Abstract: A multilayer protection bag for protecting an electronic module, circuit card, or the like comprising walls having an external first layer of an antistatic shield film, a second layer of static-free bubble pack, and a third layer of a static-free film forming an interior liner of the protection bag to inhibit corrosion and outgassing. A mechanical cushioning bumper is provided around the perimeter of the sides and bottom of the protection bag for shock protection. A moisture proof pinch type zip lock is provided on the top of the protection bag. A carrier is provided within the protection bag for holding a desiccant and a humidity indicator. The combination of such wall layers and the cushioning bumper provide an improved in-process protection bag during a manufacturing process and also a shipping and storage protection bag having at least a 10 year shelf-life for a module or circuit card placed within it.