Abstract: A soldering apparatus is adapted for making solder connections to through-hole technology components on substantially surface mount technology printed circuit boards. Lifter assemblies raise and lower solder pump assemblies. Solder pump assemblies in turn each support a nozzle support assembly. Each nozzle support assembly in turn supports either a nozzle assembly or a wave nozzle assembly. In operation, a nozzle assembly having a solder discharge configuration indicated by, and compatible with, the pin configuration of the component to be soldered is raised by the appropriate lifter assembly. Where no nozzle assembly is appropriate for the configuration of the component to be soldered, a wave nozzle assembly is raised, and the PCB moved into position adjacent to the wave nozzle assembly.

Abstract: A multi-rate, multi-head positioner (150) receives and processes unpanelized positioning commands to actuate slow stages (56, 58) and multiple fast stages (154) that are mounted on one of the slow stages to simultaneously position multiple tools (156) relative to target locations (162) on multiple associated workpieces (152). Each of the fast stages is coupled to a fast stage signal processor (172) that provides corrected position data to each fast stage positioner to compensate for fast stage nonlinearities and workpiece placement, offset, rotation, and dimensional variations among the multiple workpieces. When cutting blind via holes in etched circuit boards (ECBs), improved throughput and process yield are achieved by making half of the tools ultraviolet ("UV") lasers, which readily cut conductor and dielectric layers, and making the other half of the tools are infrared ("IR") lasers, which readily cut only dielectric layers.

Abstract: A machine for soldering printed circuit boards and the like includes a housing enclosing an outer process chamber having a soldering station and fluxing station enclosed therein and an inner heating chamber, in combination with input and output transport conveyors on which the circuit boards enter and exit the housing. The heating chamber includes an elevator rack assembly which transports a succession of circuit boards vertically between the input and output conveyors while subjecting the circuit boards to controlled heating. The heating chamber may also be supplied with an inert or reducing gas to facilitate or eliminate fluxing requirements. The environment within the housing is maintained by air lock doors.