Patents by Inventor Alan H. Brothers

Alan H. Brothers has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Energetic materials using amorphous metals and metal alloys
    Patent number: 9573858
    Abstract: A method for improving the characteristics of energetic materials uses amorphous metals as one or more reactant of said materials. Improvements in properties and energy release characteristics for a wide range of energetic materials are obtained thereby, particularly in terms of processability, mechanical properties, and ignition behavior for solid energetic materials.
    Type: Grant
    Filed: March 25, 2010
    Date of Patent: February 21, 2017
    Inventor: Alan H. Brothers
  • Method to stress relieve a magnetic recording head transducer utilizing ultrasonic cavitation
    Patent number: 9242340
    Abstract: Magnetic heads are fabricated by slicing and dicing wafers into row bars, which undergo frontside lapping and backside lapping. These lapping processes, as well as other processes, induce stresses on the row bars that are released prior to finalizing the magnetic head. Ultrasonic impact technology is used to release the stress in the row bars and to clean the row bars at the same time. Ultrasonic impact technology is used after the row bars have been wire bonded without having to de-bond the row bars.
    Type: Grant
    Filed: March 12, 2013
    Date of Patent: January 26, 2016
    Assignee: Western Digital Technologies, Inc.
    Inventors: Mark D. Moravec, Phanphat Taechangam, Alan H. Brothers
  • Laser-ignited reactive HAMR bonding
    Patent number: 9042048
    Abstract: The present disclosure generally relates to a HAMR head and a method for fabrication thereof. The HAMR head has a write head with a waveguide extending therethrough. A laser diode is coupled to a submount that is bonded to the write head using an adhesion layer, a solder structure, and a self-propagating multilayer alloying stack.
    Type: Grant
    Filed: September 30, 2014
    Date of Patent: May 26, 2015
    Assignee: Western Digital (Fremont), LLC
    Inventor: Alan H. Brothers