Patents by Inventor Alan H. Benjamin
Alan H. Benjamin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20140211427Abstract: Improved form-less electronic apparatus and methods for manufacturing the same. In one exemplary embodiment, the apparatus comprises a shape-core inductive device having a bonded-wire coil which is formed and maintained within the device without resort to a bobbin or other form(er). The absence of the bobbin simplifies the manufacture of the device, reduces its cost, and allows it to be made more compact (or alternatively additional functionality to be disposed therein). One variant utilizes a termination header for mating to a PCB or other assembly, while another totally avoids the use of the header by directly mating to the PCB. Multi-core variants and methods of manufacturing are also disclosed.Type: ApplicationFiled: February 3, 2014Publication date: July 31, 2014Inventors: Michael T. Gilmartin, Fredrick J. Kiko, Alan H. Benjamin
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Patent number: 8643456Abstract: Improved form-less electronic apparatus and methods for manufacturing the same. In one exemplary embodiment, the apparatus comprises a shape-core inductive device having a bonded-wire coil which is formed and maintained within the device without resort to a bobbin or other form(er). The absence of the bobbin simplifies the manufacture of the device, reduces its cost, and allows it to be made more compact (or alternatively additional functionality to be disposed therein). One variant utilizes a termination header for mating to a PCB or other assembly, while another totally avoids the use of the header by directly mating to the PCB. Multi-core variants and methods of manufacturing are also disclosed.Type: GrantFiled: February 4, 2013Date of Patent: February 4, 2014Assignee: Pulse Electronics, Inc.Inventors: Michael T. Gilmartin, Frederick J. Kiko, Alan H. Benjamin
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Patent number: 8368500Abstract: Improved form-less electronic apparatus and methods for manufacturing the same. In one exemplary embodiment, the apparatus comprises a shape-core inductive device having a bonded-wire coil which is formed and maintained within the device without resort to a bobbin or other form(er). The absence of the bobbin simplifies the manufacture of the device, reduces its cost, and allows it to be made more compact (or alternatively additional functionality to be disposed therein). One variant utilizes a termination header for mating to a PCB or other assembly, while another totally avoids the use of the header by directly mating to the PCB. Multi-core variants and methods of manufacturing are also disclosed.Type: GrantFiled: January 16, 2012Date of Patent: February 5, 2013Assignee: Pulse Electronics, Inc.Inventors: Michael T. Gilmartin, Frederick J. Kiko, Alan H. Benjamin
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Publication number: 20120182111Abstract: Improved form-less electronic apparatus and methods for manufacturing the same. In one exemplary embodiment, the apparatus comprises a shape-core inductive device having a bonded-wire coil which is formed and maintained within the device without resort to a bobbin or other form(er). The absence of the bobbin simplifies the manufacture of the device, reduces its cost, and allows it to be made more compact (or alternatively additional functionality to be disposed therein). One variant utilizes a termination header for mating to a PCB or other assembly, while another totally avoids the use of the header by directly mating to the PCB. Multi-core variants and methods of manufacturing are also disclosed.Type: ApplicationFiled: January 16, 2012Publication date: July 19, 2012Inventors: Michael T. Gilmartin, Frederick J. Kiko, Alan H. Benjamin
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Patent number: 8098125Abstract: Improved form-less electronic apparatus and methods for manufacturing the same. In one exemplary embodiment, the apparatus comprises a shape-core inductive device having a bonded-wire coil which is formed and maintained within the device without resort to a bobbin or other form(er). The absence of the bobbin simplifies the manufacture of the device, reduces its cost, and allows it to be made more compact (or alternatively additional functionality to be disposed therein). One variant utilizes a termination header for mating to a PCB or other assembly, while another totally avoids the use of the header by directly mating to the PCB. Multi-core variants and methods of manufacturing are also disclosed.Type: GrantFiled: January 24, 2011Date of Patent: January 17, 2012Assignee: Pulse Electronics, Inc.Inventors: Michael T. Gilmartin, Frederick J. Kiko, Alan H. Benjamin
