Abstract: An approach is provided for selectively loading a cleaning web useful in printing based on various media attributes of a media that is to be processed by a fuser unit. The approach involves determining one or more media attributes associated with a media to be processed by a fuser unit, the fuser unit comprising one or more heat rolls. The approach also involves determining at least one of the one or more media attributes meets a predetermined criteria. The approach further involves causing, at least in part, a cleaning web to contact at least one of the one or more heat rolls based, at least in part, on the determination that one or more media attributes meets the predetermined criteria.

Abstract: An approach is provided for reducing release agent transfer to a pressure member in a fuser. The approach involves causing, at least in part, at least a first sheeted substrate and a second sheeted substrate to be advanced through a fuser in a process direction. The approach also involves determining the presence of the first sheeted substrate at a fusing position. The approach further involves causing, at least in part, a fuser member and a pressure member to engage to form a fusing nip at the fusing position based, at least in part, on the determined presence of the first sheeted substrate at the fusing position. The approach additionally involves determining the first sheeted substrate has advanced through the fusing nip. The approach further involves causing, at least in part, the fuser member and the pressure member to disengage.

Abstract: An approach is provided for reusing a cleaning web to clean portions of a fuser unit. The approach involves causing a cleaning web supply mechanism to feed a cleaning web having a first surface and a second surface to the portions of the fuser unit. The approach also involves causing a cleaning web receiving mechanism to receive the cleaning web following a cleaning process in which the first surface of the cleaning web is used to clean at least one of the portions of the fuser unit. The approach further involves causing the cleaning web receiving mechanism to return the cleaning web to the portions of the fuser unit to clean at least one of the portions of the fuser unit using the second surface of the cleaning web.

Abstract: An approach is provided for applying a release agent to a substrate having at least a first surface and a second surface. The approach involves determining a print job type for applying one or more printed images to the substrate to be one of a simplex print job type that applies the one or more printed images to one of the first surface and the second surface and a duplex print job type that applies the one or more printed images to the first surface and the second surface. The approach also involves processing the determined print job type to cause, at least in part, a determination of a release agent application instruction that corresponds with the determined print job type. The approach further involves causing, at least in part, an amount of the release agent to be applied to the substrate based on the release agent application instruction.

Abstract: A paint roller apparatus is provided. In one example, the paint roller apparatus is configured to apply paint to a surface and includes a roller arm and a paint roller rotatably mounted on the roller arm about a roller axis. The paint roller has an end and a paint applicator surface. The paint roller apparatus includes a roller guard having at least one painting feature for applying paint to the surface. The roller guard is selectively movable between first and second positions. The first position comprises the painting feature disposed adjacent the end of the roller on a first side of the roller axis and the second position comprises the painting feature disposed adjacent the end of the roller on a second side of the roller axis.

Abstract: A method for selectively etching a nitride layer with respect to a silicon oxide based layer over a substrate is provided. The substrate is placed in a plasma processing chamber. The nitride layer is etched, comprising the steps of flowing a nitride etch gas comprising a hydrocarbon species, an oxygen containing species and a fluorocarbon or hydrofluorocarbon species into the plasma chamber, forming a plasma from the nitride etch gas, and using the plasma from the nitride etch gas to selectively etch the nitride layer with respect to the silicon oxide based layer.

Abstract: Various examples of system and methods for particulate filters include a particulate filter comprising a housing having a flow axis between an input header and an output header, and a plurality of filter segments arranged in a stacked array, the stacked array disposed within the housing and lying in a plane normal to the flow axis, the stacked array including a first filter segment having a first average flow characteristic per unit area and a second filter segment having a second average flow characteristic per unit area, the first average flow characteristic per unit area different from the second average flow characteristic per unit area, each particular filter segment of the plurality of filter segments having a segment flow axis substantially in parallel alignment with the flow axis.

Abstract: A method for forming semiconductor devices is provided. A wafer with a patterned photoresist mask over the wafer, wherein the patterned photoresist mask has patterned photoresist mask features with scum at bottoms of the photoresist mask features is provided. The scum is removed from the bottoms of the photoresist mask features, comprising: providing a descumming gas consisting essentially of helium and forming the helium into a plasma, which removes the scum.

Abstract: Atomic oxygen generated in oxygen stripping plasmas reacts with and damages low-k dielectric materials during stripping of dielectric post etch residues. While damage of low-k dielectric materials during stripping of dielectric post etch residues is lower with hydrogen stripping plasmas, hydrogen stripping plasmas exhibit lower strip rates. Inclusion of oxygen in a hydrogen stripping plasma improves both photoresist strip rate and uniformity, while maintaining a hydrogen to oxygen ratio avoids low-k dielectric material damage.

Abstract: An integral engine component is disclosed. The integral engine component may have a solid first member and a second member cast in place relative to the solid first member. A metallurgical bond may exist between the solid first member and the second member, and the melting temperature of the solid first member may be lower than the melting temperature of the second member.

Abstract: Atomic oxygen generated in oxygen stripping plasmas reacts with and damages low-k dielectric materials during stripping of dielectric post etch residues. While damage of low-k dielectric materials during stripping of dielectric post etch residues is lower with hydrogen stripping plasmas, hydrogen stripping plasmas exhibit lower strip rates. Inclusion of oxygen in a hydrogen stripping plasma improves both photoresist strip rate and uniformity, while maintaining a hydrogen to oxygen ratio avoids low-k dielectric material damage.

Abstract: A platen is provided for use in a chemical mechanical planarization (CMP) system. The platen includes at least one fluid output zone having a plurality of fluid outlets, the at least one fluid output zone being disposed below a polishing pad and being capable of providing fluid pressure to the polishing pad. The platen also includes at least one fluid input zone having a plurality of fluid inlets, the at least one fluid input zone being disposed below the polishing pad and being capable of removing the fluid pressure. The platen is capable of managing fluid pressure applied to the polishing pad to achieve a particular polishing profile during a CMP operation.

Abstract: A tool used to penetrate ductile sheet metal as the initial penetration in preparation for the attachment or installation of ducting and piping and particularly to forming the initial penetration in sheet metal sheet or ducting from which an opening is made for the attachment of lateral, feed, supply or return duct pipe in heating and air conditioning systems and other process or manufacturing systems employing sheet metal in the system construction. The tool has a shaft with a handle, a top edge and a blade edge with a penetrating point extending from the blade edge. An anvil is affixed to the top edge. A sheet metal workpiece is struck by the tool with the penetrating point causing a penetration in the sheet metal surface in preparation of attachment of ducting or other heating, ventilation and air-conditioning or process systems.