Patents by Inventor Alan Kordas

Alan Kordas has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Large LGA socket and method of manufacture
    Publication number: 20080242125
    Abstract: An LGA interconnect device, method of making, and device for making.
    Type: Application
    Filed: April 2, 2007
    Publication date: October 2, 2008
    Applicant: Tyco Electronics Corporation
    Inventors: Jeffrey G. Pennypacker, Jeffrey B. McClinton, Richard N. Whyne, Alan A. Kordas
  • Socket having substrate locking feature
    Patent number: 7090507
    Abstract: A socket is shown having an insulative housing surrounding a metal substrate. The substrate has an array of apertures which are located in spatially arranged order to accommodate the precise pattern desired for the device to be connected. Contact assemblies include stamped and formed contacts having an insulative plastic molded over a central section of the contact. The molded inserts are receivable in the apertures of the substrate and are later swaged to retain them and the contacts to the substrate. The substrates are located relative to a mating device by way of pins attached to the substrate. The pins are locked to the substrate by way of a locking device, whereby the pins are rotated and locked in place.
    Type: Grant
    Filed: February 27, 2004
    Date of Patent: August 15, 2006
    Assignee: Tyco Electronics Corporation
    Inventors: Darrell L Wertz, Robert T Frederick, Richard N Whyne, Andrew D Balthaser, Alan A Kordas, Peter C O'Donnell
  • Socket having substrate locking feature
    Publication number: 20050191123
    Abstract: A socket is provided which has an insulative housing surrounding a metal substrate. The substrate has an array of apertures which are located in spatially arranged order to accommodate the precise pattern desired for the device to be connected. Contact assemblies include stamped and formed contacts having an insulative plastic molded over a central section of the contact. The molded inserts are receivable in the apertures of the substrate and are later swaged to retain them and the contacts to the substrate. The substrates are located relative to a mating device by way of pins attached to the substrate. The pins are locked to the substrate by way of a locking device, whereby the pins are rotated and locked in place.
    Type: Application
    Filed: February 27, 2004
    Publication date: September 1, 2005
    Inventors: Darrell Wertz, Robert Frederick, Richard Whyne, Andrew Balthaser, Alan Kordas, Peter O'Donnell