at least one curing catalyst for the adhesive material, a flexibilizer to render the composition more flexible, a surfactant to facilitate contact with a substrate and/or a material to aid in adjusting the rheology of the composition.