Patents by Inventor Alan Kasner

Alan Kasner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10547127
    Abstract: An electrical terminal device adapted to mount to a structure, and including a electrically non-conductive substructure, an electrically non-conductive cover, a heat resistant shroud, and an electric terminal. The substructure is in contact with the structure. The cover is engaged to the substructure. The substructure and the cover define a chamber, and the substructure defines, at least in-part, a sealed passage in communication with the chamber. The heat resistant shroud substantially covers the cover. The cover is substantially located between the shroud and the substructure. The electric terminal is located in the chamber and is attached to the substructure.
    Type: Grant
    Filed: August 29, 2017
    Date of Patent: January 28, 2020
    Assignee: HAMILTON SUNDSTRAND CORPORATION
    Inventors: David S. Behling, Glenn C. Lemmers, Jr., Dhaval Patel, Alan Kasner, Douglas J. Turner
  • Publication number: 20190067840
    Abstract: An electrical terminal device adapted to mount to a structure, and including a electrically non-conductive substructure, an electrically non-conductive cover, a heat resistant shroud, and an electric terminal. The substructure is in contact with the structure. The cover is engaged to the substructure. The substructure and the cover define a chamber, and the substructure defines, at least in-part, a sealed passage in communication with the chamber. The heat resistant shroud substantially covers the cover. The cover is substantially located between the shroud and the substructure. The electric terminal is located in the chamber and is attached to the substructure.
    Type: Application
    Filed: August 29, 2017
    Publication date: February 28, 2019
    Inventors: David S. Behling, Glenn C. Lemmers, JR., Dhaval Patel, Alan Kasner, Douglas J. Turner
  • Publication number: 20180199461
    Abstract: Potted electronic assemblies are disclosed along with methods of making and cooling them. The electronic assemblies include a conductive heat transfer medium disposed between and in contact with an electronic component and a heat sink. The conductive heat transfer medium has a hardened fluid polymer material that includes boron nitride nanotubes dispersed therein.
    Type: Application
    Filed: January 9, 2017
    Publication date: July 12, 2018
    Inventors: John Huss, Alan Kasner, Mark W. Metzler, Ernest Thompson, Debabrata Pal, Charles Patrick Shepard
  • Publication number: 20170133120
    Abstract: A nanocomposite structure includes a nanocomposite. The nanocomposite includes a bulk matrix phase and a nanophase filler disposed within the bulk matrix phase. The nanophase has a plurality of nanotubes including a material with thermal conductivity that is greater than the thermal conductivity of the bulk matrix phase of the nanocomposite. An electrical device includes a conductor in thermal communication with the nanocomposite structure formed from the nanocomposite.
    Type: Application
    Filed: November 9, 2015
    Publication date: May 11, 2017
    Applicant: Hamilton Sundstrand Corporation
    Inventors: William D. Sherman, John Huss, Alan Kasner
  • Patent number: 9394685
    Abstract: An acoustic absorption material may comprise an outer layer and a first layer of batting material proximate to the outer layer. A first layer of room temperature vulcanized silicone (RTV) may be proximate to the batting material. A second layer of batting material may be proximate to the first layer of RTV opposite the first layer of batting material.
    Type: Grant
    Filed: August 18, 2014
    Date of Patent: July 19, 2016
    Assignee: HAMILTON SUNDSTRAND CORPORATION
    Inventors: David J. Dollhopf, Alan Kasner, Suzanne L. B. Woll
  • Publication number: 20160047119
    Abstract: An acoustic absorption material may comprise an outer layer and a first layer of batting material proximate to the outer layer. A first layer of room temperature vulcanized silicone (RTV) may be proximate to the batting material. A second layer of batting material may be proximate to the first layer of RTV opposite the first layer of batting material.
    Type: Application
    Filed: August 18, 2014
    Publication date: February 18, 2016
    Inventors: David J. Dollhopf, Alan Kasner, Suzanne L.B. Woll
  • Publication number: 20050113536
    Abstract: Epoxy polymer precursors and epoxy polymers resulting therefrom are tolerant to bombardment by high-energy radiation. The epoxy polymer precursors comprise at least an epoxy resin free of aromatic units and at least a curing agent selected from the group consisting of aliphatic polyamines, cycloaliphatic polyamines, polyamides, aliphatic anhydrides, cycloaliphatic anhydrides, and mixtures thereof. In one embodiment of the invention the epoxy resin comprises at least a cycloparaffinic group, and the curing agent comprises a polyamine derived from cyclohexane. Such epoxy polymer compositions are used to form reflectors elements between adjacent scintillator elements in high-energy radiation detector array.
    Type: Application
    Filed: October 25, 2004
    Publication date: May 26, 2005
    Inventors: Sean Armstrong, Wendy Lin, Alan Kasner
  • Publication number: 20050107580
    Abstract: Epoxy polymer precursors and epoxy polymers resulting therefrom are tolerant to bombardment by high-energy radiation. The epoxy polymer precursors comprise at least an epoxy resin free of aromatic units and at least a curing agent selected from the group consisting of aliphatic polyamines, cycloaliphatic polyamines, polyamides, aliphatic anhydrides, cycloaliphatic anhydrides, and mixtures thereof. In one embodiment of the invention the epoxy resin comprises at least a cycloparaffinic group, and the curing agent comprises a polyamine derived from cyclohexane. Such epoxy polymer compositions are used to form reflectors elements between adjacent scintillator elements in high-energy radiation detector array.
    Type: Application
    Filed: October 25, 2004
    Publication date: May 19, 2005
    Inventors: Sean Armstrong, Wendy Lin, Alan Kasner