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Publication number: 20110221557Abstract: Improved form-less electronic apparatus and methods for manufacturing the same. In one exemplary embodiment, the apparatus comprises a shape-core inductive device having a bonded-wire coil which is formed and maintained within the device without resort to a bobbin or other form(er). The absence of the bobbin simplifies the manufacture of the device, reduces its cost, and allows it to be made more compact (or alternatively additional functionality to be disposed therein). One variant utilizes a termination header for mating to a PCB or other assembly, while another totally avoids the use of the header by directly mating to the PCB. Multi-core variants and methods of manufacturing are also disclosed.Type: ApplicationFiled: January 24, 2011Publication date: September 15, 2011Inventors: Michael T. Gilmartin, Frederick J. Kiko, Alan H. Benjamin
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Patent number: 7876189Abstract: Improved form-less electronic apparatus and methods for manufacturing the same. In one exemplary embodiment, the apparatus comprises a shape-core inductive device having a bonded-wire coil which is formed and maintained within the device without resort to a bobbin or other form(er). The absence of the bobbin simplifies the manufacture of the device, reduces its cost, and allows it to be made more compact (or alternatively additional functionality to be disposed therein). One variant utilizes a termination header for mating to a PCB or other assembly, while another totally avoids the use of the header by directly mating to the PCB. Multi-core variants and methods of manufacturing are also disclosed.Type: GrantFiled: October 1, 2009Date of Patent: January 25, 2011Assignee: Pulse Engineering, Inc.Inventors: Michael T. Gilmartin, Frederick J. Kiko, Alan H. Benjamin
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Patent number: 7724204Abstract: Improved electrical connector apparatus including a wireless antenna acting as a transceiver in conjunction with a wireless integrated circuit is disclosed. In one embodiment, the modular connector comprises an RJ45 modular jack, and the wireless transceiver comprises a Bluetooth transceiver transmitting via an integrated antenna disposed on the front face of the Faraday shield at least partly surrounding the modular connector. In another embodiment, an 802.11 transceiver is used. In yet another embodiment, an ultra-wideband (UWB) interface is used.Type: GrantFiled: October 1, 2007Date of Patent: May 25, 2010Assignee: Pulse Engineering, Inc.Inventors: Petteri Annamaa, Alan H. Benjamin
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Publication number: 20100026438Abstract: Improved form-less electronic apparatus and methods for manufacturing the same. In one exemplary embodiment, the apparatus comprises a shape-core inductive device having a bonded-wire coil which is formed and maintained within the device without resort to a bobbin or other form(er). The absence of the bobbin simplifies the manufacture of the device, reduces its cost, and allows it to be made more compact (or alternatively additional functionality to be disposed therein). One variant utilizes a termination header for mating to a PCB or other assembly, while another totally avoids the use of the header by directly mating to the PCB. Multi-core variants and methods of manufacturing are also disclosed.Type: ApplicationFiled: October 1, 2009Publication date: February 4, 2010Inventors: Michael T. Gilmartin, Frederick J. Kiko, Alan H. Benjamin
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Patent number: 7598837Abstract: Improved form-less electronic apparatus and methods for manufacturing the same. In one exemplary embodiment, the apparatus comprises a shape-core inductive device having a bonded-wire coil which is formed and maintained within the device without resort to a bobbin or other form(er). The absence of the bobbin simplifies the manufacture of the device, reduces its cost, and allows it to be made more compact (or alternatively additional functionality to be disposed therein). One variant utilizes a termination header for mating to a PCB or other assembly, while another totally avoids the use of the header by directly mating to the PCB. Multi-core variants and methods of manufacturing are also disclosed.Type: GrantFiled: July 6, 2004Date of Patent: October 6, 2009Assignee: Pulse Engineering, Inc.Inventors: Michael T. Gilmartin, Frederick J. Kiko, Alan H. Benjamin
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Publication number: 20080136716Abstract: Improved electrical connector apparatus including a wireless antenna acting as a transceiver in conjunction with a wireless integrated circuit is disclosed. In one embodiment, the modular connector comprises an RJ45 modular jack, and the wireless transceiver comprises a Bluetooth transceiver transmitting via an integrated antenna disposed on the front face of the Faraday shield at least partly surrounding the modular connector. In another embodiment, an 802.11 transceiver is used. In yet another embodiment, an ultra-wideband (UWB) interface is used.Type: ApplicationFiled: October 1, 2007Publication date: June 12, 2008Inventors: Petteri Annamaa, Alan H. Benjamin